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MSP430F157IRTDT

Texas Instruments

MSP430F157IRTDT by Texas Instruments

MSP430F157IRTDT by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 8 MHz. It features 1024 bytes of RAM, 32768 ROM words, and connectivity options like I2C, SPI, UART. Ideal for industrial applications requiring low power consumption and multiple timers/peripherals.

Median Price

$12.264

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,500 parts In-Stock

1+ parts

$11.779

100+ parts

$10.289

1k+ parts

$7.096

10k+ parts

-

3,500

$11.779

$10.289

$7.096

-

Rochester

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$10.200

1k+ parts

$9.130

10k+ parts

$8.590

1,000

-

$10.200

$9.130

$8.590

DigiKey

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$13.430

1k+ parts

-

10k+ parts

-

1,000

-

$13.430

-

-

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$12.750

1k+ parts

$11.412

10k+ parts

$10.738

1,000

-

$12.750

$11.412

$10.738

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,393 parts In-Stock

1+ parts

$9.367

100+ parts

-

1k+ parts

-

10k+ parts

-

2,393

$9.367

-

-

-

Vyrian

USA . 2,927 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,927

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 910 parts In-Stock

1+ parts

$8.874

100+ parts

-

1k+ parts

-

10k+ parts

-

910

$8.874

-

-

-

Microchip USA

USA . 2,114 parts In-Stock

1+ parts

$31.100

100+ parts

$30.660

1k+ parts

$30.440

10k+ parts

$30.220

2,114

$31.100

$30.660

$30.440

$30.220

Parana Technologies

USA . 933 parts In-Stock

1+ parts

$54.219

100+ parts

$5,035.038

1k+ parts

$48.797

10k+ parts

-

933

$54.219

$5,035.038

$48.797

-

DigiPath Technology Company

USA . 1,687 parts In-Stock

1+ parts

$59.702

100+ parts

-

1k+ parts

-

10k+ parts

-

1,687

$59.702

-

-

-

ChromeModa Solutions

Germany . 1,522 parts In-Stock

1+ parts

$60.920

100+ parts

$49.954

1k+ parts

-

10k+ parts

-

1,522

$60.920

$49.954

-

-

IDEA Electronic Components Group

UK . 150 parts In-Stock

1+ parts

$60.920

100+ parts

$57.874

1k+ parts

$54.828

10k+ parts

-

150

$60.920

$57.874

$54.828

-

QUARKTWIN TECHNOLOGY LTD

USA . 7,993 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,993

-

-

-

-

Perfect Parts

USA . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

750

-

-

-

-

Overview

Unlock the power of innovation with the MSP430F157IRTDT by Texas Instruments. Designed with precision and reliability in mind, this microcontroller offers endless possibilities for a wide range of applications. From industrial automation to consumer electronics, this versatile product provides unmatched performance and efficiency. With features like low power mode and connectivity options including I2C, SPI, UART, and USART, the MSP430F157IRTDT delivers superior value and benefits to customers looking to elevate their projects to the next level. Experience the quality and advantages that only Texas Instruments can offer in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, reducing assembly time and costs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, making it compatible with a wide range of applications.

On Chip Data RAM Width: 8

Having a wide data RAM width allows for efficient data processing and storage, enhancing the performance of the microcontroller.

Package Shape: SQUARE

The square package shape helps in optimizing PCB layout and space utilization, contributing to a more compact and efficient design.

Bit Size: 16

With a 16-bit size, the microcontroller can handle more complex computations and tasks, making it suitable for advanced applications.

DAC Channels: YES

Having DAC channels enables the microcontroller to generate analog output signals, which is essential for various control and communication functions.

Power Supplies (V): 2/3.3

Supporting multiple power supply options makes the microcontroller versatile and adaptable to different power requirements.

No. of Terminals: 64

Having a higher number of terminals provides increased connectivity options and I/O capabilities, enhancing the versatility of the microcontroller.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The different package styles offer flexibility in mounting options and thermal management, allowing for customization based on specific needs.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage helps in reducing power consumption and extending battery life in energy-efficient applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliability in harsh environments with elevated temperatures.

CPU Family: MSP430

Being part of the MSP430 CPU family indicates high performance, low power consumption, and a broad range of peripherals, making it a reliable choice for various applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the microcontroller to operate in cold environments without compromising performance.

