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MSP430F2101TDGVR

Texas Instruments

MSP430F2101TDGVR by Texas Instruments

MSP430F2101TDGVR by Texas Instruments is a 16-bit microcontroller with 1024 ROM words and 128 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. With features like PWM channels, ADC channels, and multiple timers, it offers versatile functionality in a compact package ideal for IoT devices.

Median Price

$1.458

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,920 parts In-Stock

1+ parts

$1.458

100+ parts

$1.204

1k+ parts

$0.651

10k+ parts

-

9,920

$1.458

$1.204

$0.651

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,321 parts In-Stock

1+ parts

$1.385

100+ parts

-

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-

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3,321

$1.385

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Vyrian

USA . 4,959 parts In-Stock

1+ parts

-

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-

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4,959

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,995 parts In-Stock

1+ parts

$1.312

100+ parts

-

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-

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2,995

$1.312

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Microchip USA

USA . 2,452 parts In-Stock

1+ parts

$5.770

100+ parts

-

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2,452

$5.770

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Component Stockers USA

USA . 5,098 parts In-Stock

1+ parts

$11.490

100+ parts

-

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5,098

$11.490

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AZTECH Wire

Italy . 771 parts In-Stock

1+ parts

$20.670

100+ parts

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771

$20.670

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Parana Technologies

USA . 581 parts In-Stock

1+ parts

$52.957

100+ parts

$4,917.840

1k+ parts

$47.661

10k+ parts

-

581

$52.957

$4,917.840

$47.661

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DigiPath Technology Company

USA . 575 parts In-Stock

1+ parts

$58.312

100+ parts

-

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575

$58.312

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IDEA Electronic Components Group

UK . 1,629 parts In-Stock

1+ parts

$59.502

100+ parts

$56.527

1k+ parts

$53.552

10k+ parts

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1,629

$59.502

$56.527

$53.552

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ChromeModa Solutions

Germany . 463 parts In-Stock

1+ parts

$59.502

100+ parts

$48.792

1k+ parts

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463

$59.502

$48.792

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A-Z Elektronik GmbH

Germany . 5,384 parts In-Stock

1+ parts

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5,384

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Overview

Unleash the power of innovation with the MSP430F2101TDGVR by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers top-notch quality and reliability. The MSP430F2101TDGVR is a game-changer in the world of microcontrollers, offering unmatched performance and versatility. With a wide range of applications, this product provides customers with advanced features and benefits that set it apart from the competition. Experience the value and advantages that the MSP430F2101TDGVR brings to your projects, and revolutionize the way you approach electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications without adding unnecessary weight.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of input voltages, providing flexibility in power supply options.

CPU Family: MSP430

The MSP430 CPU family is known for its ultra-low power consumption and high performance, making it ideal for energy-efficient applications.

Maximum Clock Frequency: 16 MHz

Enables fast processing speeds and efficient operation of the microcontroller.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels allows the microcontroller to convert analog signals to digital data, expanding its capabilities for sensor interfacing and data acquisition.

Technical Specifications

Microcontrollers MSP430F2101TDGVR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

16

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

1024

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.41 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

"BOD, COMPARATOR(8), TIMER(16), WDT"

Trade Compliance

MSP430F2101TDGVR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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