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MSP430F2122IRTVR

Texas Instruments

MSP430F2122IRTVR by Texas Instruments

MSP430F2122IRTVR by Texas Instruments is a 16-bit microcontroller with 4096 ROM words, 512 RAM bytes, and 24 I/O lines. It operates at a max clock frequency of 16 MHz and is suitable for industrial applications requiring a compact chip carrier package with very thin profile.

Median Price

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1k+

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Vyrian

USA . 1,981 parts In-Stock

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Digiode

USA . 1,515 parts In-Stock

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AZTECH Wire

Italy . 869 parts In-Stock

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$6.130

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One Stop Electronics

USA . 686 parts In-Stock

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Parana Technologies

USA . 847 parts In-Stock

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$23.852

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DigiPath Technology Company

USA . 883 parts In-Stock

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ChromeModa Solutions

Germany . 4,814 parts In-Stock

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IDEA Electronic Components Group

UK . 476 parts In-Stock

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$25.460

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$24.120

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QUARKTWIN TECHNOLOGY LTD

USA . 7,586 parts In-Stock

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Corphita

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Metaverse IC Inc.

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Microchip USA

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Overview

Unlock the power of innovation with the MSP430F2122IRTVR microcontroller by Texas Instruments. Known for their high-quality products, Texas Instruments brings you a versatile solution ideal for a wide range of applications. Whether you're designing smart home devices, wearable technology, or industrial automation systems, this microcontroller offers unmatched value, efficiency, and reliability. Experience seamless integration, advanced features, and exceptional performance with the MSP430F2122IRTVR. Stay ahead of the curve and elevate your projects to new heights with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the microcontroller lightweight and durable, perfect for compact and portable electronic devices.

Surface Mount: YES

Being surface mountable allows for automated assembly processes, making it easier and more cost-effective to mass-produce electronic devices using this microcontroller.

Bit Size: 16

A 16-bit microcontroller allows for more complex calculations and processing capabilities compared to lower-bit microcontrollers, making it suitable for applications requiring higher performance.

Power Supplies (V): 1.8/3.6

The microcontroller supports a wide range of power supply voltages, providing flexibility in designing electronic systems with different power requirements.

No. of Terminals: 32

Having 32 terminals allows for a sufficient number of input/output connections, enabling the microcontroller to communicate with various external components and peripherals.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions, making it reliable for industrial applications.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making this microcontroller energy-efficient and suitable for battery-powered devices.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller uses a Reduced Instruction Set Computer (RISC) architecture, which enhances processing speed and efficiency, making it ideal for real-time control applications.

RAM Bytes: 512

With 512 bytes of RAM, the microcontroller can efficiently store and access data during operations, enabling seamless multitasking and data processing capabilities.

ROM Programmability: FLASH

The flash programmable ROM allows for easy and quick reprogramming of the microcontroller, facilitating firmware updates and customization for different applications.

Technical Specifications

Microcontrollers MSP430F2122IRTVR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 1.8V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

24

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.6

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

.8 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Trade Compliance

MSP430F2122IRTVR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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