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MSP430AFE231IPW

Texas Instruments

MSP430AFE231IPW by Texas Instruments

MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

$4.450

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,970 parts In-Stock

1+ parts

$4.450

100+ parts

$3.899

1k+ parts

$2.203

10k+ parts

-

1,970

$4.450

$3.899

$2.203

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,331 parts In-Stock

1+ parts

$4.228

100+ parts

-

1k+ parts

-

10k+ parts

-

1,331

$4.228

-

-

-

Vyrian

USA . 7,235 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,235

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 454 parts In-Stock

1+ parts

$4.005

100+ parts

-

1k+ parts

-

10k+ parts

-

454

$4.005

-

-

-

Ampacity Inc.

Singapore . 1,719 parts In-Stock

1+ parts

$8.230

100+ parts

-

1k+ parts

-

10k+ parts

-

1,719

$8.230

-

-

-

Parana Technologies

USA . 1,203 parts In-Stock

1+ parts

$19.273

100+ parts

-

1k+ parts

$19.302

10k+ parts

-

1,203

$19.273

-

$19.302

-

AZTECH Wire

Italy . 175 parts In-Stock

1+ parts

$20.870

100+ parts

-

1k+ parts

-

10k+ parts

-

175

$20.870

-

-

-

DigiPath Technology Company

USA . 29 parts In-Stock

1+ parts

$21.222

100+ parts

$19.524

1k+ parts

-

10k+ parts

-

29

$21.222

$19.524

-

-

ChromeModa Solutions

Germany . 4,193 parts In-Stock

1+ parts

$21.655

100+ parts

$17.757

1k+ parts

-

10k+ parts

-

4,193

$21.655

$17.757

-

-

IDEA Electronic Components Group

UK . 1,691 parts In-Stock

1+ parts

$21.655

100+ parts

$20.572

1k+ parts

$19.490

10k+ parts

-

1,691

$21.655

$20.572

$19.490

-

Microchip USA

USA . 1,730 parts In-Stock

1+ parts

$28.200

100+ parts

$28.030

1k+ parts

$27.940

10k+ parts

$27.860

1,730

$28.200

$28.030

$27.940

$27.860

QUARKTWIN TECHNOLOGY LTD

USA . 6,179 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,179

-

-

-

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Perfect Parts

USA . 116 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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116

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Technical Specifications

Microcontrollers MSP430AFE231IPW attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

11

No. of Terminals:

24

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

12 rpm

Maximum Supply Current:

4.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI, UART, USART

Peripherals:

BOR, POR, TIMER(3), WDT

Analog To Digital Convertors:

1-Ch 24-Bit

Trade Compliance

MSP430AFE231IPW Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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