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MSP430F148IPMG4

Texas Instruments

MSP430F148IPMG4 by Texas Instruments

MSP430F148IPMG4 by Texas Instruments is a 16-bit microcontroller with 2048 bytes of RAM, operating at a max frequency of 8 MHz. Ideal for industrial applications, it features 48 I/O lines, PWM channels, and ADC channels for precise control and monitoring in temperature ranges from -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,509 parts In-Stock

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3,509

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Digiode

USA . 770 parts In-Stock

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770

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Distributors (Availability)

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AZTECH Wire

Italy . 369 parts In-Stock

1+ parts

$14.819

100+ parts

-

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369

$14.819

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Microchip USA

USA . 461 parts In-Stock

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$28.410

100+ parts

$28.000

1k+ parts

$27.800

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$27.600

461

$28.410

$28.000

$27.800

$27.600

Parana Technologies

USA . 1,958 parts In-Stock

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$31.429

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$79.244

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1,958

$31.429

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$79.244

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One Stop Electronics

USA . 177 parts In-Stock

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$34.000

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177

$34.000

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DigiPath Technology Company

USA . 1,877 parts In-Stock

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$34.607

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1,877

$34.607

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IDEA Electronic Components Group

UK . 1,453 parts In-Stock

1+ parts

$35.313

100+ parts

$33.547

1k+ parts

$31.782

10k+ parts

-

1,453

$35.313

$33.547

$31.782

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ChromeModa Solutions

Germany . 189 parts In-Stock

1+ parts

$35.313

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$28.957

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189

$35.313

$28.957

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Corphita

USA . 4,639 parts In-Stock

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4,639

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F148IPMG4 microcontroller. Crafted with precision and quality, this powerful device delivers unparalleled performance for a wide range of applications. Whether you're in need of reliable control solutions or innovative automation systems, this product provides the value and benefits you seek. Trust in Texas Instruments to bring you cutting-edge technology that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for portable devices.

Surface Mount: YES

Easy to integrate onto circuit boards, saving space and allowing for automated assembly.

Maximum Supply Voltage: 3.6 V

Can operate efficiently within a range of voltages, providing flexibility in power source selection.

Bit Size: 16

Offers a good balance between processing power and energy efficiency for various applications.

No. of Terminals: 64

Sufficient number of terminals for connecting to external components and peripherals.

Terminal Position: QUAD

Provides a stable and secure connection to the PCB, reducing the risk of signal interference.

Maximum Clock Frequency: 8 MHz

High clock frequency allows for fast data processing and response times in real-time applications.

RAM Bytes: 2048

Adequate amount of RAM for storing and processing data efficiently during operation.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the microcontroller without requiring specialized equipment.

Technical Specifications

Microcontrollers MSP430F148IPMG4 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MSP430F148IPMG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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