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MSP430F2122TRTVR

Texas Instruments

MSP430F2122TRTVR by Texas Instruments

MSP430F2122TRTVR by Texas Instruments is a 16-bit microcontroller with 4096 ROM words and 512 RAM bytes. Operating at a max frequency of 16 MHz, it is ideal for industrial applications requiring PWM control and ADC channels. With a temperature range from -40 to 105°C, this CMOS technology chip carrier suits various embedded systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,912 parts In-Stock

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Vyrian

USA . 3,037 parts In-Stock

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3,037

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Distributors (Availability)

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AZTECH Wire

Italy . 736 parts In-Stock

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$13.605

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736

$13.605

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One Stop Electronics

USA . 185 parts In-Stock

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$28.000

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$28.000

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Parana Technologies

USA . 5 parts In-Stock

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$37.778

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$37.778

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DigiPath Technology Company

USA . 1,478 parts In-Stock

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$41.598

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ChromeModa Solutions

Germany . 6,413 parts In-Stock

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$42.447

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$34.807

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$42.447

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IDEA Electronic Components Group

UK . 2,203 parts In-Stock

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$42.447

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$40.325

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$38.202

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$42.447

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QUARKTWIN TECHNOLOGY LTD

USA . 4,271 parts In-Stock

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Corphita

USA . 1,166 parts In-Stock

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Microchip USA

USA . 249 parts In-Stock

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Overview

Experience the power of innovation with the Texas Instruments MSP430F2122TRTVR microcontroller. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability in every product they manufacture. Ideal for a wide range of applications, this microcontroller offers unmatched value, benefits, and advantages to customers. From its compact package to its impressive performance capabilities, the MSP430F2122TRTVR is the perfect choice for your next project. Unlock endless possibilities with this cutting-edge technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the microcontroller lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in production.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB space and easy integration into existing designs.

Bit Size: 16

The 16-bit architecture of the microcontroller enables it to handle complex tasks and calculations efficiently.

Power Supplies (V): 1.8/3.6

The wide range of power supply options makes the microcontroller versatile and suitable for various voltage requirements.

No. of Terminals: 32

With 32 terminals, the microcontroller can interface with a wide range of external components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles offer flexibility in design and thermal management, making it suitable for different applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliability in extreme environmental conditions.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making it an efficient choice for battery-powered devices.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the microcontroller to function in harsh cold environments without issues.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides excellent corrosion resistance and ensures reliable electrical connections over time.

ADC Channels: YES

The built-in ADC channels enable the microcontroller to capture analog signals accurately, making it suitable for sensor interfacing.

Terminal Position: QUAD

The quad terminal position simplifies PCB layout and assembly, making the integration process more straightforward.

ROM Words: 4096

The generous ROM capacity allows for storing program code and data, enabling the microcontroller to run complex algorithms and applications.

Maximum Seated Height: 0.8 mm

The low-profile design with a maximum seated height of 0.8 mm is beneficial for space-constrained applications and slim devices.

Width: 5 mm

The compact width of 5 mm allows for easy integration into small form factor designs and tight spaces.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency of 16 MHz allows the microcontroller to execute instructions quickly, enhancing overall performance.

Maximum Time At Peak Reflow Temperature (s): 30

The long maximum time at peak reflow temperature ensures proper soldering and reliability during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C enables lead-free soldering and compatibility with industry standards.

Length: 5 mm

The compact length of 5 mm contributes to the overall small footprint of the microcontroller, ideal for space-constrained designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the microcontroller can withstand harsh operating conditions in industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller with various peripheral ICs, it offers high performance, efficiency, and flexibility in interfacing with external devices.

RAM Bytes: 512

The generous RAM size of 512 bytes allows for efficient data processing and temporary storage, enhancing the microcontroller's functionality.

Technology: CMOS

The CMOS technology used in the microcontroller ensures low power consumption, high speed, and high noise immunity, making it suitable for battery-powered devices.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the manufacturing process, enhances reliability, and helps comply with environmental regulations.

PWM Channels: YES

The presence of PWM channels allows for precise control of analog output signals, making the microcontroller suitable for motor control and power management applications.

ROM Programmability: FLASH

The ROM programmability using flash memory enables easy and quick reprogramming of the microcontroller, facilitating firmware updates and customization.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables high-density integration of the microcontroller on PCBs, saving space and allowing for more features in a compact design.

Moisture Sensitivity Level (MSL): 2

The MSL level of 2 indicates that the microcontroller has moderate sensitivity to moisture, requiring proper handling and storage to maintain performance.

Speed: 16 rpm

The speed of 16 rpm refers to the maximum clock frequency for the microcontroller, ensuring fast and efficient execution of instructions for responsive performance.

No. of I/O Lines: 24

With 24 I/O lines, the microcontroller offers ample connectivity options for interfacing with external devices and peripherals, enhancing its versatility.

Technical Specifications

Microcontrollers MSP430F2122TRTVR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 1.8V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

24

No. of Terminals:

32

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.6

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

.8 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Trade Compliance

MSP430F2122TRTVR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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