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MSP430F1611IRTDR

Texas Instruments

MSP430F1611IRTDR by Texas Instruments

MSP430F1611IRTDR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 8 MHz. It features 10KB RAM, 49408 ROM words, and connectivity options like I2C and UART. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$16.554

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13,975 parts In-Stock

1+ parts

$15.896

100+ parts

$13.885

1k+ parts

$9.576

10k+ parts

-

13,975

$15.896

$13.885

$9.576

-

Rochester

USA . 147 parts In-Stock

1+ parts

-

100+ parts

$13.770

1k+ parts

$12.320

10k+ parts

$11.590

147

-

$13.770

$12.320

$11.590

DigiKey

USA . 147 parts In-Stock

1+ parts

-

100+ parts

$18.110

1k+ parts

-

10k+ parts

-

147

-

$18.110

-

-

Verical

USA . 147 parts In-Stock

1+ parts

-

100+ parts

$17.212

1k+ parts

$15.400

10k+ parts

$14.488

147

-

$17.212

$15.400

$14.488

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,195 parts In-Stock

1+ parts

$12.635

100+ parts

-

1k+ parts

-

10k+ parts

-

3,195

$12.635

-

-

-

Vyrian

USA . 6,633 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,633

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,570 parts In-Stock

1+ parts

$11.970

100+ parts

-

1k+ parts

-

10k+ parts

-

4,570

$11.970

-

-

-

Microchip USA

USA . 1,937 parts In-Stock

1+ parts

$34.660

100+ parts

$34.170

1k+ parts

$33.920

10k+ parts

$33.670

1,937

$34.660

$34.170

$33.920

$33.670

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$52.490

100+ parts

$47.766

1k+ parts

$43.042

10k+ parts

-

600

$52.490

$47.766

$43.042

-

Parana Technologies

USA . 161 parts In-Stock

1+ parts

$65.632

100+ parts

$6,094.942

1k+ parts

$59.069

10k+ parts

-

161

$65.632

$6,094.942

$59.069

-

DigiPath Technology Company

USA . 1,159 parts In-Stock

1+ parts

$72.269

100+ parts

-

1k+ parts

-

10k+ parts

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1,159

$72.269

-

-

-

IDEA Electronic Components Group

UK . 1,808 parts In-Stock

1+ parts

$73.744

100+ parts

$70.057

1k+ parts

$66.370

10k+ parts

-

1,808

$73.744

$70.057

$66.370

-

ChromeModa Solutions

Germany . 1,047 parts In-Stock

1+ parts

$73.744

100+ parts

$60.470

1k+ parts

-

10k+ parts

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1,047

$73.744

$60.470

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 23,339 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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23,339

-

-

-

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A-Z Elektronik GmbH

Germany . 6,780 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,780

-

-

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Kepictronics

USA . 1,368 parts In-Stock

1+ parts

-

100+ parts

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1,368

-

-

-

-

Futuretech Components

Singapore . 834 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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834

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-

Overview

Unlock the power of innovation with the Texas Instruments MSP430F1611IRTDR microcontroller. Built with precision and expertise, this device is perfect for a wide range of applications from industrial automation to consumer electronics. With its advanced features such as low power mode, multiple ADC channels, and connectivity options like I2C and SPI, this microcontroller offers unmatched value and performance. Trust in Texas Instruments to deliver cutting-edge technology that will take your project to the next level. Experience the quality and reliability that only TI can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring longevity and reliability.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options, accommodating a wide range of applications.

Bit Size: 16

A 16-bit architecture offers higher precision and processing capabilities compared to lower bit sizes, making this microcontroller suitable for complex tasks.

DAC Channels: YES

Digital-to-Analog Converters allow the microcontroller to interface with analog components, expanding its versatility in controlling external devices.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances performance by simplifying instruction sets and improving execution speed, making this microcontroller efficient for various applications.

No. of Timers: 6

Having 6 timers provides ample timing resources for scheduling tasks, events, and communication protocols, enhancing the functionality of the microcontroller.

Connectivity: I2C, SPI(2), UART(2), USART(2)

Multiple communication interfaces allow seamless connectivity with external devices, enabling the microcontroller to easily exchange data and commands.

Low Power Mode: YES

The availability of low power mode helps in conserving energy and extending battery life, making this microcontroller suitable for applications requiring power efficiency.

Technical Specifications

Microcontrollers MSP430F1611IRTDR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

10240

RAM Words:

10

ROM Words:

49408

ROM Programmability:

FLASH

Maximum Seated Height:

.9 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI(2), UART(2), USART(2)"

Peripherals:

"COMPARATOR, DMA(3), TIMER(6), WDT"

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F1611IRTDR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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