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MSP430F1132IRHBR

Texas Instruments

MSP430F1132IRHBR by Texas Instruments

MSP430F1132IRHBR by Texas Instruments is a 16-bit microcontroller with 8 MHz max clock freq, 5-Ch 10-Bit ADC, and FLASH ROM. Ideal for industrial applications due to -40 to 85 °C temp range, low power mode (0.35 mA), and BOR, TIMER(3), WDT peripherals support. Package style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE.

Median Price

$3.840

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,289 parts In-Stock

1+ parts

$3.840

100+ parts

$3.365

1k+ parts

$1.901

10k+ parts

-

8,289

$3.840

$3.365

$1.901

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,011 parts In-Stock

1+ parts

$3.648

100+ parts

-

1k+ parts

-

10k+ parts

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4,011

$3.648

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Vyrian

USA . 8,452 parts In-Stock

1+ parts

-

100+ parts

-

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-

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8,452

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 74 parts In-Stock

1+ parts

$3.456

100+ parts

-

1k+ parts

-

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74

$3.456

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-

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AZTECH Wire

Italy . 563 parts In-Stock

1+ parts

$16.930

100+ parts

-

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563

$16.930

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Parana Technologies

USA . 1,107 parts In-Stock

1+ parts

$29.463

100+ parts

-

1k+ parts

$59.628

10k+ parts

-

1,107

$29.463

-

$59.628

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DigiPath Technology Company

USA . 738 parts In-Stock

1+ parts

$32.443

100+ parts

$29.847

1k+ parts

-

10k+ parts

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738

$32.443

$29.847

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ChromeModa Solutions

Germany . 6,113 parts In-Stock

1+ parts

$33.105

100+ parts

$27.146

1k+ parts

-

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6,113

$33.105

$27.146

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IDEA Electronic Components Group

UK . 1,887 parts In-Stock

1+ parts

$33.105

100+ parts

$31.450

1k+ parts

$29.794

10k+ parts

-

1,887

$33.105

$31.450

$29.794

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A-Z Elektronik GmbH

Germany . 6,480 parts In-Stock

1+ parts

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6,480

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Cyclops Electronics Ltd (Excess)

UK . 1,337 parts In-Stock

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1,337

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Overview

Meet the MSP430F1132IRHBR by Texas Instruments, a high-quality microcontroller that offers unmatched value and benefits to our customers. With Texas Instruments' reputation for excellence in manufacturing, this chip provides reliability and performance for a variety of applications. Whether you're looking for low power consumption, multiple peripherals like BOR and WDT, or a wide operating temperature range, this microcontroller has you covered. Trust in Texas Instruments and the MSP430F1132IRHBR for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, ensuring reliable performance in various environments.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a wide range of applications.

Bit Size: 16

A 16-bit architecture enables higher computing capabilities and performance for the microcontroller.

Power Supplies (V): 2/3.3

Supports multiple power supply options, offering versatility in power management for different scenarios.

ADC Channels: YES

Built-in analog-to-digital converters enable the microcontroller to interface with analog sensors or signals, expanding its functionality.

ROM Words: 8192

An ample amount of Read-Only Memory allows for storing program instructions and data, facilitating complex application development.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a Reduced Instruction Set Computing (RISC) microcontroller enhances processing efficiency and speed for better performance.

Maximum Clock Frequency: 8 MHz

The ability to operate at a high clock frequency enables fast execution of instructions, enhancing overall system performance.

Low Power Mode: YES

Support for low power mode helps in conserving energy and extending battery life in battery-operated applications.

Technical Specifications

Microcontrollers MSP430F1132IRHBR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

14

No. of Serial I/Os:

0

No. of Terminals:

32

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.35 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Peripherals:

"BOR, TIMER(3), WDT"

Analog To Digital Convertors:

5-Ch 10-Bit

Trade Compliance

MSP430F1132IRHBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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