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MSP430F2012IRSAT

Texas Instruments

MSP430F2012IRSAT by Texas Instruments

MSP430F2012IRSAT by Texas Instruments is a 16-bit microcontroller with 2048 ROM words, 128 RAM bytes, and 8 ADC channels. Ideal for industrial applications, it operates at up to 16 MHz with low power mode and features peripherals like BOD, TIMER(2), WDT.

Median Price

$2.052

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 430 parts In-Stock

1+ parts

$1.010

100+ parts

$0.990

1k+ parts

$0.970

10k+ parts

-

430

$1.010

$0.990

$0.970

-

Farnell

UK . 4 parts In-Stock

1+ parts

$1.430

100+ parts

$0.959

1k+ parts

$0.930

10k+ parts

$0.779

4

$1.430

$0.959

$0.930

$0.779

Texas Instruments

USA . 2,440 parts In-Stock

1+ parts

$2.408

100+ parts

$1.989

1k+ parts

$1.075

10k+ parts

-

2,440

$2.408

$1.989

$1.075

-

DigiKey

USA . 400 parts In-Stock

1+ parts

$3.180

100+ parts

$1.967

1k+ parts

$1.769

10k+ parts

$1.694

400

$3.180

$1.967

$1.769

$1.694

Mouser Electronics

USA . 223 parts In-Stock

1+ parts

$3.180

100+ parts

$1.970

1k+ parts

$1.690

10k+ parts

$1.670

223

$3.180

$1.970

$1.690

$1.670

Arrow

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.696

10k+ parts

$1.556

250

-

-

$1.696

$1.556

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,825 parts In-Stock

1+ parts

$0.960

100+ parts

-

1k+ parts

-

10k+ parts

-

1,825

$0.960

-

-

-

Chip Stock

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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7,000

-

-

-

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Vyrian

USA . 3,624 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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3,624

-

-

-

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Bristol Electronics

USA . 342 parts In-Stock

1+ parts

-

100+ parts

-

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342

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-

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-

ACDS - Activité Composants Distribution Service

France . 225 parts In-Stock

1+ parts

-

100+ parts

-

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225

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Dan-Mar Components

USA . 225 parts In-Stock

1+ parts

-

100+ parts

-

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225

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Prism Electronics

USA . 53 parts In-Stock

1+ parts

-

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-

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53

-

-

-

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Sensible Micro Corp

USA . 32 parts In-Stock

1+ parts

-

100+ parts

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32

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Cyclops Electronics Ltd

UK . 16 parts In-Stock

1+ parts

-

100+ parts

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16

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Technoshack Inc.

Canada . 5 parts In-Stock

1+ parts

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,809 parts In-Stock

1+ parts

$0.909

100+ parts

-

1k+ parts

-

10k+ parts

-

1,809

$0.909

-

-

-

Component Stockers USA

USA . 461 parts In-Stock

1+ parts

$2.820

100+ parts

$2.070

1k+ parts

-

10k+ parts

-

461

$2.820

$2.070

-

-

Parana Technologies

USA . 1,163 parts In-Stock

1+ parts

$49.485

100+ parts

-

1k+ parts

-

10k+ parts

-

1,163

$49.485

-

-

-

DigiPath Technology Company

USA . 1,257 parts In-Stock

1+ parts

$54.489

100+ parts

$50.130

1k+ parts

-

10k+ parts

-

1,257

$54.489

$50.130

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ChromeModa Solutions

Germany . 6,361 parts In-Stock

1+ parts

$55.601

100+ parts

$45.593

1k+ parts

-

10k+ parts

-

6,361

$55.601

$45.593

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IDEA Electronic Components Group

UK . 950 parts In-Stock

1+ parts

$55.601

100+ parts

$52.821

1k+ parts

$50.041

10k+ parts

-

950

$55.601

$52.821

$50.041

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

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500

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Glotronic Ltd.

UK . 190 parts In-Stock

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190

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Overview

Enhance your projects with the Texas Instruments MSP430F2012IRSAT microcontroller, a top-notch solution for all your embedded system needs. Crafted with precision and expertise by Texas Instruments, this microcontroller offers unmatched reliability and performance. Ideal for a wide range of applications, from IoT devices to industrial automation, the MSP430F2012IRSAT provides value through its low power consumption, high efficiency, and innovative features. Elevate your designs and unleash the full potential of your creations with the MSP430F2012IRSAT microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and resources.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile and compatible with different power sources.

On Chip Data RAM Width: 8

Ample on-chip data RAM width allows for efficient data processing and storage capabilities.

Package Shape: SQUARE

Square package shape helps optimize space utilization on the PCB, especially in compact designs.

Bit Size: 16

With a 16-bit architecture, the microcontroller can handle complex operations and calculations effectively.

Power Supplies (V): 2/3.3

Supports dual power supply options for flexibility in voltage requirements and compatibility with different systems.

No. of Terminals: 16

Sufficient number of terminals for easy connectivity and interfacing with external components.

Minimum Supply Voltage: 1.8 V

Allows for operation at low power supply voltages, enhancing energy efficiency and battery life.

ADC Channels: YES

Integrated analog-to-digital converters enable the microcontroller to process analog signals accurately.

ROM Words: 2048

Large programmable ROM capacity provides ample space for storing program instructions and data.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient instruction execution and performance for embedded applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Analog To Digital Convertors: 8-Ch 10-Bit

Multiple ADC channels with high resolution allow for precise conversion of analog signals into digital data.

PWM Channels: YES

Pulse-width modulation capability enables the microcontroller to control analog devices and motors with varying duty cycles.

Connectivity: I2C, SPI, USI

Support for popular communication protocols enhances the microcontroller's compatibility with other devices and peripherals.

ROM Programmability: FLASH

Flash programmable memory enables easy and quick reprogramming of the microcontroller for firmware updates and customization.

Technical Specifications

Microcontrollers MSP430F2012IRSAT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 1.8 V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of I/O Lines:

10

No. of Serial I/Os:

0

No. of Terminals:

16

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, USI"

Peripherals:

"BOD, TIMER(2), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430F2012IRSAT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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