Terminal Finish: Matte Tin (Sn)

The matte tin finish provides good conductivity and solderability, ensuring reliable connections for the microcontroller.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals into digital data, essential for sensing and measurement applications.

DMA Channels: YES

Having DMA channels allows for efficient data transfer between peripherals and memory, enhancing overall system performance.

Terminal Position: QUAD

The quad terminal position facilitates easy PCB layout and assembly, offering convenience during the manufacturing process.

ROM Words: 32768

With a large ROM word capacity, the microcontroller can store significant amounts of program code and data, enabling complex algorithms and applications to be implemented.

Maximum Seated Height: 0.9 mm

The low seated height of the package allows for slim and compact designs, valuable in space-constrained applications.

Digital To Analog Convertors: 2-Ch 12-Bit

Having two 12-bit DACs supports precise analog output generation, crucial for accurate control and signal processing tasks.

Width: 9 mm

The compact width of the microcontroller enables it to be easily integrated into size-limited devices and applications.

Boundary Scan: YES

Boundary scan capability assists in testing and debugging the microcontroller during the manufacturing and maintenance stages, ensuring high product quality and reliability.

Peripherals: COMPARATOR, DMA(3), TIMER(6), WDT

The variety of peripherals available enhances the functionality and capability of the microcontroller, enabling a wide range of applications to be supported.

Maximum Clock Frequency: 8 MHz

With a high clock frequency, the microcontroller can execute instructions quickly, enhancing overall performance in time-critical applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering during the manufacturing process, contributing to the robustness of the microcontroller.

Length: 9 mm

The length of the microcontroller complements its compact width, allowing for a space-efficient design and easy integration into various products.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification indicates that the microcontroller is suitable for operation in harsh industrial environments, ensuring reliability and longevity.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller provides high performance, power efficiency, and streamlined instruction execution, making it ideal for demanding applications.

No. of Timers: 6

The presence of six timers offers extensive timing and scheduling capabilities, essential for applications requiring precise event management.

RAM Bytes: 1024

With a decent amount of RAM, the microcontroller can efficiently handle data processing and temporary storage requirements, supporting multitasking and complex algorithms.

Technology: CMOS

The CMOS technology ensures low power consumption and high noise immunity, contributing to energy efficiency and reliable operation of the microcontroller.

Terminal Form: NO LEAD

The no-lead terminal form simplifies PCB assembly and reduces manufacturing costs, offering a more environmentally friendly option compared to traditional leaded components.

Analog To Digital Convertors: 8-Ch 12-Bit

Having eight 12-bit ADCs allows for high-precision analog signal acquisition, crucial for applications requiring accurate sensor data conversion.

Maximum Supply Current: 0.6 mA

The low maximum supply current indicates power efficiency, making the microcontroller suitable for battery-powered or energy-conscious applications.

Nominal Supply Voltage: 2.2 V

The nominal supply voltage provides a balance between power consumption and performance, making the microcontroller suitable for a wide range of applications.

No. of DMA Channels: 3

Having three DMA channels enables efficient data transfers and offloads the CPU, enhancing overall system performance and responsiveness.

No. of Serial I/Os: 2

The presence of two serial I/O interfaces allows for easy communication and connectivity with external devices, expanding the microcontroller's versatility.

PWM Channels: YES

Having PWM channels enables the microcontroller to generate precise and adjustable pulse-width modulation signals, essential for motor control and analog signal generation.

Connectivity: I2C, SPI, UART, USART

Support for various communication interfaces enhances the connectivity options of the microcontroller, facilitating integration with a wide range of external devices and sensors.

ROM Programmability: FLASH

Being programmable with flash memory allows for easy updates and modifications to the microcontroller's firmware, ensuring flexibility and scalability in applications.

Terminal Pitch: 0.5 mm

The fine terminal pitch facilitates high-density PCB layout and assembly, enabling compact and space-efficient designs to be realized with the microcontroller.

Format: FIXED POINT

Being in fixed-point format simplifies arithmetic operations and enhances computational efficiency, making the microcontroller suitable for real-time signal processing and control applications.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the microcontroller's resistance to moisture sensitivity during storage and handling, ensuring product reliability and longevity.

Technical Specifications

Microcontrollers MSP430F157IRTDT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

.9 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, UART, USART"

Peripherals:

"COMPARATOR, DMA(3), TIMER(6), WDT"

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F157IRTDT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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