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MSP430AFE233IPW

Texas Instruments

MSP430AFE233IPW by Texas Instruments

MSP430AFE233IPW by Texas Instruments is a 16-bit microcontroller with 24 terminals, operating at up to 12 MHz. It features 3-channel 24-bit ADCs and peripherals like BOR, POR, TIMER(3), WDT. Ideal for industrial applications requiring low power consumption and connectivity via SPI, UART, USART interfaces.

Median Price

$4.450

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,910 parts In-Stock

1+ parts

$4.450

100+ parts

$3.899

1k+ parts

$2.203

10k+ parts

-

10,910

$4.450

$3.899

$2.203

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TME

Poland . 34 parts In-Stock

1+ parts

$3.120

100+ parts

-

1k+ parts

-

10k+ parts

-

34

$3.120

-

-

-

Digiode

USA . 2,564 parts In-Stock

1+ parts

$4.228

100+ parts

-

1k+ parts

-

10k+ parts

-

2,564

$4.228

-

-

-

Vyrian

USA . 2,377 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,377

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,380 parts In-Stock

1+ parts

$4.005

100+ parts

-

1k+ parts

-

10k+ parts

-

1,380

$4.005

-

-

-

Component Stockers USA

USA . 16,279 parts In-Stock

1+ parts

$4.040

100+ parts

-

1k+ parts

-

10k+ parts

-

16,279

$4.040

-

-

-

AZTECH Wire

Italy . 395 parts In-Stock

1+ parts

$15.950

100+ parts

-

1k+ parts

-

10k+ parts

-

395

$15.950

-

-

-

Microchip USA

USA . 2,525 parts In-Stock

1+ parts

$26.760

100+ parts

$26.590

1k+ parts

$26.510

10k+ parts

$26.430

2,525

$26.760

$26.590

$26.510

$26.430

Parana Technologies

USA . 1,456 parts In-Stock

1+ parts

$42.426

100+ parts

-

1k+ parts

-

10k+ parts

-

1,456

$42.426

-

-

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IDEA Electronic Components Group

UK . 2,175 parts In-Stock

1+ parts

$47.670

100+ parts

$45.286

1k+ parts

$42.903

10k+ parts

-

2,175

$47.670

$45.286

$42.903

-

ChromeModa Solutions

Germany . 324 parts In-Stock

1+ parts

$47.670

100+ parts

$39.089

1k+ parts

-

10k+ parts

-

324

$47.670

$39.089

-

-

Authorized Procurement Solutions

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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15,000

-

-

-

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DigiPath Technology Company

USA . 444 parts In-Stock

1+ parts

-

100+ parts

$42.979

1k+ parts

-

10k+ parts

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444

-

$42.979

-

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Infinite Electronics LLP (Excess)

. 267 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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267

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-

Overview

Unlock the power of innovation with the Texas Instruments MSP430AFE233IPW Microcontroller. Designed with cutting-edge technology and precision engineering, this versatile device offers unparalleled performance for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers exceptional value, reliability, and efficiency. Experience seamless connectivity, low power consumption, and advanced features that will take your projects to the next level. Trust in Texas Instruments to provide the quality and expertise you need to bring your ideas to life. Elevate your designs with the MSP430AFE233IPW and revolutionize the way you create.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protects the microcontroller from external elements, ensuring a longer lifespan.

Surface Mount: YES

Surface mount design allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options, accommodating various voltage requirements for different applications.

Package Shape: RECTANGULAR

Rectangular shape facilitates easy integration into circuit designs and ensures compatibility with standard packaging layouts.

Bit Size: 16

16-bit architecture enables efficient processing of data and instructions, offering a balance between performance and cost-effectiveness.

No. of Terminals: 24

Sufficient number of terminals for connecting input/output devices and peripherals, allowing for versatile functionality.

Package Style (Meter): SMALL OUTLINE

Compact small outline package design saves space on the PCB and is suitable for applications with limited board real estate.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage requirement enables operation in low-power scenarios, ideal for battery-powered applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliability in various environmental conditions, making it suitable for industrial use.

CPU Family: MSP430

Belonging to the MSP430 family indicates compatibility with a range of existing components and libraries, facilitating integration and programming.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing and reduced power consumption, making it a cost-effective solution for embedded systems.

RAM Bytes: 512

Adequate RAM capacity for storing data and program variables, enabling multitasking and complex computation without performance degradation.

Connectivity: SPI, UART, USART

Multiple communication interfaces support seamless integration with external devices and networks, enhancing connectivity and interoperability.

ROM Programmability: FLASH

Flash memory programmability allows for easy updating and reprogramming of firmware, enabling flexibility and future-proofing of the microcontroller.

Technical Specifications

Microcontrollers MSP430AFE233IPW attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

11

No. of Terminals:

24

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

12 rpm

Maximum Supply Current:

4.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI, UART, USART

Peripherals:

BOR, POR, TIMER(3), WDT

Analog To Digital Convertors:

3-Ch 24-Bit

Trade Compliance

MSP430AFE233IPW Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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