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MSP430F2101IDW

Texas Instruments

MSP430F2101IDW by Texas Instruments

MSP430F2101IDW by Texas Instruments is a 16-bit microcontroller with 1024 ROM words, 128 RAM bytes, and 16 MHz clock frequency. Ideal for industrial applications requiring low power consumption, it features peripherals like BOD, comparator(8), timer(16), and WDT. With a compact package style and boundary scan support, this CMOS technology-based MCU offers high performance in a small footprint.

Median Price

$1.682

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,425 parts In-Stock

1+ parts

$1.870

100+ parts

$1.545

1k+ parts

$0.835

10k+ parts

-

4,425

$1.870

$1.545

$0.835

-

Rochester

USA . 9,255 parts In-Stock

1+ parts

-

100+ parts

$1.470

1k+ parts

$1.220

10k+ parts

$1.090

9,255

-

$1.470

$1.220

$1.090

DigiKey

USA . 9,255 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.840

10k+ parts

-

9,255

-

-

$1.840

-

Verical

USA . 7,825 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.525

10k+ parts

$1.363

7,825

-

-

$1.525

$1.363

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TME

Poland . 69 parts In-Stock

1+ parts

$0.960

100+ parts

-

1k+ parts

-

10k+ parts

-

69

$0.960

-

-

-

Digiode

USA . 796 parts In-Stock

1+ parts

$1.102

100+ parts

-

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-

10k+ parts

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796

$1.102

-

-

-

DigiKey Marketplace

USA . 11,254 parts In-Stock

1+ parts

-

100+ parts

$1.210

1k+ parts

-

10k+ parts

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11,254

-

$1.210

-

-

Vyrian

USA . 8,427 parts In-Stock

1+ parts

-

100+ parts

-

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-

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8,427

-

-

-

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LIBRA Elektronik GmbH

Germany . 598 parts In-Stock

1+ parts

-

100+ parts

-

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598

-

-

-

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ACDS - Activité Composants Distribution Service

France . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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200

-

-

-

-

Bristol Electronics

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$1.017

1k+ parts

-

10k+ parts

-

200

-

$1.017

-

-

Dan-Mar Components

USA . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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200

-

-

-

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Prism Electronics

USA . 49 parts In-Stock

1+ parts

-

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-

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49

-

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Sea View Technologies

USA . 10 parts In-Stock

1+ parts

-

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-

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10

-

-

-

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Sensible Micro Corp

USA . 5 parts In-Stock

1+ parts

-

100+ parts

$0.995

1k+ parts

$0.918

10k+ parts

-

5

-

$0.995

$0.918

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,204 parts In-Stock

1+ parts

$1.044

100+ parts

-

1k+ parts

-

10k+ parts

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3,204

$1.044

-

-

-

Microchip USA

USA . 2,886 parts In-Stock

1+ parts

$7.865

100+ parts

-

1k+ parts

-

10k+ parts

-

2,886

$7.865

-

-

-

Parana Technologies

USA . 45 parts In-Stock

1+ parts

$27.845

100+ parts

-

1k+ parts

$40.656

10k+ parts

-

45

$27.845

-

$40.656

-

DigiPath Technology Company

USA . 1,333 parts In-Stock

1+ parts

$30.661

100+ parts

$28.208

1k+ parts

-

10k+ parts

-

1,333

$30.661

$28.208

-

-

ChromeModa Solutions

Germany . 3,448 parts In-Stock

1+ parts

$31.287

100+ parts

$25.655

1k+ parts

-

10k+ parts

-

3,448

$31.287

$25.655

-

-

IDEA Electronic Components Group

UK . 2,200 parts In-Stock

1+ parts

$31.287

100+ parts

$29.723

1k+ parts

$28.158

10k+ parts

-

2,200

$31.287

$29.723

$28.158

-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$44.013

100+ parts

$40.052

1k+ parts

$36.091

10k+ parts

-

2,000

$44.013

$40.052

$36.091

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Perfect Parts

USA . 764 parts In-Stock

1+ parts

-

100+ parts

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764

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F2101IDW microcontroller. Designed with precision and reliability in mind, this product offers a wide range of applications in various industries. With advanced features such as low power mode and PWM channels, this microcontroller provides unmatched performance while ensuring energy efficiency. Trust in Texas Instruments' legacy of excellence and take your projects to new heights with the MSP430F2101IDW.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective, lightweight, and durable, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, saving time and space in the overall design.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, providing flexibility in different power supply applications.

On Chip Data RAM Width: 8

Wide data RAM width allows for efficient data processing and storage on the chip.

Package Shape: RECTANGULAR

Rectangular shape ensures compatibility with standard packaging and mounting processes.

Bit Size: 16

16-bit architecture offers higher processing capabilities and precision compared to lower bit sizes.

Power Supplies (V): 2/3.3

Supports multiple power supply options, enabling flexibility in power management.

No. of Terminals: 20

Sufficient number of terminals for connecting external components and peripherals to the microcontroller.

Package Style (Meter): SMALL OUTLINE

Small outline package saves space on the PCB, especially in compact designs.

Minimum Supply Voltage: 3.3 V

Low minimum supply voltage helps in reducing power consumption and increasing efficiency.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable performance in varying environmental conditions.

CPU Family: MSP430

Part of the popular MSP430 family known for low power consumption and high performance in embedded systems.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold temperatures, suitable for outdoor or industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Durable terminal finish that ensures good contact with external connections for reliable performance.

ADC Channels: YES

Onboard ADC channels allow for analog signal conversion, enabling interfacing with analog sensors and peripherals.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and mounting options.

ROM Words: 1024

Large ROM size allows for storing program code and data, sufficient for complex applications.

Maximum Seated Height: 2.65 mm

Low seated height saves space in the overall design and allows for compact form factor.

RAM Words: 0.125

Efficient use of RAM space, suitable for storing temporary data and variables during program execution.

Width: 7.5 mm

Compact width size enables the microcontroller to fit in tight spaces or small form factor devices.

Technical Specifications

Microcontrollers MSP430F2101IDW attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

16

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

1024

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.35 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

"BOD, COMPARATOR(8), TIMER(16), WDT"

Trade Compliance

MSP430F2101IDW Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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