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MSP430F147IRTDR

Texas Instruments

MSP430F147IRTDR by Texas Instruments

MSP430F147IRTDR by Texas Instruments is a 16-bit microcontroller with 8KB RAM, 32KB ROM, and 8-channel ADC. Ideal for industrial applications due to its low power consumption (0.56mA) and wide temperature range (-40 to 85°C). Features include SPI, UART, USART connectivity and peripherals like PWM, timers, and comparator.

Median Price

$8.722

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 26,437 parts In-Stock

1+ parts

$8.722

100+ parts

$7.110

1k+ parts

$4.740

10k+ parts

-

26,437

$8.722

$7.110

$4.740

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,033 parts In-Stock

1+ parts

$8.286

100+ parts

-

1k+ parts

-

10k+ parts

-

2,033

$8.286

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-

-

Vyrian

USA . 8,242 parts In-Stock

1+ parts

-

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-

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8,242

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Semi Source

USA . 745 parts In-Stock

1+ parts

-

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745

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,927 parts In-Stock

1+ parts

$7.850

100+ parts

-

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1,927

$7.850

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Parana Technologies

USA . 367 parts In-Stock

1+ parts

$14.464

100+ parts

-

1k+ parts

$14.906

10k+ parts

-

367

$14.464

-

$14.906

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DigiPath Technology Company

USA . 2,223 parts In-Stock

1+ parts

$15.927

100+ parts

$14.653

1k+ parts

-

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2,223

$15.927

$14.653

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IDEA Electronic Components Group

UK . 2,115 parts In-Stock

1+ parts

$16.252

100+ parts

$15.439

1k+ parts

$14.627

10k+ parts

-

2,115

$16.252

$15.439

$14.627

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ChromeModa Solutions

Germany . 1,139 parts In-Stock

1+ parts

$16.252

100+ parts

$13.327

1k+ parts

-

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1,139

$16.252

$13.327

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AZTECH Wire

Italy . 646 parts In-Stock

1+ parts

$18.760

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646

$18.760

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Perfect Parts

USA . 11,200 parts In-Stock

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11,200

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A-Z Elektronik GmbH

Germany . 5,402 parts In-Stock

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5,402

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F147IRTDR microcontroller. Known for its superior quality and reliable performance, this cutting-edge product is perfect for a wide range of applications. Whether you're designing smart devices, wearables, or IoT solutions, this versatile microcontroller offers unmatched value with low power consumption, advanced peripherals, and high-speed connectivity options. Elevate your project to the next level with the MSP430F147IRTDR and experience the benefits of seamless integration and unparalleled efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various applications.

Surface Mount: YES

Facilitates easy and efficient PCB assembly, saving time and labor costs.

Maximum Supply Voltage: 3.6 V

Supports a wide range of voltage inputs, making it versatile for different power supply requirements.

Package Shape: SQUARE

Square package shape allows for efficient use of PCB space, enabling compact and space-saving designs.

Bit Size: 16

16-bit processing capability offers higher performance and computational power compared to lower bit microcontrollers.

CPU Family: MSP430

MSP430 family is known for its low power consumption and high performance, making it ideal for battery-powered devices.

ADC Channels: YES

Integrated Analog to Digital Converters allow for easy interfacing with analog sensors and signals, enhancing versatility.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enables efficient execution of instructions, resulting in faster processing and lower power consumption.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems.

ROM Programmability: FLASH

Flash programmable ROM allows for easy firmware updates and customization, improving flexibility and upgradability.

Technical Specifications

Microcontrollers MSP430F147IRTDR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

.9 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"SPI, UART, USART(2)"

Peripherals:

"COMPARATOR, POR, PWM, TIMER(2), WDT"

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430F147IRTDR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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