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MSP430F110IPWR

Texas Instruments

MSP430F110IPWR by Texas Instruments

MSP430F110IPWR by Texas Instruments is a 16-bit microcontroller with 128 bytes of RAM and 576 ROM words. Operating at a max clock frequency of 8 MHz, it has 14 I/O lines and PWM channels for industrial applications requiring low power consumption. With a supply voltage range of 1.8V to 3.6V, this CMOS technology-based MCU is suitable for various embedded systems due to its compact size and dual terminal position in a small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,375 parts In-Stock

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Digiode

USA . 1,355 parts In-Stock

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1,355

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Distributors (Availability)

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AZTECH Wire

Italy . 636 parts In-Stock

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$19.730

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One Stop Electronics

USA . 600 parts In-Stock

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$21.000

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$21.000

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Parana Technologies

USA . 1,214 parts In-Stock

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$36.624

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DigiPath Technology Company

USA . 1,148 parts In-Stock

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$40.328

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$37.102

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$40.328

$37.102

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ChromeModa Solutions

Germany . 1,320 parts In-Stock

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$41.151

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$33.744

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$41.151

$33.744

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IDEA Electronic Components Group

UK . 268 parts In-Stock

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$41.151

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$39.093

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$37.036

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$41.151

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$37.036

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Corphita

USA . 4,856 parts In-Stock

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Perfect Parts

USA . 896 parts In-Stock

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Futuretech Components

Singapore . 836 parts In-Stock

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Microchip USA

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Overview

Unlock the potential of your next project with the Texas Instruments MSP430F110IPWR microcontroller. With a reputation for top-quality products, Texas Instruments delivers unmatched reliability and performance in the field. Ideal for a wide range of applications, this microcontroller offers customers the value and benefits they need to succeed. Whether you're looking to streamline operations or enhance functionality, the MSP430F110IPWR is the solution you've been searching for. Choose Texas Instruments for superior technology that sets you apart from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on circuit boards.

Maximum Supply Voltage: 3.6 V

This high maximum supply voltage allows for flexibility in power supply options.

Bit Size: 16

A 16-bit architecture enables efficient processing and performance.

Minimum Operating Temperature: -40 °C

With a wide operating temperature range, this microcontroller can function in extreme environments.

ROM Programmability: FLASH

Flash ROM programmability offers easy and fast reprogramming of the microcontroller as needed.

PWM Channels: YES

Pulse Width Modulation (PWM) capability allows for precise control of analog signals, useful in many applications.

Technical Specifications

Microcontrollers MSP430F110IPWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

IT ALSO OPERATES 1.8 V AT 2 MHZ MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of I/O Lines:

14

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

576

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.35 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

MSP430F110IPWR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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