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MSP430F2012IN

Texas Instruments

MSP430F2012IN by Texas Instruments

MSP430F2012IN by Texas Instruments is a 16-bit microcontroller with 2048 ROM words, 128 RAM bytes, and 8 ADC channels. Ideal for industrial applications, it offers low power mode, connectivity via I2C/SPI/USI, and peripherals like BOD and timers. Operating at up to 16 MHz with a supply voltage range of 1.8-3.6 V, it suits various embedded systems requiring efficient processing capabilities.

Median Price

$1.705

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 300 parts In-Stock

1+ parts

$1.640

100+ parts

$1.160

1k+ parts

$0.813

10k+ parts

$0.779

300

$1.640

$1.160

$0.813

$0.779

RS (Exports)

UK . 4 parts In-Stock

1+ parts

$1.770

100+ parts

$1.230

1k+ parts

$1.160

10k+ parts

-

4

$1.770

$1.230

$1.160

-

Chip1Stop

Japan . 156 parts In-Stock

1+ parts

$2.000

100+ parts

$1.390

1k+ parts

-

10k+ parts

-

156

$2.000

$1.390

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-

Texas Instruments

USA . 5,905 parts In-Stock

1+ parts

$2.007

100+ parts

$1.658

1k+ parts

$0.896

10k+ parts

-

5,905

$2.007

$1.658

$0.896

-

Rochester

USA . 4,759 parts In-Stock

1+ parts

-

100+ parts

$1.420

1k+ parts

$1.270

10k+ parts

$1.190

4,759

-

$1.420

$1.270

$1.190

DigiKey

USA . 4,759 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.860

10k+ parts

-

4,759

-

-

$1.860

-

Verical

USA . 3,713 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.587

10k+ parts

$1.488

3,713

-

-

$1.587

$1.488

Arrow

USA . 1,075 parts In-Stock

1+ parts

-

100+ parts

$1.569

1k+ parts

$1.391

10k+ parts

$1.320

1,075

-

$1.569

$1.391

$1.320

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,566 parts In-Stock

1+ parts

$1.302

100+ parts

-

1k+ parts

-

10k+ parts

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3,566

$1.302

-

-

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Vyrian

USA . 4,939 parts In-Stock

1+ parts

-

100+ parts

-

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4,939

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-

-

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DigiKey Marketplace

USA . 4,759 parts In-Stock

1+ parts

-

100+ parts

$1.290

1k+ parts

-

10k+ parts

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4,759

-

$1.290

-

-

Connector Distribution Corp

USA . 45 parts In-Stock

1+ parts

-

100+ parts

-

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45

-

-

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Right Parts Inc.

USA . 45 parts In-Stock

1+ parts

-

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45

-

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First Choice Components Inc.

USA . 9 parts In-Stock

1+ parts

-

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9

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Resion

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,522 parts In-Stock

1+ parts

$1.233

100+ parts

-

1k+ parts

-

10k+ parts

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4,522

$1.233

-

-

-

Continental Prestige Electronics

USA . 16 parts In-Stock

1+ parts

$1.710

100+ parts

$1.230

1k+ parts

$0.840

10k+ parts

-

16

$1.710

$1.230

$0.840

-

Microchip USA

USA . 1,402 parts In-Stock

1+ parts

$8.385

100+ parts

-

1k+ parts

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10k+ parts

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1,402

$8.385

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Parana Technologies

USA . 2,171 parts In-Stock

1+ parts

$33.365

100+ parts

-

1k+ parts

$123.862

10k+ parts

-

2,171

$33.365

-

$123.862

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ChromeModa Solutions

Germany . 4,309 parts In-Stock

1+ parts

$37.489

100+ parts

$30.741

1k+ parts

-

10k+ parts

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4,309

$37.489

$30.741

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IDEA Electronic Components Group

UK . 1,511 parts In-Stock

1+ parts

$37.489

100+ parts

$35.615

1k+ parts

$33.740

10k+ parts

-

1,511

$37.489

$35.615

$33.740

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Perfect Parts

USA . 3,529 parts In-Stock

1+ parts

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3,529

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DigiPath Technology Company

USA . 2,262 parts In-Stock

1+ parts

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100+ parts

$33.800

1k+ parts

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2,262

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$33.800

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iodParts Technologies Inc.

India . 125 parts In-Stock

1+ parts

-

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125

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F2012IN microcontroller. Designed with precision and quality in mind, this versatile device offers endless possibilities for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers unmatched performance and reliability. With low power consumption and advanced features like ADC channels and PWM channels, the MSP430F2012IN is the perfect choice for your next project. Experience the value and benefits that Texas Instruments brings to the table with this cutting-edge microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for a variety of applications while ensuring longevity.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of supply voltage compatibility, making the microcontroller versatile in different power supply scenarios.

ROM Programmability: FLASH

The flash programmability of the ROM allows for easy updates and modifications to the firmware, giving flexibility and ease of use.

Analog To Digital Convertors: 8-Ch 10-Bit

Having 8 channels with 10-bit resolution provides accurate and reliable analog to digital conversion, essential for many applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller is based on RISC architecture, providing efficient processing power and execution speed for various tasks.

Maximum Clock Frequency: 16 MHz

With a high clock frequency, the microcontroller can handle demanding operations and data processing effectively and efficiently.

No. of I/O Lines: 10

Having 10 I/O lines allows for versatile connectivity and interaction with external devices, expanding the capabilities of the microcontroller.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes the microcontroller suitable for use in harsh environments or varying temperature conditions.

Maximum Operating Temperature: 85 °C

Operating efficiently at high temperatures enables the microcontroller to be used in industrial applications where heat resistance is crucial.

Technical Specifications

Microcontrollers MSP430F2012IN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 1.8 V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.305 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of I/O Lines:

10

No. of Serial I/Os:

0

No. of Terminals:

14

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

5.08 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, USI"

Peripherals:

"BOD, TIMER(2), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430F2012IN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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