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MSP430F149IRTDT

Texas Instruments

MSP430F149IRTDT by Texas Instruments

MSP430F149IRTDT by Texas Instruments is a 16-bit microcontroller with 48 I/O lines, 8 MHz clock frequency, and 2.7-3.6 V supply voltage range. It features 8-Ch 12-Bit ADC channels and peripherals like PWM, UART, SPI for industrial applications requiring low power consumption and high-speed processing.

Median Price

$13.718

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 18,184 parts In-Stock

1+ parts

$10.996

100+ parts

$9.605

1k+ parts

$6.624

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-

18,184

$10.996

$9.605

$6.624

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DigiKey

USA . 553 parts In-Stock

1+ parts

$16.440

100+ parts

$11.255

1k+ parts

$10.810

10k+ parts

-

553

$16.440

$11.255

$10.810

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Mouser Electronics

USA . 32 parts In-Stock

1+ parts

$16.440

100+ parts

$11.260

1k+ parts

$10.800

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32

$16.440

$11.260

$10.800

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Arrow

USA . 500 parts In-Stock

1+ parts

-

100+ parts

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$8.092

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500

-

-

$8.092

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Distributors (In-Stock)

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Bristol Electronics

USA . 86 parts In-Stock

1+ parts

$8.736

100+ parts

$5.241

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-

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86

$8.736

$5.241

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Digiode

USA . 401 parts In-Stock

1+ parts

$10.446

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401

$10.446

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Vyrian

USA . 4,726 parts In-Stock

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4,726

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Euro-Tech

UK . 109 parts In-Stock

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109

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Dan-Mar Components

USA . 86 parts In-Stock

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86

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LWI Electronics Inc

India . 6 parts In-Stock

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6

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Semi Source

USA . 5 parts In-Stock

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5

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Distributors (Availability)

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Corphita

USA . 2,869 parts In-Stock

1+ parts

$9.896

100+ parts

-

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2,869

$9.896

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Microchip USA

USA . 1,765 parts In-Stock

1+ parts

$29.040

100+ parts

$28.620

1k+ parts

$28.410

10k+ parts

$28.210

1,765

$29.040

$28.620

$28.410

$28.210

Parana Technologies

USA . 1,814 parts In-Stock

1+ parts

$56.219

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1,814

$56.219

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DigiPath Technology Company

USA . 602 parts In-Stock

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$61.904

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602

$61.904

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IDEA Electronic Components Group

UK . 1,150 parts In-Stock

1+ parts

$63.167

100+ parts

$60.009

1k+ parts

$56.850

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1,150

$63.167

$60.009

$56.850

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ChromeModa Solutions

Germany . 806 parts In-Stock

1+ parts

$63.167

100+ parts

$51.797

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806

$63.167

$51.797

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Perfect Parts

USA . 2,304 parts In-Stock

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2,304

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Assy Fe

Spain . 4 parts In-Stock

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4

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Overview

Unleash the power of innovation with the MSP430F149IRTDT by Texas Instruments, a top-quality microcontroller designed to elevate your projects to new heights. This state-of-the-art device combines cutting-edge technology with the trusted reliability of Texas Instruments, offering customers unparalleled value and performance. Perfect for a wide range of applications, from industrial automation to consumer electronics, this microcontroller boasts impressive features and benefits that will revolutionize your designs. Trust in Texas Instruments for quality you can depend on, and let the MSP430F149IRTDT take your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the microcontroller.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options.

RAM Words: 2

Sufficient memory for storing data and instructions.

ADC Channels: YES

Enables analog to digital conversion for sensor interfacing.

Peripheral IC Type: MICROCONTROLLER, RISC

Uses Reduced Instruction Set Computing for efficient performance.

Analog To Digital Convertors: 8-Ch 12-Bit

Provides high resolution conversion for accurate sensor readings.

Connectivity: SPI, UART, USART(2)

Supports various communication protocols for versatile connectivity.

ROM Programmability: FLASH

Allows for easy reprogramming of the microcontroller's memory.

Low Power Mode: YES

Reduces power consumption for energy-efficient operation.

Technical Specifications

Microcontrollers MSP430F149IRTDT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

2

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

.9 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"SPI, UART, USART(2)"

Peripherals:

"COMPARATOR, POR, PWM, TIMER(2), WDT"

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430F149IRTDT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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