Loading...

MSP430F2011IPW

Texas Instruments

MSP430F2011IPW by Texas Instruments

MSP430F2011IPW by Texas Instruments is a 16-bit microcontroller with 2048 ROM words and 128 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption. With peripherals like BOD, comparator(8), and timer(2), it offers versatile functionality in a compact package style.

Median Price

$1.171

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 7 parts In-Stock

1+ parts

$0.129

100+ parts

-

1k+ parts

-

10k+ parts

-

7

$0.129

-

-

-

Chip1Stop

Japan . 200 parts In-Stock

1+ parts

$0.761

100+ parts

$0.627

1k+ parts

-

10k+ parts

-

200

$0.761

$0.627

-

-

Texas Instruments

USA . 2,878 parts In-Stock

1+ parts

$1.709

100+ parts

$1.412

1k+ parts

$0.763

10k+ parts

-

2,878

$1.709

$1.412

$0.763

-

DigiKey

USA . 28 parts In-Stock

1+ parts

$2.340

100+ parts

$1.430

1k+ parts

$1.287

10k+ parts

$1.186

28

$2.340

$1.430

$1.287

$1.186

Mouser Electronics

USA . 21 parts In-Stock

1+ parts

$2.340

100+ parts

$1.360

1k+ parts

$1.280

10k+ parts

$1.180

21

$2.340

$1.360

$1.280

$1.180

Avnet

USA . 806 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.852

10k+ parts

$0.786

806

-

-

$0.852

$0.786

Rochester

USA . 221 parts In-Stock

1+ parts

-

100+ parts

$1.490

1k+ parts

$1.240

10k+ parts

$1.100

221

-

$1.490

$1.240

$1.100

Verical

USA . 17 parts In-Stock

1+ parts

-

100+ parts

$0.674

1k+ parts

$0.674

10k+ parts

$0.674

17

-

$0.674

$0.674

$0.674

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,242 parts In-Stock

1+ parts

$0.391

100+ parts

-

1k+ parts

-

10k+ parts

-

1,242

$0.391

-

-

-

TME

Poland . 87 parts In-Stock

1+ parts

$2.130

100+ parts

$1.270

1k+ parts

$1.210

10k+ parts

-

87

$2.130

$1.270

$1.210

-

Chip Stock

USA . 43,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

43,500

-

-

-

-

Vyrian

USA . 4,088 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,088

-

-

-

-

Sensible Micro Corp

USA . 1,635 parts In-Stock

1+ parts

-

100+ parts

$0.556

1k+ parts

$0.513

10k+ parts

-

1,635

-

$0.556

$0.513

-

Elcom Components

USA . 280 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

280

-

-

-

-

LIBRA Elektronik GmbH

Germany . 92 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

92

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,562 parts In-Stock

1+ parts

$0.371

100+ parts

-

1k+ parts

-

10k+ parts

-

1,562

$0.371

-

-

-

Parana Technologies

USA . 2,103 parts In-Stock

1+ parts

$59.596

100+ parts

$5,534.409

1k+ parts

$53.637

10k+ parts

-

2,103

$59.596

$5,534.409

$53.637

-

DigiPath Technology Company

USA . 215 parts In-Stock

1+ parts

$65.623

100+ parts

-

1k+ parts

-

10k+ parts

-

215

$65.623

-

-

-

ChromeModa Solutions

Germany . 4,314 parts In-Stock

1+ parts

$66.962

100+ parts

$54.909

1k+ parts

-

10k+ parts

-

4,314

$66.962

$54.909

-

-

IDEA Electronic Components Group

UK . 431 parts In-Stock

1+ parts

$66.962

100+ parts

$63.614

1k+ parts

$60.266

10k+ parts

-

431

$66.962

$63.614

$60.266

-

Kepictronics

USA . 7,099 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,099

-

-

-

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

iodParts Technologies Inc.

India . 450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

450

-

-

-

-

Overview

Looking for a reliable microcontroller for your project? Look no further than the MSP430F2011IPW by Texas Instruments. With a reputation for high-quality products, Texas Instruments delivers excellence in every aspect. The MSP430F2011IPW offers unmatched value with its versatile applications in various industries. From low power mode to multiple peripherals like BOD and timers, this microcontroller provides the performance you need. Trust Texas Instruments for cutting-edge technology and innovation that will take your project to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, saving time and cost.

Maximum Supply Voltage: 3.6 V

Supports a wide range of power supply voltages, increasing compatibility with various systems.

On Chip Data RAM Width: 8

8-bit data RAM width provides sufficient memory for various data processing tasks.

Package Shape: RECTANGULAR

Rectangular package shape is space-efficient and fits well in compact electronic devices.

Bit Size: 16

16-bit processing capability allows for complex computations and high performance.

Power Supplies (V): 2/3.3

Supports multiple power supply options, offering flexibility in power management.

No. of Terminals: 14

Sufficient terminals for connecting to various external components and peripherals.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style saves space on the PCB and enables slim device designs.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage for energy-efficient operation and extended battery life.

Maximum Operating Temperature: 85 °C

Wide temperature range support makes the product suitable for industrial applications.

CPU Family: MSP430

Belonging to the MSP430 family ensures high performance, reliability, and compatibility with existing systems.

Minimum Operating Temperature: -40 °C

Operational at low temperatures, making it suitable for harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish ensures reliable connections and resistance to corrosion.

Terminal Position: DUAL

Dual terminal position for stability and improved signal integrity.

ROM Words: 2048

Ample ROM storage capacity for storing program instructions and data.

Maximum Seated Height: 1.2 mm

Low profile design for space-constrained applications.

RAM Words: 0.125

Sufficient RAM capacity for buffering and temporary data storage.

Width: 4.4 mm

Narrow width for compact device designs.

Boundary Scan: YES

Boundary scan capability for efficient testing and debugging during manufacturing.

Peripherals: BOD, COMPARATOR(8), TIMER(2), WDT

Diverse set of peripherals for enhanced functionality and connectivity.

Maximum Clock Frequency: 16 MHz

High clock frequency for fast processing and response times.

Peak Reflow Temperature °C: 260

Supports high-temperature reflow soldering processes for reliable assembly.

Length: 5 mm

Compact length for space-efficient PCB layout.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range support for reliability in harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient data processing and control.

No. of Timers: 2

Multiple timer channels for accurate timing and scheduling tasks.

RAM Bytes: 128

Sufficient RAM storage for data manipulation and processing.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for reliable solder joints and mechanical strength.

Maximum Supply Current: 0.37 mA

Low supply current consumption for energy-efficient operation.

Nominal Supply Voltage: 2.2 V

Stable nominal supply voltage for consistent performance.

PWM Channels: YES

PWM channels for precise control of connected devices.

ROM Programmability: FLASH

Flash ROM programmability for easy firmware updates and customization.

Terminal Pitch: 0.65 mm

Narrow terminal pitch for high-density PCB layouts.

Format: FIXED POINT

Fixed-point format for efficient arithmetic operations and numerical precision.

Speed: 16 rpm

High processing speed for real-time applications and responsive performance.

Low Power Mode: YES

Low power mode for energy-saving operation and extended battery life.

On Chip Program ROM Width: 8

On-chip program ROM width of 8 bits for storing program instructions.

No. of I/O Lines: 10

Sufficient I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers MSP430F2011IPW attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

IT ALSO OPERATES AT 1.8 V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of I/O Lines:

10

No. of Serial I/Os:

0

No. of Terminals:

14

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

"BOD, COMPARATOR(8), TIMER(2), WDT"

Trade Compliance

MSP430F2011IPW Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20