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MSP430F2132TRTVT

Texas Instruments

MSP430F2132TRTVT by Texas Instruments

MSP430F2132TRTVT by Texas Instruments is a 16-bit microcontroller with 32 terminals, operating at 1.8/3.6V and up to 16MHz clock frequency. Ideal for industrial applications, it features 512 bytes of RAM, 8192 ROM words, and PWM channels for precise control in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,046 parts In-Stock

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Digiode

USA . 3,115 parts In-Stock

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One Stop Electronics

USA . 592 parts In-Stock

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$4.000

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AZTECH Wire

Italy . 876 parts In-Stock

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$5.888

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Parana Technologies

USA . 1,972 parts In-Stock

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$52.744

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DigiPath Technology Company

USA . 1,456 parts In-Stock

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$58.078

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IDEA Electronic Components Group

UK . 2,160 parts In-Stock

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$59.263

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$56.300

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$53.337

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ChromeModa Solutions

Germany . 1,571 parts In-Stock

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$59.263

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$48.596

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QUARKTWIN TECHNOLOGY LTD

USA . 11,438 parts In-Stock

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Corphita

USA . 4,140 parts In-Stock

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Microchip USA

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F2132TRTVT microcontroller. Designed for a wide range of applications, this versatile chip offers high-quality performance and reliability. With its advanced technology and state-of-the-art features, this microcontroller provides customers with unmatched value and benefits. Whether you're working on IoT devices, consumer electronics, or industrial automation, the MSP430F2132TRTVT is the perfect choice to bring your ideas to life. Trust Texas Instruments to deliver cutting-edge solutions that exceed your expectations.

Feature Benefit Bullets

Surface Mount: YES

Surface mount package allows for easy installation on PCBs, saving space and reducing assembly time.

Bit Size: 16

With a bit size of 16, this microcontroller is capable of processing complex instructions and handling data efficiently.

Power Supplies (V): 1.8/3.6

Wide range of power supply options enables flexibility in designing and powering the system.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles provide options for different application requirements, such as heat dissipation and space constraints.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliability in harsh industrial environments.

CPU Family: MSP430

Belonging to the MSP430 family ensures compatibility with other microcontrollers and software tools from the same family.

ADC Channels: YES

Built-in ADC channels enable analog signal processing, making it suitable for applications requiring sensor interfacing.

Maximum Clock Frequency: 16 MHz

High clock frequency allows for fast processing of instructions, leading to improved system performance.

ROM Programmability: FLASH

Flash programmability enables easy firmware updates and customization of the microcontroller's functions.

RAM Bytes: 512

With 512 bytes of RAM, the microcontroller can store and process data efficiently, enhancing overall system performance.

Technical Specifications

Microcontrollers MSP430F2132TRTVT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 1.8V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

24

No. of Terminals:

32

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.6

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

.8 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Trade Compliance

MSP430F2132TRTVT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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