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MSP430F2132QRHBTEP

Texas Instruments

MSP430F2132QRHBTEP by Texas Instruments

MSP430F2132QRHBTEP by Texas Instruments is a 16-bit microcontroller with 8KB ROM, 512B RAM, and 8-Ch 10-Bit ADC. Ideal for automotive applications due to its low power mode, operating temperature range of -40 to 125 °C, and connectivity via USCI interface. With a max clock frequency of 16 MHz, it offers peripherals like comparator and timer(2) for efficient performance.

Median Price

$9.570

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 56,670 parts In-Stock

1+ parts

$8.835

100+ parts

$7.717

1k+ parts

$5.322

10k+ parts

-

56,670

$8.835

$7.717

$5.322

-

Mouser Electronics

USA . 275 parts In-Stock

1+ parts

$9.570

100+ parts

$6.350

1k+ parts

$6.270

10k+ parts

-

275

$9.570

$6.350

$6.270

-

DigiKey

USA . 388 parts In-Stock

1+ parts

$9.670

100+ parts

$6.416

1k+ parts

-

10k+ parts

-

388

$9.670

$6.416

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,780 parts In-Stock

1+ parts

$8.393

100+ parts

-

1k+ parts

-

10k+ parts

-

4,780

$8.393

-

-

-

Vyrian

USA . 8,981 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,981

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,265 parts In-Stock

1+ parts

$7.952

100+ parts

-

1k+ parts

-

10k+ parts

-

4,265

$7.952

-

-

-

Parana Technologies

USA . 1,879 parts In-Stock

1+ parts

$68.882

100+ parts

$6,396.697

1k+ parts

$61.993

10k+ parts

-

1,879

$68.882

$6,396.697

$61.993

-

DigiPath Technology Company

USA . 2,099 parts In-Stock

1+ parts

$75.847

100+ parts

$69.779

1k+ parts

-

10k+ parts

-

2,099

$75.847

$69.779

-

-

ChromeModa Solutions

Germany . 1,189 parts In-Stock

1+ parts

$77.395

100+ parts

$63.464

1k+ parts

-

10k+ parts

-

1,189

$77.395

$63.464

-

-

IDEA Electronic Components Group

UK . 597 parts In-Stock

1+ parts

$77.395

100+ parts

$73.525

1k+ parts

$69.656

10k+ parts

-

597

$77.395

$73.525

$69.656

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

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Microchip USA

USA . 1,494 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,494

-

-

-

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Futuretech Components

Singapore . 832 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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832

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-

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Overview

Unlock the potential of your projects with the MSP430F2132QRHBTEP by Texas Instruments. As a leader in microcontrollers, Texas Instruments delivers unparalleled quality and reliability. Perfect for a wide range of applications, this microcontroller offers customers value with its advanced features and benefits. Experience seamless connectivity, low power consumption, and high performance with the MSP430F2132QRHBTEP. Take your projects to the next level with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material helps in reducing the weight of the microcontroller, making it suitable for portable devices.

Maximum Supply Voltage: 3.6 V

Higher supply voltage allows for flexibility in power supply options and compatibility with a wider range of applications.

Bit Size: 16

A 16-bit architecture provides higher processing power and efficiency compared to lower bit sizes.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures reliable performance even in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

ADC Channels: YES

Analog to Digital Convertors enable the microcontroller to interface with analog sensors and devices, expanding its capabilities.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances the microcontroller's processing speed and efficiency, making it suitable for real-time applications.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and convenient updates to the microcontroller's firmware without the need for specialized equipment.

No. of I/O Lines: 24

Having 24 I/O lines provides ample connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers MSP430F2132QRHBTEP attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

24

No. of Serial I/Os:

1

No. of Terminals:

32

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

512

RAM Words:

0.5

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

.455 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Connectivity:

USCI

Peripherals:

COMPARATOR, BOD, POR, TIMER(2)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430F2132QRHBTEP Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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