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MSP430A149IPZR

Texas Instruments

MSP430A149IPZR by Texas Instruments

MSP430A149IPZR by Texas Instruments is a 16-bit microcontroller with 2560 bytes of RAM and 61440 ROM words. It features 4-Ch 16-Bit ADC channels, operates at a max clock frequency of 16 MHz, and includes peripherals like BOD, Comparator, RTC. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,488 parts In-Stock

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8,488

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Digiode

USA . 4,277 parts In-Stock

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4,277

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Distributors (Availability)

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One Stop Electronics

USA . 1,547 parts In-Stock

1+ parts

$6.000

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1,547

$6.000

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AZTECH Wire

Italy . 651 parts In-Stock

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$14.407

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651

$14.407

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Parana Technologies

USA . 1,162 parts In-Stock

1+ parts

$62.594

100+ parts

$5,812.774

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$56.334

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1,162

$62.594

$5,812.774

$56.334

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DigiPath Technology Company

USA . 639 parts In-Stock

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$68.923

100+ parts

$63.410

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639

$68.923

$63.410

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ChromeModa Solutions

Germany . 4,133 parts In-Stock

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$70.330

100+ parts

$57.671

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4,133

$70.330

$57.671

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IDEA Electronic Components Group

UK . 1,210 parts In-Stock

1+ parts

$70.330

100+ parts

$66.814

1k+ parts

$63.297

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1,210

$70.330

$66.814

$63.297

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Corphita

USA . 2,687 parts In-Stock

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Overview

Discover the Texas Instruments MSP430A149IPZR microcontroller, a high-quality product that offers unparalleled value and performance. Ideal for a wide range of applications, this microcontroller boasts advanced features and benefits that cater to your specific needs. With its low power mode, connectivity options, and impressive peripherals, this product is designed to enhance your projects and streamline your work. Trust in Texas Instruments' reputation for excellence and innovation, and elevate your designs with the MSP430A149IPZR microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and protection for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

Allows for a higher operating voltage range, providing flexibility in power supply options.

No. of I/O Lines: 72

An ample number of I/O lines allows for connectivity with a wide range of external devices and peripherals.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to accurately convert analog signals to digital data, expanding its functionality.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient processing and execution of instructions, enhancing the overall performance of the microcontroller.

Maximum Clock Frequency: 16 MHz

High clock frequency facilitates quick execution of instructions and operations, leading to improved performance.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the microcontroller, enabling firmware updates and modifications without the need for external programming tools.

Low Power Mode: YES

Low power mode functionality helps in reducing power consumption during idle or standby periods, making the microcontroller energy-efficient.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of applications, making it a reliable choice for embedded systems.

Technical Specifications

Microcontrollers MSP430A149IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

72

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2560

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

USCI(4)

Peripherals:

BOD, COMPARATOR, POR, TIMER(3), RTC, WDT

Analog To Digital Convertors:

4-Ch 16-Bit

Trade Compliance

MSP430A149IPZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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