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MSP430F147IPMR-KAM

Texas Instruments

MSP430F147IPMR-KAM by Texas Instruments

MSP430F147IPMR-KAM by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 8 MHz. It features 1024 bytes of RAM, 32768 ROM words, and 8-channel 12-bit ADC for industrial applications requiring low power consumption and high-speed processing.

Median Price

$7.679

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$7.679

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650

$7.679

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Vyrian

USA . 8,501 parts In-Stock

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Digiode

USA . 1,926 parts In-Stock

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1,926

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Distributors (Availability)

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Semicontronic

India . 1,382 parts In-Stock

1+ parts

$7.000

100+ parts

$6.825

1k+ parts

$6.790

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1,382

$7.000

$6.825

$6.790

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One Stop Electronics

USA . 423 parts In-Stock

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$7.000

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423

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Continental Prestige Electronics

USA . 2,252 parts In-Stock

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$7.679

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$7.525

2,252

$7.679

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$7.525

Ampacity Inc.

Singapore . 643 parts In-Stock

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$12.000

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643

$12.000

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AZTECH Wire

Italy . 528 parts In-Stock

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$13.530

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528

$13.530

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Parana Technologies

USA . 1,398 parts In-Stock

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$21.476

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$21.857

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1,398

$21.476

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$21.857

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DigiPath Technology Company

USA . 1,373 parts In-Stock

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$23.647

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1,373

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IDEA Electronic Components Group

UK . 307 parts In-Stock

1+ parts

$24.130

100+ parts

$22.924

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$21.717

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307

$24.130

$22.924

$21.717

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ChromeModa Solutions

Germany . 276 parts In-Stock

1+ parts

$24.130

100+ parts

$19.787

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276

$24.130

$19.787

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Corohmni

South Africa . 71 parts In-Stock

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$28.646

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71

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Corphita

USA . 2,703 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$7.525

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$7.295

10k+ parts

$7.141

500

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$7.525

$7.295

$7.141

Argo Parts USA

USA . 202 parts In-Stock

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202

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Overview

Unleash the power of innovation with the MSP430F147IPMR-KAM by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers top-notch quality and reliability. This versatile microcontroller is perfect for a wide range of applications, offering customers unparalleled value and benefits. From low power modes to advanced peripherals like comparators and PWM, this product is designed to meet your needs with precision and efficiency. Experience the difference with the MSP430F147IPMR-KAM and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power input.

On Chip Data RAM Width: 8

Sufficient RAM width for data processing.

Bit Size: 16

Decent bit size for various operations.

Power Supplies (V): 2/3.3

Supports multiple power supply configurations.

No. of Terminals: 64

Sufficient number of terminals for connectivity.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications with higher operating temperatures.

CPU Family: MSP430

Highly efficient CPU family known for low power consumption.

ADC Channels: YES

Includes analog to digital converters for data conversion.

ROM Words: 32768

Large ROM size for program storage.

Maximum Clock Frequency: 8 MHz

Decent clock frequency for fast processing.

Peripheral IC Type: MICROCONTROLLER, RISC

Uses RISC architecture for efficient processing.

Technology: CMOS

Complementary metal-oxide-semiconductor technology for low power consumption.

Analog To Digital Convertors: 8-Ch 12-Bit

Multiple ADC channels with high resolution for accurate conversions.

PWM Channels: YES

Supports pulse width modulation for precise control.

Connectivity: SPI, UART, USART(2)

Multiple communication interfaces for connectivity.

ROM Programmability: FLASH

Flash ROM for reprogrammable memory.

Low Power Mode: YES

Includes low power modes for energy efficiency.

Technical Specifications

Microcontrollers MSP430F147IPMR-KAM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"SPI, UART, USART(2)"

Peripherals:

"COMPARATOR, POR, PWM, TIMER(2), WDT"

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430F147IPMR-KAM Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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