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MSP430F2013QRSATEP

Texas Instruments

MSP430F2013QRSATEP by Texas Instruments

MSP430F2013QRSATEP by Texas Instruments is a 16-bit microcontroller with 2048 ROM words and 128 RAM bytes. It operates at up to 16 MHz, suitable for automotive applications with low power mode and peripherals like BOR, TIMER(2), WDT. Offers connectivity via I2C, SPI, USI interfaces for versatile usage.

Median Price

$7.057

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 35,639 parts In-Stock

1+ parts

$6.801

100+ parts

$5.544

1k+ parts

$3.696

10k+ parts

-

35,639

$6.801

$5.544

$3.696

-

Rochester

USA . 1,460 parts In-Stock

1+ parts

-

100+ parts

$5.850

1k+ parts

$5.240

10k+ parts

$4.930

1,460

-

$5.850

$5.240

$4.930

DigiKey

USA . 1,460 parts In-Stock

1+ parts

-

100+ parts

$7.700

1k+ parts

-

10k+ parts

-

1,460

-

$7.700

-

-

Verical

USA . 1,210 parts In-Stock

1+ parts

-

100+ parts

$7.313

1k+ parts

$6.550

10k+ parts

$6.162

1,210

-

$7.313

$6.550

$6.162

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,204 parts In-Stock

1+ parts

$4.874

100+ parts

-

1k+ parts

-

10k+ parts

-

2,204

$4.874

-

-

-

Vyrian

USA . 5,030 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,030

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,508 parts In-Stock

1+ parts

$4.617

100+ parts

-

1k+ parts

-

10k+ parts

-

4,508

$4.617

-

-

-

Microchip USA

USA . 1,811 parts In-Stock

1+ parts

$30.030

100+ parts

$29.850

1k+ parts

$29.750

10k+ parts

$29.660

1,811

$30.030

$29.850

$29.750

$29.660

Parana Technologies

USA . 1,631 parts In-Stock

1+ parts

$74.521

100+ parts

-

1k+ parts

-

10k+ parts

-

1,631

$74.521

-

-

-

DigiPath Technology Company

USA . 1,190 parts In-Stock

1+ parts

$82.057

100+ parts

-

1k+ parts

-

10k+ parts

-

1,190

$82.057

-

-

-

ChromeModa Solutions

Germany . 4,527 parts In-Stock

1+ parts

$83.732

100+ parts

$68.660

1k+ parts

-

10k+ parts

-

4,527

$83.732

$68.660

-

-

IDEA Electronic Components Group

UK . 708 parts In-Stock

1+ parts

$83.732

100+ parts

$79.545

1k+ parts

$75.359

10k+ parts

-

708

$83.732

$79.545

$75.359

-

QUARKTWIN TECHNOLOGY LTD

USA . 17,026 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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17,026

-

-

-

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

Overview

Unlock the potential of your next project with the MSP430F2013QRSATEP by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers high-quality products that exceed expectations. Ideal for a variety of applications, this microcontroller offers unparalleled value and benefits to customers. With advanced features like low power mode, PWM channels, and ADC capabilities, this product is a game-changer for any project. Trust Texas Instruments for reliable, cutting-edge solutions that will take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various environments.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, making it versatile in different applications.

On Chip Data RAM Width: 8

Having a wider on-chip data RAM width enables faster data processing and storage capabilities.

Package Shape: SQUARE

The square shape of the package provides a compact form factor, saving space on the PCB.

Bit Size: 16

With a 16-bit size, this microcontroller can handle larger data sets and perform more complex calculations efficiently.

Power Supplies (V): 2/3.3

Supporting multiple power supply options gives flexibility in powering the microcontroller according to the application requirements.

No. of Terminals: 16

Having 16 terminals allows for connection to various external components and peripherals, increasing the microcontroller's functionality.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage helps in reducing power consumption and extending battery life in low-power applications.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making it an excellent choice for battery-powered devices.

Technical Specifications

Microcontrollers MSP430F2013QRSATEP attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 2.7V SUPPLY

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

10

No. of Serial I/Os:

0

No. of Terminals:

16

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.38 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI, USI

Peripherals:

BOR, TIMER(2), WDT

Analog To Digital Convertors:

2-Ch 16-Bit

Trade Compliance

MSP430F2013QRSATEP Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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