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MSP430F2013IPW

Texas Instruments

MSP430F2013IPW by Texas Instruments

MSP430F2013IPW by Texas Instruments is a 16-bit microcontroller with 2048 ROM words and 128 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption. With connectivity options like I2C and SPI, it offers versatile peripheral support for various embedded systems.

Median Price

$2.760

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 237 parts In-Stock

1+ parts

$0.495

100+ parts

$0.495

1k+ parts

$0.495

10k+ parts

$0.495

237

$0.495

$0.495

$0.495

$0.495

Chip1Stop

Japan . 220 parts In-Stock

1+ parts

$1.610

100+ parts

$1.230

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-

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220

$1.610

$1.230

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RS (Exports)

UK . 150 parts In-Stock

1+ parts

$2.520

100+ parts

$1.540

1k+ parts

-

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150

$2.520

$1.540

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Farnell

UK . 115 parts In-Stock

1+ parts

$2.900

100+ parts

$1.750

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$1.180

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115

$2.900

$1.750

$1.180

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Texas Instruments

USA . 73,632 parts In-Stock

1+ parts

$2.957

100+ parts

$2.591

1k+ parts

$1.464

10k+ parts

-

73,632

$2.957

$2.591

$1.464

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Mouser Electronics

USA . 141 parts In-Stock

1+ parts

$4.200

100+ parts

$3.170

1k+ parts

$2.850

10k+ parts

$2.640

141

$4.200

$3.170

$2.850

$2.640

Element14

Singapore . 115 parts In-Stock

1+ parts

$4.290

100+ parts

$2.920

1k+ parts

$2.120

10k+ parts

-

115

$4.290

$2.920

$2.120

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Rochester

USA . 252 parts In-Stock

1+ parts

-

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$2.100

1k+ parts

$1.880

10k+ parts

$1.770

252

-

$2.100

$1.880

$1.770

DigiKey

USA . 252 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.760

10k+ parts

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252

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-

$2.760

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,294 parts In-Stock

1+ parts

$1.130

100+ parts

-

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4,294

$1.130

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TME

Poland . 12 parts In-Stock

1+ parts

$1.670

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12

$1.670

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Vyrian

USA . 7,646 parts In-Stock

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7,646

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Chip Stock

USA . 7,500 parts In-Stock

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7,500

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LIBRA Elektronik GmbH

Germany . 65 parts In-Stock

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65

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ACDS - Activité Composants Distribution Service

France . 44 parts In-Stock

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44

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Semi Source

USA . 42 parts In-Stock

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42

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LWI Electronics Inc

India . 8 parts In-Stock

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8

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Cyclops Electronics Ltd

UK . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,258 parts In-Stock

1+ parts

$1.071

100+ parts

-

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3,258

$1.071

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Parana Technologies

USA . 16 parts In-Stock

1+ parts

$51.414

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16

$51.414

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DigiPath Technology Company

USA . 499 parts In-Stock

1+ parts

$56.613

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499

$56.613

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ChromeModa Solutions

Germany . 4,854 parts In-Stock

1+ parts

$57.768

100+ parts

$47.370

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4,854

$57.768

$47.370

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IDEA Electronic Components Group

UK . 1,972 parts In-Stock

1+ parts

$57.768

100+ parts

$54.880

1k+ parts

$51.991

10k+ parts

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1,972

$57.768

$54.880

$51.991

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Perfect Parts

USA . 13,154 parts In-Stock

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13,154

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Cyclops Electronics Ltd (Excess)

UK . 44 parts In-Stock

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44

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Overview

Unlock the potential of your projects with the MSP430F2013IPW microcontroller by Texas Instruments. Designed with precision and reliability, this powerful device offers a wide range of applications in various industries. From smart home automation to wearable technology, the MSP430F2013IPW provides unmatched performance and efficiency. With its advanced features and innovative design, this microcontroller delivers exceptional value and benefits to customers seeking cutting-edge solutions for their projects. Trust Texas Instruments to bring you quality products that drive success in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, ensuring longevity and reliability.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

CPU Family: MSP430

MSP430 family of microcontrollers are known for their low power consumption, making this microcontroller energy efficient and suitable for battery-powered applications.

Analog To Digital Convertors: 1-Ch 16-Bit

High resolution analog to digital converters enable accurate and precise measurements in applications requiring analog signal processing.

Connectivity: I2C, SPI, USI

Multiple connectivity options such as I2C, SPI, and USI facilitate easy communication with other devices, enhancing the microcontroller's versatility in various applications.

ROM Programmability: FLASH

Flash programmable ROM allows for easy reprogramming of the microcontroller, enabling quick updates and modifications to the firmware.

Low Power Mode: YES

The presence of low power mode enhances the energy efficiency of the microcontroller, making it suitable for applications requiring extended battery life or energy conservation.

Technical Specifications

Microcontrollers MSP430F2013IPW attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 1.8 V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of I/O Lines:

10

No. of Serial I/Os:

0

No. of Terminals:

14

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, USI"

Peripherals:

"BOD, TIMER(2), WDT"

Analog To Digital Convertors:

1-Ch 16-Bit

Trade Compliance

MSP430F2013IPW Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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