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MSP430F2101IDGV

Texas Instruments

MSP430F2101IDGV by Texas Instruments

MSP430F2101IDGV by Texas Instruments is a 16-bit microcontroller with 1024 ROM words and 128 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. With features like PWM channels, ADC channels, and multiple timers, it offers versatile functionality in a compact package ideal for IoT devices.

Median Price

$1.682

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,949 parts In-Stock

1+ parts

$1.870

100+ parts

$1.545

1k+ parts

$0.835

10k+ parts

-

6,949

$1.870

$1.545

$0.835

-

Rochester

USA . 3,862 parts In-Stock

1+ parts

-

100+ parts

$1.470

1k+ parts

$1.220

10k+ parts

$1.090

3,862

-

$1.470

$1.220

$1.090

DigiKey

USA . 3,862 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.840

10k+ parts

-

3,862

-

-

$1.840

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Verical

USA . 2,550 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.525

10k+ parts

$1.363

2,550

-

-

$1.525

$1.363

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,891 parts In-Stock

1+ parts

$1.102

100+ parts

-

1k+ parts

-

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1,891

$1.102

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-

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Vyrian

USA . 6,175 parts In-Stock

1+ parts

-

100+ parts

-

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6,175

-

-

-

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DigiKey Marketplace

USA . 3,862 parts In-Stock

1+ parts

-

100+ parts

$1.210

1k+ parts

-

10k+ parts

-

3,862

-

$1.210

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,321 parts In-Stock

1+ parts

$1.044

100+ parts

-

1k+ parts

-

10k+ parts

-

3,321

$1.044

-

-

-

Component Stockers USA

USA . 11,689 parts In-Stock

1+ parts

$1.170

100+ parts

$1.100

1k+ parts

$0.880

10k+ parts

-

11,689

$1.170

$1.100

$0.880

-

Microchip USA

USA . 1,717 parts In-Stock

1+ parts

$7.865

100+ parts

-

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1,717

$7.865

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Parana Technologies

USA . 2,185 parts In-Stock

1+ parts

$54.411

100+ parts

-

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-

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2,185

$54.411

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-

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ChromeModa Solutions

Germany . 6,227 parts In-Stock

1+ parts

$61.136

100+ parts

$50.132

1k+ parts

-

10k+ parts

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6,227

$61.136

$50.132

-

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IDEA Electronic Components Group

UK . 816 parts In-Stock

1+ parts

$61.136

100+ parts

$58.079

1k+ parts

$55.022

10k+ parts

-

816

$61.136

$58.079

$55.022

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QUARKTWIN TECHNOLOGY LTD

USA . 3,962 parts In-Stock

1+ parts

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3,962

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DigiPath Technology Company

USA . 2,310 parts In-Stock

1+ parts

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100+ parts

$55.120

1k+ parts

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2,310

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$55.120

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Metaverse IC Inc.

Canada . 1,390 parts In-Stock

1+ parts

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100+ parts

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1,390

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Perfect Parts

USA . 562 parts In-Stock

1+ parts

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562

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Overview

Experience the power of innovation with the Texas Instruments MSP430F2101IDGV microcontroller. Known for its high quality and reliability, Texas Instruments continues to lead the industry in cutting-edge technology. This versatile microcontroller is ideal for a wide range of applications, offering customers exceptional value and performance. Whether you're designing consumer electronics, industrial automation systems, or automotive products, the MSP430F2101IDGV delivers superior functionality and efficiency. Trust Texas Instruments to provide the solutions you need to bring your projects to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

Supports a relatively high supply voltage, making it suitable for a wide range of applications.

On Chip Data RAM Width: 8

Offers a decent amount of on-chip memory for data storage and manipulation.

Package Shape: RECTANGULAR

Allows for efficient use of space on the circuit board, enabling a compact and streamlined design.

Bit Size: 16

Provides a good balance between processing power and complexity for various tasks and applications.

Power Supplies (V): 2/3.3

Offers flexibility in power supply options, allowing for compatibility with different voltage sources.

No. of Terminals: 20

Provides sufficient connections for interfacing with external components and peripherals.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Enables a compact form factor, suitable for space-constrained applications and designs.

Minimum Supply Voltage: 3.3 V

Ensures reliable operation at a low voltage threshold, helping to conserve power.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments without sacrificing performance or reliability.

CPU Family: MSP430

Part of a popular and reliable microcontroller family, known for its efficiency and robust performance.

Minimum Operating Temperature: -40 °C

Designed to function in extreme cold conditions, making it suitable for diverse environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent corrosion resistance and conductivity for reliable connections over time.

ADC Channels: YES

Integrated analog-to-digital converter allows for interfacing with analog sensors and signals.

Terminal Position: DUAL

Dual terminal position provides flexibility in mounting options and layout configurations.

ROM Words: 1024

Ample on-chip memory for storing program instructions and data.

Maximum Seated Height: 1.2 mm

Low profile design enables compact and slim device form factor.

RAM Words: 0.125

Provides fast access memory for temporary data storage during processing.

Width: 4.4 mm

Compact width allows for space-efficient board layout and design.

Boundary Scan: YES

Boundary scan feature for testing and debugging during development and production.

Peripherals: BOD, COMPARATOR(8), TIMER(16), WDT

Includes various peripherals for versatile interfacing and functionality in different applications.

Maximum Clock Frequency: 16 MHz

High clock frequency enables fast processing and response times for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified duration during manufacturing processes.

Peak Reflow Temperature °C: 260

Designed to endure high reflow temperatures without damage during assembly.

Length: 5 mm

Compact length contributes to overall small footprint and space-saving layout.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with extended temperature ranges and durability requirements.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller architecture provides efficient processing and control capabilities.

No. of Timers: 16

Multiple timers support various timing functions and tasks simultaneously.

RAM Bytes: 128

Adequate RAM capacity for buffering and storing data during operation.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

Gull wing terminal form for easy surface mounting and reliable solder connections.

Maximum Supply Current: 0.35 mA

Low supply current consumption for power-efficient operation.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent and reliable performance.

PWM Channels: YES

Pulse-width modulation channels for precise control and modulation of analog signals.

ROM Programmability: FLASH

Flash ROM technology allows for reprogrammable memory for firmware updates and customization.

Terminal Pitch: 0.4 mm

Narrow terminal pitch for high-density mounting and compact design layout.

Format: FIXED POINT

Fixed-point format for efficient numerical processing and calculations.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates a moderate level of moisture sensitivity for manufacturing and storage.

Speed: 16 rpm

Can operate at a speed of 16 revolutions per minute, suitable for motor control applications.

Low Power Mode: YES

Includes low power mode for energy-efficient operation and extended battery life.

On Chip Program ROM Width: 8

On-chip program ROM width of 8 bits for storing program instructions and code.

No. of I/O Lines: 16

Sufficient I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers MSP430F2101IDGV attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

16

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

1024

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.35 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

"BOD, COMPARATOR(8), TIMER(16), WDT"

Trade Compliance

MSP430F2101IDGV Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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