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MSP430F2012TRSAR

Texas Instruments

MSP430F2012TRSAR by Texas Instruments

MSP430F2012TRSAR by Texas Instruments is a 16-bit microcontroller with 2048 ROM words and 128 RAM bytes. Operating at up to 16 MHz, it features 8 ADC channels and peripherals like BOD, TIMER(2), WDT. Ideal for industrial applications requiring low power consumption and connectivity via I2C, SPI, USI interfaces.

Median Price

$2.128

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 67,305 parts In-Stock

1+ parts

$2.128

100+ parts

$1.758

1k+ parts

$0.950

10k+ parts

-

67,305

$2.128

$1.758

$0.950

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,333 parts In-Stock

1+ parts

$2.022

100+ parts

-

1k+ parts

-

10k+ parts

-

1,333

$2.022

-

-

-

Vyrian

USA . 3,717 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,717

-

-

-

-

EPE Components Inc.

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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3,000

-

-

-

-

Bristol Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

3,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 67,302 parts In-Stock

1+ parts

$1.810

100+ parts

-

1k+ parts

-

10k+ parts

-

67,302

$1.810

-

-

-

Corphita

USA . 4,412 parts In-Stock

1+ parts

$1.915

100+ parts

-

1k+ parts

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4,412

$1.915

-

-

-

AZTECH Wire

Italy . 321 parts In-Stock

1+ parts

$16.100

100+ parts

-

1k+ parts

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321

$16.100

-

-

-

Parana Technologies

USA . 2,378 parts In-Stock

1+ parts

$28.976

100+ parts

-

1k+ parts

$53.885

10k+ parts

-

2,378

$28.976

-

$53.885

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IDEA Electronic Components Group

UK . 863 parts In-Stock

1+ parts

$32.557

100+ parts

$30.929

1k+ parts

$29.301

10k+ parts

-

863

$32.557

$30.929

$29.301

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ChromeModa Solutions

Germany . 219 parts In-Stock

1+ parts

$32.557

100+ parts

$26.697

1k+ parts

-

10k+ parts

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219

$32.557

$26.697

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QUARKTWIN TECHNOLOGY LTD

USA . 28,382 parts In-Stock

1+ parts

-

100+ parts

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28,382

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DigiPath Technology Company

USA . 2,376 parts In-Stock

1+ parts

-

100+ parts

$29.353

1k+ parts

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10k+ parts

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2,376

-

$29.353

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Metaverse IC Inc.

Canada . 202 parts In-Stock

1+ parts

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202

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Overview

Experience the innovative power of Texas Instruments with the MSP430F2012TRSAR microcontroller. Designed for a wide range of applications, this high-quality product offers customers unmatched value and benefits. With features like low power mode, multiple peripherals, and connectivity options, this microcontroller provides superior performance in a compact package. Trust Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and protection for the microcontroller, ensuring a longer lifespan.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltage, making it versatile for different applications.

CPU Family: MSP430

Part of the MSP430 family known for low power consumption and high performance, making it an efficient choice.

ADC Channels: YES

Integrated analog to digital converters provide flexibility for interfacing with sensors and other analog devices.

Peripherals: BOD, TIMER(2), WDT

Comes with essential peripherals like brown-out detection, timers, and watchdog timer for enhanced functionality.

Connectivity: I2C, SPI, USI

Supports popular communication interfaces like I2C, SPI, and USI, enabling easy integration with other devices.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and fast updates to the program code without the need for a separate programmer.

Low Power Mode: YES

Includes low power modes to minimize power consumption, making it suitable for battery-powered applications and energy-efficient designs.

Technical Specifications

Microcontrollers MSP430F2012TRSAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 1.8 V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of I/O Lines:

10

No. of Serial I/Os:

0

No. of Terminals:

16

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, USI"

Peripherals:

"BOD, TIMER(2), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430F2012TRSAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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