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MSP430A148IPZR

Texas Instruments

MSP430A148IPZR by Texas Instruments

MSP430A148IPZR by Texas Instruments is a 16-bit microcontroller with 2048 bytes of RAM and 49152 ROM words. It features 3 ADC channels, operates at a max clock frequency of 16 MHz, and has low power mode for industrial applications.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 6,299 parts In-Stock

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Digiode

USA . 867 parts In-Stock

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867

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One Stop Electronics

USA . 1,395 parts In-Stock

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$8.000

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1,395

$8.000

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AZTECH Wire

Italy . 500 parts In-Stock

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$10.636

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$10.636

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Parana Technologies

USA . 1,207 parts In-Stock

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$26.164

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$26.746

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DigiPath Technology Company

USA . 2,153 parts In-Stock

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$28.810

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$26.505

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ChromeModa Solutions

Germany . 4,456 parts In-Stock

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$29.398

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$24.106

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$29.398

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IDEA Electronic Components Group

UK . 1,820 parts In-Stock

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$29.398

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$27.928

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$26.458

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1,820

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$26.458

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Microchip USA

USA . 1,014 parts In-Stock

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$30.200

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$30.020

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$29.930

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$29.830

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$30.020

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$29.830

Component Stockers USA

USA . 1,370 parts In-Stock

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$85.720

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Corphita

USA . 4,253 parts In-Stock

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Overview

Unlock the power of innovation with the Texas Instruments MSP430A148IPZR microcontroller. Designed for high performance and reliability, this versatile device offers a wide range of applications in various industries. With its cutting-edge technology and advanced features, the MSP430A148IPZR delivers unparalleled value and benefits to customers. Trust in Texas Instruments' proven track record of excellence and elevate your projects to new heights with this exceptional microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power supply options for the product.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals to digital for processing.

ROM Words: 49152

With a large ROM capacity of 49152 words, the microcontroller can store a significant amount of program data.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency of 16 MHz enables fast processing speeds for the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller allows for efficient operation and execution of instructions.

RAM Bytes: 2048

The ample RAM capacity of 2048 bytes allows for storing variables and temporary data during program execution.

Technology: CMOS

The CMOS technology used in the microcontroller helps in reducing power consumption and enhancing battery life.

Low Power Mode: YES

The availability of a low power mode helps in saving energy and prolonging the battery life of the product.

Technical Specifications

Microcontrollers MSP430A148IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

72

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

49152

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

.56 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

USCI(4)

Peripherals:

BOD, COMPARATOR, POR, TIMER(3), RTC, WDT

Analog To Digital Convertors:

3-Ch 16-Bit

Trade Compliance

MSP430A148IPZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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