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MSP430F148IRTDT

Texas Instruments

MSP430F148IRTDT by Texas Instruments

MSP430F148IRTDT by Texas Instruments is a 16-bit microcontroller with 2/3.3V power supplies, 8MHz clock frequency, and 48 I/O lines. Ideal for industrial applications, it features 8 ADC channels, PWM channels, and connectivity options like SPI and UART for efficient data processing in compact designs.

Median Price

$14.765

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 38,078 parts In-Stock

1+ parts

$11.340

100+ parts

$9.245

1k+ parts

$6.163

10k+ parts

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38,078

$11.340

$9.245

$6.163

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Mouser Electronics

USA . 163 parts In-Stock

1+ parts

$18.190

100+ parts

$11.670

1k+ parts

$10.010

10k+ parts

-

163

$18.190

$11.670

$10.010

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,495 parts In-Stock

1+ parts

$10.773

100+ parts

-

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-

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3,495

$10.773

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-

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Vyrian

USA . 8,557 parts In-Stock

1+ parts

-

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8,557

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Global Solutions Electronics Company

USA . 98 parts In-Stock

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98

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LWI Electronics Inc

India . 9 parts In-Stock

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-

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-

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9

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,762 parts In-Stock

1+ parts

$10.206

100+ parts

-

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4,762

$10.206

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-

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Parana Technologies

USA . 2,341 parts In-Stock

1+ parts

$22.408

100+ parts

-

1k+ parts

$23.082

10k+ parts

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2,341

$22.408

-

$23.082

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DigiPath Technology Company

USA . 1,699 parts In-Stock

1+ parts

$24.674

100+ parts

$22.700

1k+ parts

-

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1,699

$24.674

$22.700

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ChromeModa Solutions

Germany . 1,337 parts In-Stock

1+ parts

$25.178

100+ parts

$20.646

1k+ parts

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1,337

$25.178

$20.646

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IDEA Electronic Components Group

UK . 200 parts In-Stock

1+ parts

$25.178

100+ parts

$23.919

1k+ parts

$22.660

10k+ parts

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200

$25.178

$23.919

$22.660

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Perfect Parts

USA . 1,318 parts In-Stock

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1,318

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Overview

Unlock the potential of your projects with the Texas Instruments MSP430F148IRTDT microcontroller. Designed with precision and quality in mind, this versatile chip offers a wide range of applications in various industries. With its low power consumption, high performance, and advanced features such as ADC channels, PWM channels, and connectivity options like SPI and UART, this microcontroller provides exceptional value and benefits to customers looking to elevate their designs. Trust Texas Instruments for top-notch products that deliver outstanding results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

Higher supply voltage allows for flexibility in power requirements, accommodating a wider range of external components.

ADC Channels: YES

The presence of analog-to-digital converters enables the microcontroller to interface with analog sensors, expanding its usability.

ROM Programmability: FLASH

Flash programmability allows for easy reprogramming and updating of firmware, ensuring adaptability to changing requirements.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient processing and performance, making the microcontroller suitable for real-time applications.

Maximum Clock Frequency: 8 MHz

Higher clock frequency allows for faster data processing and execution of instructions, enhancing the overall performance of the microcontroller.

No. of I/O Lines: 48

Abundance of input/output lines provides ample connectivity options for interfacing with external devices, making the microcontroller versatile in different applications.

Technical Specifications

Microcontrollers MSP430F148IRTDT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

2

ROM Words:

49152

ROM Programmability:

FLASH

Maximum Seated Height:

.9 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"SPI, UART, USART(2)"

Peripherals:

"COMPARATOR, POR, PWM, TIMER(2), WDT"

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430F148IRTDT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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