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MSP430F2111TRGER

Texas Instruments

MSP430F2111TRGER by Texas Instruments

MSP430F2111TRGER by Texas Instruments is a 16-bit microcontroller with 2048 ROM words and 128 RAM bytes. Operating at up to 16 MHz, it features 16 timers, PWM channels, and ADC channels. Ideal for industrial applications requiring low power consumption and fixed-point format processing.

Median Price

$1.442

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,500 parts In-Stock

1+ parts

$1.857

100+ parts

$1.534

1k+ parts

$0.829

10k+ parts

-

5,500

$1.857

$1.534

$0.829

-

Rochester

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

$1.190

1k+ parts

$1.060

10k+ parts

$1.000

18,000

-

$1.190

$1.060

$1.000

DigiKey

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.560

10k+ parts

-

18,000

-

-

$1.560

-

Verical

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.325

10k+ parts

$1.250

18,000

-

-

$1.325

$1.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,975 parts In-Stock

1+ parts

$1.092

100+ parts

-

1k+ parts

-

10k+ parts

-

1,975

$1.092

-

-

-

Vyrian

USA . 6,497 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,497

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,175 parts In-Stock

1+ parts

$1.035

100+ parts

-

1k+ parts

-

10k+ parts

-

3,175

$1.035

-

-

-

Component Stockers USA

USA . 28,377 parts In-Stock

1+ parts

$1.330

100+ parts

$1.250

1k+ parts

$0.900

10k+ parts

$1.130

28,377

$1.330

$1.250

$0.900

$1.130

Parana Technologies

USA . 2,215 parts In-Stock

1+ parts

$24.739

100+ parts

-

1k+ parts

$25.409

10k+ parts

-

2,215

$24.739

-

$25.409

-

IDEA Electronic Components Group

UK . 1,507 parts In-Stock

1+ parts

$27.797

100+ parts

$26.407

1k+ parts

$25.017

10k+ parts

-

1,507

$27.797

$26.407

$25.017

-

ChromeModa Solutions

Germany . 1,165 parts In-Stock

1+ parts

$27.797

100+ parts

$22.794

1k+ parts

-

10k+ parts

-

1,165

$27.797

$22.794

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 4,511 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,511

-

-

-

-

DigiPath Technology Company

USA . 1,453 parts In-Stock

1+ parts

-

100+ parts

$25.062

1k+ parts

-

10k+ parts

-

1,453

-

$25.062

-

-

Overview

Unlock the power of cutting-edge technology with the Texas Instruments MSP430F2111TRGER microcontroller. Designed for industrial applications, this versatile chip offers high performance and reliability. With a wide range of peripherals including timers, comparators, and PWM channels, this microcontroller is perfect for a variety of projects. Benefit from the efficiency and precision of Texas Instruments' renowned manufacturing quality and take your designs to the next level with the MSP430F2111TRGER.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the microcontroller, making it suitable for various environments and applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 3.6 V

Having a maximum supply voltage of 3.6 V enables compatibility with a wide range of power sources, increasing flexibility in design.

Maximum Operating Temperature: 105 °C

High maximum operating temperature of 105°C ensures reliable performance even in harsh operating conditions.

CPU Family: MSP430

The MSP430 CPU family is known for its low-power consumption and high efficiency, making it a popular choice for various portable and battery-operated devices.

ADC Channels: YES

Having ADC channels allows for analog-to-digital conversion, making it suitable for applications requiring sensor interfacing and data acquisition.

ROM Programmability: FLASH

ROM programmability using flash technology allows for easy and flexible firmware updates, enhancing the product's versatility and longevity.

Low Power Mode: YES

Low power mode capability helps in reducing power consumption, extending battery life, and making the product energy-efficient.

Technical Specifications

Microcontrollers MSP430F2111TRGER attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

24

No. of Timers:

16

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.41 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

"BOD, COMPARATOR(8), TIMER(16), WDT"

Trade Compliance

MSP430F2111TRGER Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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