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MSP430F1111AIPWR

Texas Instruments

MSP430F1111AIPWR by Texas Instruments

MSP430F1111AIPWR by Texas Instruments is a 16-bit microcontroller with 2048 ROM words and 128 RAM bytes. Operating at up to 8 MHz, it features peripherals like comparator, timer(3), and WDT. Ideal for industrial applications requiring low power consumption and fixed-point format processing.

Median Price

$2.618

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,065 parts In-Stock

1+ parts

$2.618

100+ parts

$2.294

1k+ parts

$1.296

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6,065

$2.618

$2.294

$1.296

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,187 parts In-Stock

1+ parts

$2.487

100+ parts

-

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4,187

$2.487

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Vyrian

USA . 3,906 parts In-Stock

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3,906

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Zilex Electronics Inc.

Canada . 2,000 parts In-Stock

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2,000

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NexGen Digital

USA . 1,499 parts In-Stock

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1,499

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ComSIT Distribution GmbH

Germany . 1,150 parts In-Stock

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ComSIT USA

USA . 700 parts In-Stock

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700

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,075 parts In-Stock

1+ parts

$2.356

100+ parts

-

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4,075

$2.356

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Parana Technologies

USA . 2,292 parts In-Stock

1+ parts

$47.595

100+ parts

$4,419.957

1k+ parts

$42.836

10k+ parts

-

2,292

$47.595

$4,419.957

$42.836

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DigiPath Technology Company

USA . 357 parts In-Stock

1+ parts

$52.408

100+ parts

$48.216

1k+ parts

-

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357

$52.408

$48.216

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ChromeModa Solutions

Germany . 6,666 parts In-Stock

1+ parts

$53.478

100+ parts

$43.852

1k+ parts

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6,666

$53.478

$43.852

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IDEA Electronic Components Group

UK . 273 parts In-Stock

1+ parts

$53.478

100+ parts

$50.804

1k+ parts

$48.130

10k+ parts

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273

$53.478

$50.804

$48.130

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Kepictronics

USA . 208 parts In-Stock

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208

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Overview

Unlock endless possibilities with the MSP430F1111AIPWR by Texas Instruments. This high-quality microcontroller offers reliable performance and versatility for a wide range of applications. With its innovative design and advanced features, this product provides exceptional value and benefits to customers seeking cutting-edge technology. Trust in Texas Instruments to deliver top-notch products that exceed expectations and drive success in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to damage, ensuring the longevity of the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time in production processes.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can handle higher power requirements and voltages, making it suitable for a wide range of applications.

On Chip Data RAM Width: 8

Having an 8-bit data RAM width allows for efficient data processing and storage capabilities, enhancing the performance of the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC (Reduced Instruction Set Computing) microcontroller ensures faster and more efficient operation, making it a good choice for performance-critical applications.

Maximum Clock Frequency: 8 MHz

Capable of running at a maximum clock frequency of 8 MHz, this microcontroller can handle high-speed operations and data processing tasks effectively.

ROM Programmability: FLASH

The ability to program ROM using FLASH technology allows for flexibility and ease of updating firmware, making it an ideal choice for applications that require frequent software modifications.

Technical Specifications

Microcontrollers MSP430F1111AIPWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

14

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.35 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

"COMPARATOR, POR, TIMER(3), WDT"

Trade Compliance

MSP430F1111AIPWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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