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MSP430F123IPWR-HYD

Texas Instruments

MSP430F123IPWR-HYD by Texas Instruments

MSP430F123IPWR-HYD by Texas Instruments is a 16-bit microcontroller with 256 bytes of RAM and flash ROM programmability. It operates at a max clock frequency of 8 MHz, suitable for industrial applications requiring low power consumption. With peripherals like comparators and timers, it offers connectivity via SPI and UART interfaces for versatile usage in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,019 parts In-Stock

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Digiode

USA . 566 parts In-Stock

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Nova Conductors

Japan . 22 parts In-Stock

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AZTECH Wire

Italy . 590 parts In-Stock

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$5.872

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One Stop Electronics

USA . 1,591 parts In-Stock

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$9.000

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Ampacity Inc.

Singapore . 390 parts In-Stock

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$30.000

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Parana Technologies

USA . 1,732 parts In-Stock

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$44.947

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Component Stockers USA

USA . 3,044 parts In-Stock

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$47.690

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DigiPath Technology Company

USA . 854 parts In-Stock

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$49.492

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$45.533

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854

$49.492

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ChromeModa Solutions

Germany . 2,944 parts In-Stock

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$50.502

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$41.412

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IDEA Electronic Components Group

UK . 1,787 parts In-Stock

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$45.452

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Perfect Parts

USA . 4,480 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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Corphita

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Aranea Global

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F123IPWR-HYD microcontroller. Built with top-quality materials and cutting-edge technology, this product offers unparalleled performance and reliability in a compact package. Ideal for a wide range of applications, from industrial automation to consumer electronics, this microcontroller delivers high-speed processing and low power consumption. Experience the value and benefits of Texas Instruments' expertise in microcontrollers with the MSP430F123IPWR-HYD. Empower your projects and take them to the next level with this versatile and efficient solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and cost-effective housing for the microcontroller.

Surface Mount: YES

Allows for easy and efficient integration onto circuit boards.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options.

Package Shape: RECTANGULAR

Facilitates easy placement and mounting within electronic devices.

Bit Size: 16

Offers good processing power for various applications.

No. of Terminals: 28

Provides ample connectivity options for peripheral devices.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Enables compact and space-saving designs in electronic products.

Minimum Supply Voltage: 1.8 V

Allows for low power operation in energy-efficient applications.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with varying temperature conditions.

CPU Family: MSP430

Part of a reliable and versatile microcontroller family for diverse applications.

Minimum Operating Temperature: -40 °C

Ideal for use in extreme temperature conditions.

ADC Channels: YES

Enables analog-to-digital conversion for precise sensor interfacing.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes efficient RISC architecture for optimized performance.

RAM Bytes: 256

Sufficient memory for data storage and processing in embedded systems.

Technology: CMOS

Provides low power consumption and high noise immunity for reliable operation.

PWM Channels: YES

Supports pulse-width modulation for motor control and power regulation.

Connectivity: SPI, UART

Offers versatile communication options for interfacing with other devices.

ROM Programmability: FLASH

Allows for flexible and fast programming of the microcontroller.

Low Power Mode: YES

Enhances energy efficiency and prolongs battery life in portable devices.

No. of I/O Lines: 22

Sufficient input/output lines for connecting external components and peripherals.

Technical Specifications

Microcontrollers MSP430F123IPWR-HYD attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

22

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

256

ROM Words:

0

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

8 rpm

Maximum Supply Current:

.35 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI, UART

Peripherals:

COMPARATOR(2), TIMER

Trade Compliance

MSP430F123IPWR-HYD Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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