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MSP430F155IRTDT

Texas Instruments

MSP430F155IRTDT by Texas Instruments

MSP430F155IRTDT by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at a max frequency of 8 MHz. It features 2 DAC and ADC channels, along with 3 DMA channels. Ideal for industrial applications requiring low power consumption and connectivity via I2C, SPI, UART, and USART interfaces.

Median Price

$11.324

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 22,350 parts In-Stock

1+ parts

$11.713

100+ parts

$10.231

1k+ parts

$7.056

10k+ parts

-

22,350

$11.713

$10.231

$7.056

-

Rochester

USA . 293 parts In-Stock

1+ parts

-

100+ parts

$8.830

1k+ parts

$7.900

10k+ parts

$7.430

293

-

$8.830

$7.900

$7.430

DigiKey

USA . 293 parts In-Stock

1+ parts

-

100+ parts

$11.610

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293

-

$11.610

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Verical

USA . 125 parts In-Stock

1+ parts

-

100+ parts

$11.037

1k+ parts

$9.875

10k+ parts

$9.287

125

-

$11.037

$9.875

$9.287

Distributors (In-Stock)

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Digiode

USA . 3,824 parts In-Stock

1+ parts

$9.310

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-

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3,824

$9.310

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Vyrian

USA . 5,000 parts In-Stock

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DigiKey Marketplace

USA . 293 parts In-Stock

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293

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ACDS - Activité Composants Distribution Service

France . 235 parts In-Stock

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235

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Connector Distribution Corp

USA . 5 parts In-Stock

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5

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Right Parts Inc.

USA . 5 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 4,199 parts In-Stock

1+ parts

$8.820

100+ parts

-

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4,199

$8.820

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$19.277

100+ parts

$19.085

1k+ parts

$18.314

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50

$19.277

$19.085

$18.314

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AZTECH Wire

Italy . 1,029 parts In-Stock

1+ parts

$21.580

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1,029

$21.580

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Microchip USA

USA . 2,578 parts In-Stock

1+ parts

$30.930

100+ parts

$30.490

1k+ parts

$30.270

10k+ parts

$30.050

2,578

$30.930

$30.490

$30.270

$30.050

Parana Technologies

USA . 507 parts In-Stock

1+ parts

$54.128

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507

$54.128

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DigiPath Technology Company

USA . 2,103 parts In-Stock

1+ parts

$59.602

100+ parts

$54.834

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2,103

$59.602

$54.834

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ChromeModa Solutions

Germany . 5,341 parts In-Stock

1+ parts

$60.818

100+ parts

$49.871

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5,341

$60.818

$49.871

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IDEA Electronic Components Group

UK . 1,345 parts In-Stock

1+ parts

$60.818

100+ parts

$57.777

1k+ parts

$54.736

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1,345

$60.818

$57.777

$54.736

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QUARKTWIN TECHNOLOGY LTD

USA . 5,082 parts In-Stock

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5,082

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 975 parts In-Stock

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Futuretech Components

Singapore . 834 parts In-Stock

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834

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Perfect Parts

USA . 755 parts In-Stock

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755

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Cyclops Electronics Ltd (Excess)

UK . 235 parts In-Stock

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Glotronic Ltd.

UK . 188 parts In-Stock

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Overview

Unlock the potential of your projects with the MSP430F155IRTDT by Texas Instruments. This versatile microcontroller offers top-quality performance and reliability, thanks to its cutting-edge technology. Ideal for a wide range of applications, from consumer electronics to industrial automation, this product stands out for its low power consumption and innovative features. Experience the value and benefits that Texas Instruments brings to the table with the MSP430F155IRTDT, delivering seamless connectivity and exceptional performance in a compact package. Elevate your designs with this advanced microcontroller today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the microcontroller, ensuring longevity and reliability.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, making it suitable for a wide range of applications.

Bit Size: 16

With a 16-bit architecture, this microcontroller can perform operations with higher precision and more complex algorithms, making it suitable for demanding tasks.

DAC Channels: YES

The presence of DAC channels enables the microcontroller to generate analog output signals, which can be essential for various control and communication applications.

ADC Channels: YES

Having ADC channels allows the microcontroller to accurately convert analog signals into digital data, enabling it to interface with sensors and other analog devices.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller ensures efficient and streamlined operation, which can result in faster execution of tasks and lower power consumption.

Connectivity: "I2C, SPI, UART, USART

Support for various communication protocols like I2C, SPI, UART, and USART enhances the versatility of the microcontroller, enabling it to easily communicate with other devices.

ROM Programmability: FLASH

The flash programmability of the ROM allows for easy and quick updates to the program code, making it convenient for development and maintenance of the microcontroller.

Low Power Mode: YES

The presence of a low power mode enables the microcontroller to conserve energy when idle or in low-demand situations, making it suitable for battery-operated devices or energy-efficient applications.

Technical Specifications

Microcontrollers MSP430F155IRTDT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

RAM Words:

0.5

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

.9 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, UART, USART"

Peripherals:

"COMPARATOR, DMA(3), TIMER(6), WDT"

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F155IRTDT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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