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MSP430AFE233IPWR

Texas Instruments

MSP430AFE233IPWR by Texas Instruments

MSP430AFE233IPWR by Texas Instruments is a 16-bit microcontroller with 24 terminals, operating at a max frequency of 12 MHz. Ideal for industrial applications, it features 3 ADC channels, SPI and UART connectivity, and low power mode with a supply current of 4.5 mA.

Median Price

$2.798

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 200 parts In-Stock

1+ parts

$2.260

100+ parts

$2.210

1k+ parts

$2.170

10k+ parts

-

200

$2.260

$2.210

$2.170

-

Texas Instruments

USA . 8,013 parts In-Stock

1+ parts

$3.337

100+ parts

$2.924

1k+ parts

$1.652

10k+ parts

-

8,013

$3.337

$2.924

$1.652

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 18 parts In-Stock

1+ parts

$2.298

100+ parts

-

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-

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18

$2.298

-

-

-

Digiode

USA . 1,752 parts In-Stock

1+ parts

$3.170

100+ parts

-

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-

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1,752

$3.170

-

-

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Vyrian

USA . 5,855 parts In-Stock

1+ parts

-

100+ parts

-

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5,855

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NexGen Digital

USA . 374 parts In-Stock

1+ parts

-

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-

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374

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 100 parts In-Stock

1+ parts

$2.298

100+ parts

-

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-

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100

$2.298

-

-

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Ampacity Inc.

Singapore . 3,757 parts In-Stock

1+ parts

$2.840

100+ parts

-

1k+ parts

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10k+ parts

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3,757

$2.840

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Corphita

USA . 881 parts In-Stock

1+ parts

$3.003

100+ parts

-

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881

$3.003

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Parana Technologies

USA . 94 parts In-Stock

1+ parts

$32.118

100+ parts

-

1k+ parts

$98.659

10k+ parts

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94

$32.118

-

$98.659

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DigiPath Technology Company

USA . 1,085 parts In-Stock

1+ parts

$35.366

100+ parts

-

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1,085

$35.366

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IDEA Electronic Components Group

UK . 1,187 parts In-Stock

1+ parts

$36.088

100+ parts

$34.284

1k+ parts

$32.479

10k+ parts

-

1,187

$36.088

$34.284

$32.479

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ChromeModa Solutions

Germany . 105 parts In-Stock

1+ parts

$36.088

100+ parts

$29.592

1k+ parts

-

10k+ parts

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105

$36.088

$29.592

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Perfect Parts

USA . 6,720 parts In-Stock

1+ parts

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6,720

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Overview

Unlock the power of innovation with the Texas Instruments MSP430AFE233IPWR microcontroller. Designed with cutting-edge technology and precision engineering, this device offers unparalleled performance and reliability in a wide range of applications. From industrial automation to consumer electronics, this versatile microcontroller delivers superior functionality and efficiency. Trust in Texas Instruments' legacy of excellence and invest in the future of your projects with the MSP430AFE233IPWR. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and cost-effectiveness.

Surface Mount: YES

Allows for easy integration onto PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options.

Package Shape: RECTANGULAR

Enables efficient use of board space for compact designs.

Bit Size: 16

Provides a balance between performance and cost for various applications.

No. of Terminals: 24

Offers enough connectivity options for diverse interfacing needs.

Package Style: SMALL OUTLINE

Facilitates compact and space-saving designs in electronic devices.

Minimum Supply Voltage: 1.8 V

Supports low-power operation for energy-efficient applications.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in various environmental conditions.

CPU Family: MSP430

Represents a well-established and trusted brand for microcontroller solutions.

Minimum Operating Temperature: -40 °C

Allows for operation in harsh and extreme temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and excellent electrical conductivity.

ADC Channels: YES

Enables analog signal processing for a wide range of applications.

Terminal Position: DUAL

Offers flexibility in board layout and component placement.

ROM Words: 8192

Provides ample storage for program and data memory requirements.

Maximum Seated Height: 1.2 mm

Supports slim and compact device designs.

Width: 4.4 mm

Contributes to space-saving layouts in electronic systems.

Boundary Scan: YES

Facilitates debugging and testing during the manufacturing process.

Peripherals: BOR, POR, TIMER(3), WDT

Offers a variety of integrated features for enhanced functionality.

Maximum Clock Frequency: 12 MHz

Balances performance and power consumption for optimal operation.

Maximum Time At Peak Reflow Temperature: 30s

Ensures reliable soldering during manufacturing processes.

Peak Reflow Temperature: 260C

Suitable for lead-free soldering processes in compliance with industry standards.

Length: 7.8 mm

Contributes to compact and space-efficient device designs.

Temperature Grade: INDUSTRIAL

Suitable for operation in industrial environments with varying temperature ranges.

Peripheral IC Type: MICROCONTROLLER, RISC

Offers a powerful and efficient processing architecture for diverse applications.

RAM Bytes: 512

Provides sufficient volatile memory for data storage and processing requirements.

Technology: CMOS

Ensures low power consumption and compatibility with modern digital systems.

Terminal Form: GULL WING

Facilitates easy soldering and assembly onto PCBs.

Analog To Digital Convertors: 3-Ch 24-Bit

Enables high-resolution analog signal processing for precision applications.

Maximum Supply Current: 4.5 mA

Supports low-power operation for energy-efficient designs.

Nominal Supply Voltage: 2.2 V

Provides a stable operating voltage for consistent performance.

PWM Channels: YES

Enables precise control of output signals for various applications.

Connectivity: SPI, UART, USART

Offers versatile communication interfaces for seamless connectivity.

ROM Programmability: FLASH

Allows for easy and fast reprogramming of the memory contents.

Terminal Pitch: 0.65 mm

Facilitates compact board layouts and high-density mounting.

Speed: 12 rpm

Suitable for various speed control applications in electronic systems.

Low Power Mode: YES

Supports energy-efficient operation for battery-powered devices.

On Chip Program ROM Width: 8

Provides efficient storage for program instructions.

No. of I/O Lines: 11

Offers flexibility in interfacing with external components and peripherals.

Technical Specifications

Microcontrollers MSP430AFE233IPWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

11

No. of Terminals:

24

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

12 rpm

Maximum Supply Current:

4.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI, UART, USART

Peripherals:

BOR, POR, TIMER(3), WDT

Analog To Digital Convertors:

3-Ch 24-Bit

Trade Compliance

MSP430AFE233IPWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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