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MSP430F2112TPW

Texas Instruments

MSP430F2112TPW by Texas Instruments

MSP430F2112TPW by Texas Instruments is a 16-bit microcontroller with 2048 ROM words and 256 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption and connectivity via I2C, IRDA, SPI, and UART interfaces. The compact package style with small outline and thin profile makes it ideal for space-constrained designs.

Median Price

$2.414

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,750 parts In-Stock

1+ parts

$2.414

100+ parts

$2.115

1k+ parts

$1.195

10k+ parts

-

2,750

$2.414

$2.115

$1.195

-

Mouser Electronics

USA . 227 parts In-Stock

1+ parts

$5.290

100+ parts

$2.700

1k+ parts

$1.980

10k+ parts

$1.920

227

$5.290

$2.700

$1.980

$1.920

Arrow

USA . 350 parts In-Stock

1+ parts

-

100+ parts

$1.595

1k+ parts

-

10k+ parts

-

350

-

$1.595

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TME

Poland . 50 parts In-Stock

1+ parts

$1.470

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$1.470

-

-

-

Digiode

USA . 2,767 parts In-Stock

1+ parts

$2.293

100+ parts

-

1k+ parts

-

10k+ parts

-

2,767

$2.293

-

-

-

Vyrian

USA . 7,243 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,243

-

-

-

-

Euro-Tech

UK . 364 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

364

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 450 parts In-Stock

1+ parts

$2.173

100+ parts

-

1k+ parts

-

10k+ parts

-

450

$2.173

-

-

-

Microchip USA

USA . 2,988 parts In-Stock

1+ parts

$14.510

100+ parts

$14.420

1k+ parts

$14.380

10k+ parts

$14.330

2,988

$14.510

$14.420

$14.380

$14.330

Parana Technologies

USA . 451 parts In-Stock

1+ parts

$37.045

100+ parts

-

1k+ parts

-

10k+ parts

-

451

$37.045

-

-

-

DigiPath Technology Company

USA . 985 parts In-Stock

1+ parts

$40.792

100+ parts

$37.528

1k+ parts

-

10k+ parts

-

985

$40.792

$37.528

-

-

ChromeModa Solutions

Germany . 2,000 parts In-Stock

1+ parts

$41.624

100+ parts

$34.132

1k+ parts

-

10k+ parts

-

2,000

$41.624

$34.132

-

-

IDEA Electronic Components Group

UK . 1,609 parts In-Stock

1+ parts

$41.624

100+ parts

$39.543

1k+ parts

$37.462

10k+ parts

-

1,609

$41.624

$39.543

$37.462

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Perfect Parts

USA . 888 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

888

-

-

-

-

Overview

Unlock the power of innovation with the Texas Instruments MSP430F2112TPW microcontroller. Designed with precision and reliability in mind, this high-quality product offers a wide range of applications in various industries. With its advanced features and performance capabilities, customers can expect unmatched value and benefits when using this cutting-edge technology. Elevate your projects to new heights and experience the advantages that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for efficient and compact PCB designs, saving space and reducing overall product size.

Maximum Supply Voltage: 3.6 V

This high supply voltage provides flexibility in power options for the microcontroller, allowing it to be used in a variety of applications.

ADC Channels: YES

Having analog-to-digital converter channels enables the microcontroller to interface with analog sensors and signals, expanding its functionality.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a Reduced Instruction Set Computer (RISC) architecture microcontroller, it offers high performance and efficiency in executing instructions, crucial for real-time applications.

Connectivity: I2C, IRDA, SPI(2), UART

The variety of connectivity options such as I2C, IRDA, SPI, and UART allows the microcontroller to communicate with external devices and systems, enhancing its versatility.

Low Power Mode: YES

The low power mode feature helps in reducing power consumption during idle or standby modes, making the microcontroller energy efficient and suitable for battery-operated applications.

Technical Specifications

Microcontrollers MSP430F2112TPW attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

24

No. of Serial I/Os:

1

No. of Terminals:

28

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.6

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(2), UART"

Peripherals:

"BOD, COMPARATOR, POR, TIMER(2), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430F2112TPW Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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