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MSP430F2012TRSAT

Texas Instruments

MSP430F2012TRSAT by Texas Instruments

MSP430F2012TRSAT by Texas Instruments is a 16-bit microcontroller with 2048 ROM words, 128 RAM bytes, and 8 ADC channels. Ideal for industrial applications due to its low power mode, it offers connectivity via I2C, SPI, and USI interfaces. With a max clock frequency of 16 MHz and peak reflow temperature of 260°C, it ensures high performance in compact designs.

Median Price

$2.800

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 28,745 parts In-Stock

1+ parts

$2.281

100+ parts

$1.998

1k+ parts

$1.129

10k+ parts

-

28,745

$2.281

$1.998

$1.129

-

DigiKey

USA . 465 parts In-Stock

1+ parts

$3.320

100+ parts

$2.061

1k+ parts

$1.855

10k+ parts

$1.777

465

$3.320

$2.061

$1.855

$1.777

Mouser Electronics

USA . 77 parts In-Stock

1+ parts

$3.320

100+ parts

$2.070

1k+ parts

$1.770

10k+ parts

$1.760

77

$3.320

$2.070

$1.770

$1.760

Rochester

USA . 155 parts In-Stock

1+ parts

-

100+ parts

$1.620

1k+ parts

$1.450

10k+ parts

$1.370

155

-

$1.620

$1.450

$1.370

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,157 parts In-Stock

1+ parts

$1.492

100+ parts

-

1k+ parts

-

10k+ parts

-

2,157

$1.492

-

-

-

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$1.510

100+ parts

-

1k+ parts

-

10k+ parts

-

15

$1.510

-

-

-

Vyrian

USA . 5,736 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,736

-

-

-

-

ComSIT Distribution GmbH

Germany . 703 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

703

-

-

-

-

Schukat

Germany . 245 parts In-Stock

1+ parts

-

100+ parts

$2.102

1k+ parts

$2.024

10k+ parts

-

245

-

$2.102

$2.024

-

EPE Components Inc.

USA . 30 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30

-

-

-

-

Bristol Electronics

USA . 30 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 7,381 parts In-Stock

1+ parts

$1.330

100+ parts

-

1k+ parts

-

10k+ parts

-

7,381

$1.330

-

-

-

Corphita

USA . 1,824 parts In-Stock

1+ parts

$1.413

100+ parts

-

1k+ parts

-

10k+ parts

-

1,824

$1.413

-

-

-

Aranea Global

USA . 500 parts In-Stock

1+ parts

$1.480

100+ parts

-

1k+ parts

$1.421

10k+ parts

-

500

$1.480

-

$1.421

-

Parana Technologies

USA . 1,321 parts In-Stock

1+ parts

$16.137

100+ parts

-

1k+ parts

$16.460

10k+ parts

-

1,321

$16.137

-

$16.460

-

DigiPath Technology Company

USA . 1,193 parts In-Stock

1+ parts

$17.768

100+ parts

$16.347

1k+ parts

-

10k+ parts

-

1,193

$17.768

$16.347

-

-

ChromeModa Solutions

Germany . 5,073 parts In-Stock

1+ parts

$18.131

100+ parts

$14.867

1k+ parts

-

10k+ parts

-

5,073

$18.131

$14.867

-

-

IDEA Electronic Components Group

UK . 1,347 parts In-Stock

1+ parts

$18.131

100+ parts

$17.224

1k+ parts

$16.318

10k+ parts

-

1,347

$18.131

$17.224

$16.318

-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$41.626

100+ parts

$37.880

1k+ parts

$34.133

10k+ parts

-

2,000

$41.626

$37.880

$34.133

-

Overview

Discover the power and precision of the MSP430F2012TRSAT microcontroller by Texas Instruments. With cutting-edge technology and a reputation for excellence, Texas Instruments delivers unmatched quality in the field of microcontrollers. Ideal for a wide range of applications, this compact chip offers incredible value with low power consumption, high performance, and versatile connectivity options. Whether you're designing a smart device or a sophisticated control system, the MSP430F2012TRSAT provides the reliability and efficiency you need to bring your projects to life. Experience the difference that Texas Instruments can make in your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability to the product, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows flexibility in power supply options and compatibility with different systems.

ROM Words: 2048

Large ROM capacity allows for storing a significant amount of program data, enabling complex functionalities and applications.

Maximum Clock Frequency: 16 MHz

High clock frequency enables fast processing and response times, enhancing overall performance of the microcontroller.

ADC Channels: YES

Built-in Analog to Digital Converters provide the ability to interface with analog sensors and signals, expanding the range of applications the microcontroller can be used for.

Connectivity: I2C, SPI, USI

Support for multiple connectivity options like I2C, SPI, and USI enables easy integration with other devices and peripherals, increasing the versatility of the product.

Low Power Mode: YES

Low power mode helps in conserving energy and prolonging battery life, making the microcontroller energy-efficient and suitable for battery-powered applications.

Technical Specifications

Microcontrollers MSP430F2012TRSAT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 1.8 V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of I/O Lines:

10

No. of Serial I/Os:

0

No. of Terminals:

16

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, USI"

Peripherals:

"BOD, TIMER(2), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430F2012TRSAT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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