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MSP430F1491IPMG4

Texas Instruments

MSP430F1491IPMG4 by Texas Instruments

MSP430F1491IPMG4 by Texas Instruments is a 16-bit microcontroller with 48 I/O lines, 2 timers, and 2048 bytes of RAM. It operates at a max clock frequency of 8 MHz and has peripherals like comparator, PWM, and UART for industrial applications requiring low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Chip Stock

USA . 52,530 parts In-Stock

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Vyrian

USA . 7,273 parts In-Stock

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Bristol Electronics

USA . 4,112 parts In-Stock

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Digiode

USA . 3,922 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 11 parts In-Stock

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AZTECH Wire

Italy . 361 parts In-Stock

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$11.560

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Parana Technologies

USA . 977 parts In-Stock

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$24.981

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$2,319.820

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$22.482

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977

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One Stop Electronics

USA . 1,015 parts In-Stock

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$25.000

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DigiPath Technology Company

USA . 2,042 parts In-Stock

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$27.507

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ChromeModa Solutions

Germany . 6,049 parts In-Stock

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$28.068

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$23.016

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IDEA Electronic Components Group

UK . 1,231 parts In-Stock

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$28.068

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$26.665

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$25.261

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Component Stockers USA

USA . 328 parts In-Stock

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$99.990

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Corphita

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Microchip USA

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Overview

Unlock the next level of innovation with the Texas Instruments MSP430F1491IPMG4 microcontroller. Crafted with precision and expertise, this powerful device offers unrivaled performance and reliability in a compact package. Ideal for a wide range of applications, this microcontroller boasts low power consumption and advanced peripherals like comparators, timers, and PWM channels. Experience seamless connectivity with SPI, UART, and USART interfaces. Transform your projects with the cutting-edge technology of the MSP430 family and elevate your designs to new heights. Embrace the future of microcontrollers with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for portable applications.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage levels, providing flexibility in various power supply scenarios.

CPU Family: MSP430

The MSP430 family is known for its low power consumption and high performance, making it a great choice for energy-efficient applications.

Maximum Clock Frequency: 8 MHz

Offers fast processing speeds for quick response times in real-time applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for efficient execution of instructions, leading to improved performance.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the device, enabling flexibility in firmware updates and customization.

Low Power Mode: YES

Supports low power consumption, extending battery life and making it ideal for battery-operated devices.

Technical Specifications

Microcontrollers MSP430F1491IPMG4 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

2

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"SPI, UART, USART(2)"

Peripherals:

"COMPARATOR, POR, PWM, TIMER(2), WDT"

Trade Compliance

MSP430F1491IPMG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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