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MSP430F2001TRSAT

Texas Instruments

MSP430F2001TRSAT by Texas Instruments

MSP430F2001TRSAT by Texas Instruments is a 16-bit microcontroller with 1024 ROM words and 128 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption. Features include 2 timers, PWM channels, and peripherals like BOD and comparators.

Median Price

$1.350

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,245 parts In-Stock

1+ parts

$1.492

100+ parts

$1.232

1k+ parts

$0.666

10k+ parts

-

3,245

$1.492

$1.232

$0.666

-

Mouser Electronics

USA . 11 parts In-Stock

1+ parts

$3.210

100+ parts

$1.650

1k+ parts

$1.110

10k+ parts

$1.060

11

$3.210

$1.650

$1.110

$1.060

DigiKey

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.133

10k+ parts

-

500

-

-

$1.133

-

Rochester

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$1.300

1k+ parts

$1.080

10k+ parts

$0.962

250

-

$1.300

$1.080

$0.962

Verical

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.350

10k+ parts

$1.202

250

-

-

$1.350

$1.202

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 320 parts In-Stock

1+ parts

$0.879

100+ parts

-

1k+ parts

-

10k+ parts

-

320

$0.879

-

-

-

Chip Stock

USA . 17,050 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17,050

-

-

-

-

Vyrian

USA . 2,789 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,789

-

-

-

-

ComSIT Distribution GmbH

Germany . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

750

-

-

-

-

ComSIT USA

USA . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

750

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

250

-

-

-

-

Bristol Electronics

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$1.307

1k+ parts

$0.784

10k+ parts

-

250

-

$1.307

$0.784

-

Dan-Mar Components

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

250

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,962 parts In-Stock

1+ parts

$0.832

100+ parts

-

1k+ parts

-

10k+ parts

-

3,962

$0.832

-

-

-

Parana Technologies

USA . 65 parts In-Stock

1+ parts

$25.603

100+ parts

-

1k+ parts

$26.216

10k+ parts

-

65

$25.603

-

$26.216

-

DigiPath Technology Company

USA . 2,307 parts In-Stock

1+ parts

$28.192

100+ parts

$25.936

1k+ parts

-

10k+ parts

-

2,307

$28.192

$25.936

-

-

IDEA Electronic Components Group

UK . 508 parts In-Stock

1+ parts

$28.767

100+ parts

$27.329

1k+ parts

$25.890

10k+ parts

-

508

$28.767

$27.329

$25.890

-

ChromeModa Solutions

Germany . 325 parts In-Stock

1+ parts

$28.767

100+ parts

$23.589

1k+ parts

-

10k+ parts

-

325

$28.767

$23.589

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Perfect Parts

USA . 656 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

656

-

-

-

-

Overview

Discover the power and efficiency of the Texas Instruments MSP430F2001TRSAT microcontroller! Designed with cutting-edge technology and a commitment to quality, this device offers unparalleled performance in a compact package. Ideal for a wide range of applications, from consumer electronics to industrial automation, this microcontroller delivers reliable operation and versatile functionality. Experience the value and benefits of Texas Instruments' expertise with the MSP430F2001TRSAT, providing customers with a competitive edge in their projects. Upgrade your designs today with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and durable, suitable for portable and rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly processes, saving time and cost during production.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6 V provides flexibility in power supply options for the microcontroller, making it compatible with a wide range of systems.

On Chip Data RAM Width: 8

Having a wide on-chip data RAM width of 8 bits allows for efficient data processing and storage capabilities within the microcontroller.

Package Shape: SQUARE

The square package shape provides a compact form factor, saving space on the PCB and enabling efficient design layouts.

Bit Size: 16

With a bit size of 16, this microcontroller offers enhanced processing power and performance for handling complex tasks and computations.

Power Supplies (V): 2/3.3

The availability of multiple power supply options at 2V and 3.3V ensures compatibility with different voltage requirements in various applications.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options for interfacing with external components and peripherals, enhancing the versatility of the microcontroller.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles allows for efficient heat dissipation, space-saving design, and compatibility with various mounting options.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage of 1.8V enables energy-efficient operation and extends battery life in power-constrained applications.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, the microcontroller can withstand elevated temperatures, making it suitable for industrial applications with harsh environmental conditions.

CPU Family: MSP430

Being part of the MSP430 CPU family signifies reliability, performance, and compatibility with a range of development tools and software, making it a popular choice among developers.

