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MSP430F2131IDW

Texas Instruments

MSP430F2131IDW by Texas Instruments

MSP430F2131IDW by Texas Instruments is a 16-bit microcontroller with 8192 ROM words and 256 RAM bytes. It operates at a max clock frequency of 16 MHz, making it suitable for industrial applications requiring low power consumption and high-speed processing. With features like 16 timers, PWM channels, and ADC capabilities, this microcontroller is ideal for embedded systems design.

Median Price

$2.580

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,645 parts In-Stock

1+ parts

$3.054

100+ parts

$2.676

1k+ parts

$1.512

10k+ parts

-

1,645

$3.054

$2.676

$1.512

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Rochester

USA . 143 parts In-Stock

1+ parts

-

100+ parts

$1.960

1k+ parts

$1.750

10k+ parts

$1.650

143

-

$1.960

$1.750

$1.650

DigiKey

USA . 143 parts In-Stock

1+ parts

-

100+ parts

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$2.580

10k+ parts

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143

-

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$2.580

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Digiode

USA . 4,931 parts In-Stock

1+ parts

$1.995

100+ parts

-

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4,931

$1.995

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$2.305

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10

$2.305

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Vyrian

USA . 8,965 parts In-Stock

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8,965

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DigiKey Marketplace

USA . 143 parts In-Stock

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$2.180

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143

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$2.180

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Ampacity Inc.

Singapore . 381 parts In-Stock

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$1.780

100+ parts

-

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381

$1.780

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Semicontronic

India . 241 parts In-Stock

1+ parts

$1.780

100+ parts

$1.736

1k+ parts

$1.727

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241

$1.780

$1.736

$1.727

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Corphita

USA . 3,347 parts In-Stock

1+ parts

$1.890

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$1.890

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Continental Prestige Electronics

USA . 6,784 parts In-Stock

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$2.305

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$2.259

6,784

$2.305

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$2.259

Argo Parts USA

USA . 4,789 parts In-Stock

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$2.305

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4,789

$2.305

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Netroflash

USA . 50 parts In-Stock

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$2.305

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50

$2.305

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Corohmni

South Africa . 235 parts In-Stock

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$49.582

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$49.582

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Parana Technologies

USA . 888 parts In-Stock

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$67.367

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ChromeModa Solutions

Germany . 6,424 parts In-Stock

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$75.693

100+ parts

$62.068

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6,424

$75.693

$62.068

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IDEA Electronic Components Group

UK . 471 parts In-Stock

1+ parts

$75.693

100+ parts

$71.908

1k+ parts

$68.124

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471

$75.693

$71.908

$68.124

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DigiPath Technology Company

USA . 1,511 parts In-Stock

1+ parts

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$68.245

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1,511

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$68.245

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Discover the power and precision of the Texas Instruments MSP430F2131IDW microcontroller. With a reputation for top-quality manufacturing, this device offers a wide range of applications in various industries. From industrial automation to consumer electronics, the MSP430F2131IDW provides unmatched value with its low power consumption, high performance, and innovative features. Trust Texas Instruments for cutting-edge technology that delivers exceptional results for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly of electronic circuits.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can handle higher power applications.

On Chip Data RAM Width: 8

Having an on-chip data RAM width of 8 bits allows for faster and more efficient data processing.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized form factor for easy integration into circuit designs.

Bit Size: 16

With a bit size of 16, this microcontroller can handle larger data processing tasks with ease.

Power Supplies (V): 2/3.3

The availability of multiple power supply options (2V and 3.3V) provides flexibility in different power configurations.

No. of Terminals: 20

Having 20 terminals allows for a sufficient number of connections for various input and output functions.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and is suitable for compact electronic devices.

Minimum Supply Voltage: 3.3 V

The minimum supply voltage of 3.3V ensures stable operation and compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C makes this microcontroller suitable for industrial applications with high heat levels.

CPU Family: MSP430

Being part of the MSP430 CPU family ensures compatibility with existing designs and software libraries.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for reliable operation in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold provides excellent conductivity and corrosion resistance for long-lasting performance.

ADC Channels: YES

The presence of ADC channels allows for analog-to-digital conversion, enabling the microcontroller to interface with a wide range of sensors and devices.

Terminal Position: DUAL

The dual terminal position enhances stability and reliability of connections in the circuit.

ROM Words: 8192

The large ROM size of 8192 words provides ample storage for program code and data.

Maximum Seated Height: 2.65 mm

The low maximum seated height saves space and allows for compact designs in electronic applications.

RAM Words: 0.25

Even with a small RAM size of 0.25 words, this microcontroller can still handle basic data processing tasks effectively.

Width: 7.5 mm

The narrow width of 7.5 mm enables easy integration into tight spaces or smaller electronic devices.

Boundary Scan: YES

Having boundary scan capability allows for efficient testing and debugging of the microcontroller during production.

Peripherals: 'BOD, COMPARATOR(8), TIMER(16), WDT'

The various peripherals like BOD, comparators, timers, and WDT enhance the functionality and versatility of the microcontroller for different applications.

Maximum Clock Frequency: 16 MHz

With a maximum clock frequency of 16 MHz, this microcontroller can execute instructions quickly and efficiently.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperatures for up to 30 seconds ensures robustness during the manufacturing process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C guarantees proper soldering and reliability in the assembly process.

Length: 12.8 mm

The compact length of 12.8 mm contributes to space-saving designs and compatibility with smaller electronic devices.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this microcontroller can withstand harsh operating conditions in industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller ensures efficient and speedy execution of instructions for enhanced performance.

No. of Timers: 16

Having 16 timers provides ample timing control for various functions and tasks in the system.

RAM Bytes: 256

The generous RAM size of 256 bytes enables efficient temporary storage of data and variables during program execution.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of electronic devices.

Terminal Form: GULL WING

The gull wing terminal form ensures secure connections and ease of soldering during assembly.

Maximum Supply Current: 0.35 mA

The low maximum supply current of 0.35 mA contributes to energy efficiency and longer battery life in portable devices.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is a common standard in electronic systems, ensuring compatibility with various power sources.

PWM Channels: YES

The presence of PWM channels allows for precise control of analog signals, making this microcontroller suitable for motor control and other applications.

ROM Programmability: FLASH

The ROM programmability using flash memory enables easy and quick updates of program code without requiring external programming equipment.

Terminal Pitch: 1.27 mm

The standard terminal pitch of 1.27 mm enables easy integration into various circuit boards and connectors.

Format: FIXED POINT

Operating in fixed-point format ensures efficient arithmetic operations and compatibility with a wide range of software algorithms.

Speed: 16 rpm

With a speed of 16 rpm, this microcontroller can process instructions and data at a fast rate, suitable for real-time applications.

Low Power Mode: YES

The low power mode feature allows the microcontroller to conserve energy when not in active use, contributing to overall power efficiency.

On Chip Program ROM Width: 8

Having an on-chip program ROM width of 8 bits facilitates efficient storage and execution of program code.

No. of I/O Lines: 16

With 16 I/O lines, this microcontroller can interface with a variety of external devices and peripherals for versatile functionality.

Technical Specifications

Microcontrollers MSP430F2131IDW attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

16

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.35 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

"BOD, COMPARATOR(8), TIMER(16), WDT"

Trade Compliance

MSP430F2131IDW Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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