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MSP430AFE223IPW

Texas Instruments

MSP430AFE223IPW by Texas Instruments

MSP430AFE223IPW by Texas Instruments is a 16-bit microcontroller with 4096 ROM words, 256 RAM bytes, and 3-Ch 24-Bit ADC channels. Ideal for industrial applications, it features BOR, POR, TIMER(3), WDT peripherals and supports SPI, UART, USART connectivity. Operating temperature ranges from -40 to 85 °C with low power mode option.

Median Price

$3.985

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,360 parts In-Stock

1+ parts

$3.985

100+ parts

$3.492

1k+ parts

$1.973

10k+ parts

-

1,360

$3.985

$3.492

$1.973

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,537 parts In-Stock

1+ parts

$3.786

100+ parts

-

1k+ parts

-

10k+ parts

-

2,537

$3.786

-

-

-

Vyrian

USA . 6,231 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,231

-

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,017 parts In-Stock

1+ parts

$3.586

100+ parts

-

1k+ parts

-

10k+ parts

-

3,017

$3.586

-

-

-

AZTECH Wire

Italy . 793 parts In-Stock

1+ parts

$14.850

100+ parts

-

1k+ parts

-

10k+ parts

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793

$14.850

-

-

-

Microchip USA

USA . 1,737 parts In-Stock

1+ parts

$25.260

100+ parts

$25.100

1k+ parts

$25.020

10k+ parts

$24.950

1,737

$25.260

$25.100

$25.020

$24.950

Parana Technologies

USA . 2,008 parts In-Stock

1+ parts

$74.429

100+ parts

-

1k+ parts

-

10k+ parts

-

2,008

$74.429

-

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IDEA Electronic Components Group

UK . 1,923 parts In-Stock

1+ parts

$83.628

100+ parts

$79.447

1k+ parts

$75.265

10k+ parts

-

1,923

$83.628

$79.447

$75.265

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ChromeModa Solutions

Germany . 663 parts In-Stock

1+ parts

$83.628

100+ parts

$68.575

1k+ parts

-

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663

$83.628

$68.575

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QUARKTWIN TECHNOLOGY LTD

USA . 22,957 parts In-Stock

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22,957

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DigiPath Technology Company

USA . 1,876 parts In-Stock

1+ parts

-

100+ parts

$75.399

1k+ parts

-

10k+ parts

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1,876

-

$75.399

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Component Stockers USA

USA . 999 parts In-Stock

1+ parts

-

100+ parts

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999

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Overview

Revolutionize your projects with the Texas Instruments MSP430AFE223IPW Microcontroller. Designed with precision and innovation, this small outline package offers 16-bit processing power and a wide range of peripherals including BOR, POR, and timers. Perfect for industrial applications, this microcontroller boasts low power consumption, high-speed connectivity via SPI, UART, and USART, and three 24-bit ADC channels. Unlock the potential of your designs with the MSP430AFE223IPW, where quality meets value for unparalleled performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Wide range of supply voltage allows for flexibility in power sources.

Bit Size: 16

Higher bit size provides better precision and performance for data processing.

No. of Terminals: 24

Sufficient number of terminals for connecting to various external devices and components.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme low temperature environments, suitable for a wide range of applications.

ADC Channels: YES

Built-in Analog to Digital Converters allow for easy interfacing with analog sensors and signals.

ROM Words: 4096

Large ROM capacity for storing program instructions and data.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient and fast processing capabilities for real-time applications.

RAM Bytes: 256

Adequate RAM for temporary data storage and manipulation, enhancing overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-powered devices.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of voltage levels, useful in motor control and power management.

Connectivity: SPI, UART, USART

Multiple communication interfaces provide flexibility for connecting to other devices and systems.

ROM Programmability: FLASH

Flash programmable memory allows for easy and fast updates to the firmware without the need for external programming equipment.

Low Power Mode: YES

Energy-efficient low-power mode extends battery life in portable applications.

Technical Specifications

Microcontrollers MSP430AFE223IPW attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

11

No. of Terminals:

24

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

12 rpm

Maximum Supply Current:

4.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI, UART, USART

Peripherals:

BOR, POR, TIMER(3), WDT

Analog To Digital Convertors:

3-Ch 24-Bit

Trade Compliance

MSP430AFE223IPW Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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