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MSP430F123IPW

Texas Instruments

MSP430F123IPW by Texas Instruments

MSP430F123IPW by Texas Instruments is a 16-bit microcontroller with 8 MHz max clock frequency, 256 bytes RAM, and 8192 ROM words. Ideal for industrial applications, it features SPI and UART connectivity, low power mode, and peripherals like comparator and timer.

Median Price

$5.802

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 55,080 parts In-Stock

1+ parts

$4.945

100+ parts

$4.333

1k+ parts

$2.448

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-

55,080

$4.945

$4.333

$2.448

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DigiKey

USA . 220 parts In-Stock

1+ parts

$6.660

100+ parts

$4.320

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-

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220

$6.660

$4.320

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Mouser Electronics

USA . 130 parts In-Stock

1+ parts

$6.660

100+ parts

$4.320

1k+ parts

$3.980

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130

$6.660

$4.320

$3.980

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Arrow

USA . 150 parts In-Stock

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-

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$2.842

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-

$2.842

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Distributors (In-Stock)

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TME

Poland . 40 parts In-Stock

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$3.380

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40

$3.380

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Digiode

USA . 2,943 parts In-Stock

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$4.698

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2,943

$4.698

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Vyrian

USA . 8,402 parts In-Stock

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8,402

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LIBRA Elektronik GmbH

Germany . 1,831 parts In-Stock

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1,831

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Huijzer Components

Netherlands . 212 parts In-Stock

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Inventory MP

USA . 110 parts In-Stock

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Bristol Electronics

USA . 110 parts In-Stock

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Classic Components Corporation

USA . 73 parts In-Stock

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EMSNET

USA . 47 parts In-Stock

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LWI Electronics Inc

India . 9 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 3,829 parts In-Stock

1+ parts

$4.450

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3,829

$4.450

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Parana Technologies

USA . 549 parts In-Stock

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$67.921

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549

$67.921

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DigiPath Technology Company

USA . 2,000 parts In-Stock

1+ parts

$74.790

100+ parts

$68.807

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2,000

$74.790

$68.807

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ChromeModa Solutions

Germany . 6,477 parts In-Stock

1+ parts

$76.316

100+ parts

$62.579

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6,477

$76.316

$62.579

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IDEA Electronic Components Group

UK . 1,832 parts In-Stock

1+ parts

$76.316

100+ parts

$72.500

1k+ parts

$68.684

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1,832

$76.316

$72.500

$68.684

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Lixinc

USA . 14,704 parts In-Stock

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Kepictronics

USA . 8,000 parts In-Stock

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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Perfect Parts

USA . 928 parts In-Stock

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Assy Fe

Spain . 250 parts In-Stock

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Authorized Procurement Solutions

USA . 112 parts In-Stock

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F123IPW microcontroller. Designed for a wide range of applications, this high-quality device offers unparalleled value and benefits to customers. With its cutting-edge technology and reliable performance, the MSP430F123IPW is perfect for projects requiring low power consumption and high efficiency. Trust in Texas Instruments, a leader in the industry, to provide you with a dependable solution that will take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V offers flexibility in power supply options.

On Chip Data RAM Width: 8

Having a data RAM width of 8 enhances data processing capabilities.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient space utilization on the PCB.

Bit Size: 16

A 16-bit architecture enables efficient data processing and computations.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options for peripherals and interfaces.

Minimum Supply Voltage: 1.8 V

Support for a minimum supply voltage of 1.8V allows for operation in low power scenarios.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures reliable performance in harsh environments.

CPU Family: MSP430

Being part of the MSP430 CPU family indicates efficient power management and low energy consumption.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C enables operation in extreme cold conditions.

ADC Channels: YES

Integrated ADC channels provide analog input capabilities for sensor interfacing.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers high performance and efficient processing capabilities.

Connectivity: "SPI, UART

Support for SPI and UART connectivity options enables seamless communication with external devices.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and quick updates to the program code.

PWM Channels: YES

Integrated PWM channels facilitate precise control of analog outputs.

Technical Specifications

Microcontrollers MSP430F123IPW attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

22

No. of Serial I/Os:

1

No. of Terminals:

28

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

8 rpm

Maximum Supply Current:

.35 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"SPI, UART"

Peripherals:

COMPARATOR, POR, TIMER, WDT

Trade Compliance

MSP430F123IPW Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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