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MSP430F123IRHBR

Texas Instruments

MSP430F123IRHBR by Texas Instruments

MSP430F123IRHBR by Texas Instruments is a 16-bit microcontroller with 8 MHz max clock frequency, 256 bytes of RAM, and 8192 ROM words. Ideal for industrial applications, it features SPI and UART connectivity, low power mode, and peripherals like comparator and timer.

Median Price

$3.006

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,500 parts In-Stock

1+ parts

$1.890

100+ parts

$1.850

1k+ parts

$1.810

10k+ parts

-

2,500

$1.890

$1.850

$1.810

-

Texas Instruments

USA . 12,525 parts In-Stock

1+ parts

$4.121

100+ parts

$3.611

1k+ parts

$2.040

10k+ parts

-

12,525

$4.121

$3.611

$2.040

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,024 parts In-Stock

1+ parts

$1.796

100+ parts

-

1k+ parts

-

10k+ parts

-

1,024

$1.796

-

-

-

LIBRA Elektronik GmbH

Germany . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,000

-

-

-

-

Cyclops Electronics Ltd

UK . 3,370 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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3,370

-

-

-

-

Vyrian

USA . 3,109 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,109

-

-

-

-

Rebound Electronics

UK . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Resion

USA . 883 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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883

-

-

-

-

Prism Electronics

USA . 20 parts In-Stock

1+ parts

-

100+ parts

-

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20

-

-

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LWI Electronics Inc

India . 4 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 7,352 parts In-Stock

1+ parts

$1.610

100+ parts

-

1k+ parts

-

10k+ parts

-

7,352

$1.610

-

-

-

Corphita

USA . 4,880 parts In-Stock

1+ parts

$1.701

100+ parts

-

1k+ parts

-

10k+ parts

-

4,880

$1.701

-

-

-

AZTECH Wire

Italy . 1,157 parts In-Stock

1+ parts

$8.980

100+ parts

-

1k+ parts

-

10k+ parts

-

1,157

$8.980

-

-

-

Parana Technologies

USA . 1,073 parts In-Stock

1+ parts

$34.881

100+ parts

-

1k+ parts

-

10k+ parts

-

1,073

$34.881

-

-

-

ChromeModa Solutions

Germany . 6,828 parts In-Stock

1+ parts

$39.192

100+ parts

$32.137

1k+ parts

-

10k+ parts

-

6,828

$39.192

$32.137

-

-

IDEA Electronic Components Group

UK . 905 parts In-Stock

1+ parts

$39.192

100+ parts

$37.232

1k+ parts

$35.273

10k+ parts

-

905

$39.192

$37.232

$35.273

-

A-Z Elektronik GmbH

Germany . 4,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,500

-

-

-

-

Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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3,500

-

-

-

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Kepictronics

USA . 3,269 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,269

-

-

-

-

DigiPath Technology Company

USA . 504 parts In-Stock

1+ parts

-

100+ parts

$35.336

1k+ parts

-

10k+ parts

-

504

-

$35.336

-

-

Overview

Unleash the power of innovation with the Texas Instruments MSP430F123IRHBR microcontroller! Designed with precision and cutting-edge technology, this product offers unparalleled quality and reliability. Ideal for a wide range of applications, this microcontroller provides customers with unmatched value, efficiency, and flexibility. Experience seamless connectivity, exceptional performance, and low power consumption with the MSP430F123IRHBR. Elevate your projects to new heights with Texas Instruments' leading-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and electrical insulation, making the product suitable for a wide range of applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding environmental conditions.

ADC Channels: YES

The presence of ADC channels allows for analog to digital conversion, enabling the microcontroller to interface with various sensors and external analog signals.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller ensures efficient processing and power consumption, making it ideal for battery-operated devices and applications where performance is crucial.

ROM Programmability: FLASH

Flash programmability allows for easy and flexible reprogramming of the ROM, enabling quick updates and modifications to the firmware.

Connectivity: "SPI, UART

Support for SPI and UART communication interfaces enhances the connectivity options of the microcontroller, enabling seamless integration with other devices and systems.

Technical Specifications

Microcontrollers MSP430F123IRHBR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

22

No. of Serial I/Os:

1

No. of Terminals:

32

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

8 rpm

Maximum Supply Current:

.35 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"SPI, UART"

Peripherals:

COMPARATOR, POR, TIMER, WDT

Trade Compliance

MSP430F123IRHBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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