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MSP430F2111TPWR

Texas Instruments

MSP430F2111TPWR by Texas Instruments

MSP430F2111TPWR by Texas Instruments is a 16-bit microcontroller with 2048 ROM words and 128 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. With features like PWM channels, ADC channels, and multiple timers, it offers versatile functionality in a compact package.

Median Price

$1.442

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 49,500 parts In-Stock

1+ parts

$1.857

100+ parts

$1.534

1k+ parts

$0.829

10k+ parts

-

49,500

$1.857

$1.534

$0.829

-

Rochester

USA . 686 parts In-Stock

1+ parts

-

100+ parts

$1.190

1k+ parts

$1.060

10k+ parts

$1.000

686

-

$1.190

$1.060

$1.000

DigiKey

USA . 686 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.560

10k+ parts

-

686

-

-

$1.560

-

Verical

USA . 686 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.325

10k+ parts

$1.250

686

-

-

$1.325

$1.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 868 parts In-Stock

1+ parts

$1.092

100+ parts

-

1k+ parts

-

10k+ parts

-

868

$1.092

-

-

-

Vyrian

USA . 5,969 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,969

-

-

-

-

DigiKey Marketplace

USA . 686 parts In-Stock

1+ parts

-

100+ parts

$1.330

1k+ parts

-

10k+ parts

-

686

-

$1.330

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,552 parts In-Stock

1+ parts

$1.035

100+ parts

-

1k+ parts

-

10k+ parts

-

1,552

$1.035

-

-

-

Parana Technologies

USA . 1,656 parts In-Stock

1+ parts

$22.939

100+ parts

$2,130.221

1k+ parts

$20.645

10k+ parts

-

1,656

$22.939

$2,130.221

$20.645

-

DigiPath Technology Company

USA . 1,809 parts In-Stock

1+ parts

$25.259

100+ parts

$23.238

1k+ parts

-

10k+ parts

-

1,809

$25.259

$23.238

-

-

IDEA Electronic Components Group

UK . 2,102 parts In-Stock

1+ parts

$25.774

100+ parts

$24.485

1k+ parts

$23.197

10k+ parts

-

2,102

$25.774

$24.485

$23.197

-

ChromeModa Solutions

Germany . 882 parts In-Stock

1+ parts

$25.774

100+ parts

$21.135

1k+ parts

-

10k+ parts

-

882

$25.774

$21.135

-

-

Perfect Parts

USA . 2,565 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,565

-

-

-

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Overview

Unleash the power of innovation with the MSP430F2111TPWR microcontroller by Texas Instruments. This cutting-edge device offers unparalleled quality and reliability, setting the industry standard for excellence. Ideal for a wide range of applications, this microcontroller provides customers with unmatched value, efficiency, and performance. Elevate your projects to new heights with the MSP430F2111TPWR and experience the difference that Texas Instruments can make in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to physical damage, making the product suitable for industrial applications.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle a wide range of power input, making it versatile for various projects.

Bit Size: 16

A 16-bit architecture allows for higher precision and complex calculations, enabling the microcontroller to perform advanced functions efficiently.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable for long-term use.

Maximum Clock Frequency: 16 MHz

With a maximum clock frequency of 16 MHz, this microcontroller can execute instructions at a fast rate, improving overall performance.

RAM Bytes: 128

Having 128 bytes of RAM allows for efficient data storage and manipulation, enhancing the microcontroller's ability to process information effectively.

Technical Specifications

Microcontrollers MSP430F2111TPWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

16

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.41 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

"BOD, COMPARATOR(8), TIMER(16), WDT"

Trade Compliance

MSP430F2111TPWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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