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MSP430A151IRHBT

Texas Instruments

MSP430A151IRHBT by Texas Instruments

MSP430A151IRHBT by Texas Instruments is a 16-bit microcontroller with 512B RAM, 266240 ROM words, and 8 ADC channels. Ideal for industrial applications due to its low power mode, peripherals like BOR and timers, and connectivity options including I2C and UART.

Median Price

$2.859

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.298

10k+ parts

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250

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-

$3.298

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Rochester

USA . 88 parts In-Stock

1+ parts

-

100+ parts

$2.420

1k+ parts

$2.170

10k+ parts

$2.040

88

-

$2.420

$2.170

$2.040

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 562 parts In-Stock

1+ parts

$2.565

100+ parts

-

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562

$2.565

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Vyrian

USA . 7,743 parts In-Stock

1+ parts

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7,743

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 169 parts In-Stock

1+ parts

$2.290

100+ parts

-

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169

$2.290

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Corphita

USA . 4,531 parts In-Stock

1+ parts

$2.430

100+ parts

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4,531

$2.430

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Parana Technologies

USA . 345 parts In-Stock

1+ parts

$23.769

100+ parts

-

1k+ parts

$24.397

10k+ parts

-

345

$23.769

-

$24.397

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DigiPath Technology Company

USA . 771 parts In-Stock

1+ parts

$26.173

100+ parts

$24.079

1k+ parts

-

10k+ parts

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771

$26.173

$24.079

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ChromeModa Solutions

Germany . 574 parts In-Stock

1+ parts

$26.707

100+ parts

$21.900

1k+ parts

-

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574

$26.707

$21.900

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IDEA Electronic Components Group

UK . 519 parts In-Stock

1+ parts

$26.707

100+ parts

$25.372

1k+ parts

$24.036

10k+ parts

-

519

$26.707

$25.372

$24.036

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iodParts Technologies Inc.

India . 500 parts In-Stock

1+ parts

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100+ parts

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500

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Overview

Unlock endless possibilities with the Texas Instruments MSP430A151IRHBT Microcontroller. Crafted with precision and expertise, this versatile chip offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this innovative solution provides seamless connectivity, low power consumption, and advanced features to help you bring your ideas to life. Experience the next level of technology with the MSP430A151IRHBT and revolutionize the way you design and create.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Maximum Supply Voltage: 3.6 V

Allows for higher voltage applications, providing flexibility in usage.

Bit Size: 16

The 16-bit architecture allows for efficient processing of data and instructions.

ADC Channels: YES

The presence of Analog to Digital Converters allows for easy integration with analog sensors and inputs.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC architecture microcontroller, it offers high performance and low power consumption.

ROM Programmability: FLASH

Flash ROM allows for easy and quick programming of the microcontroller.

Connectivity: I2C, IRDA, LIN, SCI(2), SPI(2), UART

Multiple connectivity options make it versatile and compatible with various communication protocols.

Technical Specifications

Microcontrollers MSP430A151IRHBT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

24

No. of Serial I/Os:

1

No. of Terminals:

32

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

512

ROM Words:

266240

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

.45 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, LIN, SCI(2), SPI(2), UART

Peripherals:

BOR, COMPARATOR, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430A151IRHBT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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