Minimum Operating Temperature: -40 °C

The wide operating temperature range starting from -40°C ensures reliable performance in extreme cold conditions, making it suitable for a variety of environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish with nickel/palladium/gold provides excellent corrosion resistance, ensuring long-term reliability and robustness in challenging operating environments.

Terminal Position: QUAD

The quad terminal position facilitates easy soldering and mounting on the PCB, enabling efficient assembly processes during production.

ROM Words: 1024

The large ROM capacity of 1024 words allows for storing program instructions and data, enabling the microcontroller to execute a wide range of tasks and applications.

Maximum Seated Height: 1 mm

With a low maximum seated height of 1mm, the microcontroller saves space on the PCB and enables compact and slim device designs.

RAM Words: 0.125

Although small in capacity, the RAM words of 0.125 provide temporary storage for critical data during processing, enhancing the overall functionality of the microcontroller.

Width: 4 mm

The compact width of 4mm allows for efficient PCB layout designs and space-saving integration in various electronic devices.

Boundary Scan: YES

Having boundary scan capability enables easy debugging, testing, and verification of the microcontroller's connections and functionality, simplifying the development and troubleshooting process.

Peripherals: BOD, COMPARATOR(8), TIMER(2), WDT

The inclusion of various peripherals such as Brownout Detector (BOD), 8 comparators, 2 timers, and Watchdog Timer (WDT) enhances the functionality and versatility of the microcontroller for diverse applications.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency of 16 MHz allows for fast and efficient processing of instructions, making the microcontroller suitable for applications that require quick response times.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the microcontroller can withstand high-temperature soldering processes during assembly, ensuring reliable and robust connections.

Length: 4 mm

The compact length of 4mm contributes to the overall small form factor of the microcontroller, allowing for a space-efficient design in electronic devices.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades signifies the robustness and reliability of the microcontroller for operation in demanding industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC-based microcontroller, it offers efficient instruction execution and reduced power consumption, making it ideal for applications requiring high performance and low energy consumption.

No. of Timers: 2

Having 2 timers provides additional timing and control capabilities for managing various tasks and processes within the microcontroller, enhancing its overall functionality.

RAM Bytes: 128

The 128 bytes of RAM capacity allow for storing and accessing temporary data during operation, providing essential memory resources for efficient data processing.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with modern integrated circuits, making the microcontroller energy-efficient and reliable.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the soldering and mounting process, reducing assembly complexity and ensuring secure connections for reliable operation.

Maximum Supply Current: 0.37 mA

The low maximum supply current of 0.37 mA indicates energy-efficient operation, making the microcontroller suitable for battery-powered applications that require minimal power consumption.

Nominal Supply Voltage: 2.2 V

The nominal supply voltage of 2.2V strikes a balance between performance and power efficiency, offering stable operation and compatibility with a wide range of voltage sources.

PWM Channels: YES

The presence of PWM channels enables precise control of analog signals, allowing for applications such as motor control, LED dimming, and audio modulation with enhanced accuracy.

ROM Programmability: FLASH

Utilizing flash ROM for programmability allows for easy and efficient updating of firmware and software applications, enabling flexibility and adaptability in the microcontroller's functionality.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm facilitates high-density mounting on the PCB, enabling compact and space-efficient designs in electronic systems.

Format: FIXED POINT

Operating in fixed-point format simplifies arithmetic operations and reduces computational overhead, making the microcontroller efficient for tasks requiring integer-based calculations.

Moisture Sensitivity Level (MSL): 2

Having a moisture sensitivity level of 2 ensures proper handling and storage requirements to prevent moisture-related damage during assembly and operation, maintaining the reliability of the microcontroller.

Speed: 16 rpm

With a speed rating of 16 rpm, the microcontroller offers fast and responsive performance for time-critical applications, enhancing overall efficiency and effectiveness.

Low Power Mode: YES

The availability of a low power mode allows for energy-efficient operation during idle or standby periods, prolonging battery life and reducing overall power consumption in the application.

On Chip Program ROM Width: 8

The on-chip program ROM width of 8 bits provides sufficient storage capacity for program instructions, enhancing the microcontroller's processing capabilities and versatility in executing tasks.

Technical Specifications

Microcontrollers MSP430F2001TRSAT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

IT ALSO OPERATES AT 1.8 V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of I/O Lines:

10

No. of Serial I/Os:

0

No. of Terminals:

16

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

1024

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.37 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

"BOD, COMPARATOR(8), TIMER(2), WDT"

Trade Compliance

MSP430F2001TRSAT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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