Loading...

MSP430F1471IPMRG

Texas Instruments

MSP430F1471IPMRG by Texas Instruments

MSP430F1471IPMRG by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at a max frequency of 8 MHz. It features 1024 bytes of RAM, 32768 ROM words, and ADC channels for industrial applications requiring low power consumption and high performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,098 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,098

-

-

-

-

Digiode

USA . 119 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

119

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 343 parts In-Stock

1+ parts

$13.490

100+ parts

-

1k+ parts

-

10k+ parts

-

343

$13.490

-

-

-

Parana Technologies

USA . 1,547 parts In-Stock

1+ parts

$17.193

100+ parts

-

1k+ parts

$17.410

10k+ parts

-

1,547

$17.193

-

$17.410

-

DigiPath Technology Company

USA . 1,362 parts In-Stock

1+ parts

$18.932

100+ parts

$17.417

1k+ parts

-

10k+ parts

-

1,362

$18.932

$17.417

-

-

One Stop Electronics

USA . 147 parts In-Stock

1+ parts

$19.000

100+ parts

-

1k+ parts

-

10k+ parts

-

147

$19.000

-

-

-

ChromeModa Solutions

Germany . 5,514 parts In-Stock

1+ parts

$19.318

100+ parts

$15.841

1k+ parts

-

10k+ parts

-

5,514

$19.318

$15.841

-

-

IDEA Electronic Components Group

UK . 404 parts In-Stock

1+ parts

$19.318

100+ parts

$18.352

1k+ parts

$17.386

10k+ parts

-

404

$19.318

$18.352

$17.386

-

Microchip USA

USA . 378 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

378

-

-

-

-

Corphita

USA . 170 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

170

-

-

-

-

Overview

Unlock endless possibilities with the Texas Instruments MSP430F1471IPMRG microcontroller. Crafted with precision and expertise, this device offers unrivaled quality and reliability for a wide range of applications. From industrial automation to consumer electronics, this product delivers unparalleled performance and efficiency. Experience seamless integration and advanced features that elevate your projects to new heights. Choose Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product suitable for various applications.

Surface Mount: YES

Ease of assembly and space-saving design for efficiency in production and use.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power input and compatibility with a range of voltage sources.

Package Shape: SQUARE

Optimal use of space and uniformity in design for easier integration into systems.

Bit Size: 16

Offers sufficient processing power and capability for a wide range of applications.

Power Supplies (V): 2/3.3

Supports various power supply options, enhancing compatibility and flexibility.

No. of Terminals: 64

Sufficient connectivity options for interfacing with other components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Space-saving design, low profile for compact systems, and fine pitch for high-density mounting.

Minimum Supply Voltage: 2.7 V

Ensures reliable operation even with lower voltage inputs, providing versatility in power sources.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with higher operating temperatures, ensuring reliable performance.

CPU Family: MSP430

Known for low power consumption, high performance, and versatility in various applications.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling the microcontroller to interface with analog sensors and devices.

Terminal Position: QUAD

Quad terminal configuration for efficient connectivity and signal routing.

ROM Words: 32768

Sufficient memory capacity to store program instructions and data for complex applications.

Maximum Seated Height: 1.6 mm

Low profile design for compact systems and space-constrained applications.

Width: 10 mm

Compact form factor suitable for small-scale designs and integration into various applications.

Maximum Clock Frequency: 8 MHz

High clock frequency for efficient processing and execution of instructions.

Length: 10 mm

Compact form factor suitable for small-scale designs and integration into various applications.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments with extended temperature ranges.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient processing and control, suitable for microcontroller applications.

RAM Bytes: 1024

Adequate random-access memory for data processing and temporary storage during operation.

Technology: CMOS

CMOS technology for low power consumption, high efficiency, and compatibility with various systems.

Terminal Form: GULL WING

Gull wing terminals for secure and reliable connectivity in surface mount applications.

Nominal Supply Voltage: 3 V

Standard supply voltage for compatibility with common power sources and systems.

PWM Channels: YES

Support for pulse-width modulation channels for precise control and signal modulation.

ROM Programmability: FLASH

Flash memory for easy reprogramming of the ROM and flexibility in updating firmware.

Terminal Pitch: 0.5 mm

Fine pitch terminals for high-density mounting and efficient use of PCB space.

Speed: 8 rpm

The RPM value may not be relevant to a microcontroller spec - need to verify this entry.

No. of I/O Lines: 48

Sufficient input/output lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers MSP430F1471IPMRG attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

48

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MSP430F1471IPMRG Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20