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MSP430F168IPMR

Texas Instruments

MSP430F168IPMR by Texas Instruments

MSP430F168IPMR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 8 MHz. It features 2 DAC and 8 ADC channels, suitable for industrial applications requiring low power consumption and high-speed connectivity via I2C, SPI, UART, and USART interfaces.

Median Price

$11.394

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 12,794 parts In-Stock

1+ parts

$11.394

100+ parts

$9.953

1k+ parts

$6.864

10k+ parts

-

12,794

$11.394

$9.953

$6.864

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,464 parts In-Stock

1+ parts

$10.824

100+ parts

-

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2,464

$10.824

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Chip Stock

USA . 18,500 parts In-Stock

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18,500

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Vyrian

USA . 6,896 parts In-Stock

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6,896

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Cyclops Electronics Ltd

UK . 2 parts In-Stock

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-

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2

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Distributors (Availability)

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Ampacity Inc.

Singapore . 12,394 parts In-Stock

1+ parts

$9.680

100+ parts

-

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12,394

$9.680

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Corphita

USA . 3,389 parts In-Stock

1+ parts

$10.255

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3,389

$10.255

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AZTECH Wire

Italy . 375 parts In-Stock

1+ parts

$15.980

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375

$15.980

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Microchip USA

USA . 2,607 parts In-Stock

1+ parts

$25.820

100+ parts

$25.450

1k+ parts

$25.260

10k+ parts

$25.080

2,607

$25.820

$25.450

$25.260

$25.080

Parana Technologies

USA . 2,161 parts In-Stock

1+ parts

$73.850

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-

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2,161

$73.850

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DigiPath Technology Company

USA . 1,991 parts In-Stock

1+ parts

$81.318

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1,991

$81.318

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ChromeModa Solutions

Germany . 5,617 parts In-Stock

1+ parts

$82.978

100+ parts

$68.042

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5,617

$82.978

$68.042

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IDEA Electronic Components Group

UK . 902 parts In-Stock

1+ parts

$82.978

100+ parts

$78.829

1k+ parts

$74.680

10k+ parts

-

902

$82.978

$78.829

$74.680

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GreenTree Electronics

Israel . 26,000 parts In-Stock

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26,000

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A-Z Elektronik GmbH

Germany . 5,588 parts In-Stock

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5,588

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Lixinc

USA . 1,271 parts In-Stock

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1,271

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Kepictronics

USA . 170 parts In-Stock

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170

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F168IPMR microcontroller. Built with superior quality and reliability, this device offers a wide range of applications in various industries. With advanced features like low power mode, multiple connectivity options, and high-speed performance, the MSP430F168IPMR delivers exceptional value to customers seeking efficient and innovative solutions. Trust in Texas Instruments to provide top-notch technology that empowers your projects to reach new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, making it suitable for a variety of applications.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with different systems.

Bit Size: 16

16-bit architecture allows for higher precision and processing capabilities compared to lower bit sizes, making it suitable for complex tasks.

ADC Channels: YES

Having Analog to Digital Converter channels allows the microcontroller to interface with analog sensors and signals, increasing its versatility.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC (Reduced Instruction Set Computing) microcontroller offers efficient and fast execution of instructions, making it suitable for high-performance applications.

Maximum Clock Frequency: 8 MHz

With a maximum clock frequency of 8 MHz, this microcontroller can handle tasks requiring faster processing speeds.

Connectivity: I2C, SPI(2), UART(2), USART(2)

Multiple connectivity options like I2C, SPI, UART, and USART allow for easy communication with other devices, expanding the capabilities of the microcontroller.

Technical Specifications

Microcontrollers MSP430F168IPMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

2

ROM Words:

49152

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI(2), UART(2), USART(2)"

Peripherals:

"COMPARATOR, DMA(3), TIMER(6), WDT"

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F168IPMR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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