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MSP430F2112TRTVR

Texas Instruments

MSP430F2112TRTVR by Texas Instruments

MSP430F2112TRTVR by Texas Instruments is a 16-bit microcontroller with 2048 ROM words and 256 RAM bytes. Operating at a max frequency of 16 MHz, it is ideal for industrial applications requiring a compact chip carrier package with very thin profile and quad terminal position. The microcontroller features PWM channels, ADC support, and RISC architecture for efficient performance in various embedded systems.

Median Price

$40.226

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$40.226

100+ parts

-

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550

$40.226

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Vyrian

USA . 8,439 parts In-Stock

1+ parts

-

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-

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8,439

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Digiode

USA . 1,689 parts In-Stock

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1,689

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 853 parts In-Stock

1+ parts

$5.531

100+ parts

-

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853

$5.531

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One Stop Electronics

USA . 1,035 parts In-Stock

1+ parts

$7.000

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-

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1,035

$7.000

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Parana Technologies

USA . 346 parts In-Stock

1+ parts

$76.975

100+ parts

$7,148.316

1k+ parts

$69.278

10k+ parts

-

346

$76.975

$7,148.316

$69.278

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DigiPath Technology Company

USA . 992 parts In-Stock

1+ parts

$84.759

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992

$84.759

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ChromeModa Solutions

Germany . 564 parts In-Stock

1+ parts

$86.489

100+ parts

$70.921

1k+ parts

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564

$86.489

$70.921

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IDEA Electronic Components Group

UK . 27 parts In-Stock

1+ parts

$86.489

100+ parts

$82.165

1k+ parts

$77.840

10k+ parts

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27

$86.489

$82.165

$77.840

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Corphita

USA . 478 parts In-Stock

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478

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Microchip USA

USA . 233 parts In-Stock

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Overview

Unlock the power of innovation with the MSP430F2112TRTVR by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers top-notch quality and reliability. Ideal for a wide range of applications, this microcontroller offers unparalleled value and benefits to customers. With advanced features like ADC channels, PWM channels, and ROM programmability, the MSP430F2112TRTVR is designed to meet your industrial needs with ease. Experience the difference with Texas Instruments and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for various applications while keeping the overall weight of the device minimal.

Surface Mount: YES

Surface mount technology allows for easy integration onto PCBs, saving space and enabling automated assembly processes.

Power Supplies (V): 1.8/3.6

The range of power supply voltages allows flexibility in design and compatibility with different power sources.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliable performance even in harsh environments where temperatures can fluctuate.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient processing and optimized performance for embedded applications, making this microcontroller a good choice for low-power devices.

ROM Programmability: FLASH

Flash programmable ROM allows for easy updates and versatility in programming, enhancing the flexibility and functionality of the microcontroller.

Technical Specifications

Microcontrollers MSP430F2112TRTVR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 1.8V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

24

No. of Terminals:

32

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.6

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

.8 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Trade Compliance

MSP430F2112TRTVR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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