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MSP430A092IPMR

Texas Instruments

MSP430A092IPMR by Texas Instruments

MSP430A092IPMR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 8 MHz. It features ADC and PWM channels, suitable for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,828 parts In-Stock

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Digiode

USA . 179 parts In-Stock

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AZTECH Wire

Italy . 295 parts In-Stock

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$9.598

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One Stop Electronics

USA . 687 parts In-Stock

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$30.000

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Parana Technologies

USA . 2,095 parts In-Stock

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$53.025

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ChromeModa Solutions

Germany . 6,966 parts In-Stock

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$59.579

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$48.855

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6,966

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$48.855

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IDEA Electronic Components Group

UK . 4 parts In-Stock

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$59.579

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$56.600

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$53.621

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4

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$53.621

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QUARKTWIN TECHNOLOGY LTD

USA . 15,015 parts In-Stock

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Corphita

USA . 1,537 parts In-Stock

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DigiPath Technology Company

USA . 1,467 parts In-Stock

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$53.716

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Microchip USA

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Overview

Elevate your projects to new heights with the MSP430A092IPMR microcontroller from Texas Instruments. Built with precision and expertise, this powerful device offers unparalleled performance in a compact package. Perfect for a wide range of applications, this microcontroller boasts a 16-bit architecture, low power consumption, and advanced ADC channels for seamless integration. Experience the ultimate in reliability and efficiency with Texas Instruments, setting the standard for quality in the industry. Upgrade your designs today and unlock endless possibilities with the MSP430A092IPMR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and lightweight, ensuring the microcontroller is protected during handling and operation.

Surface Mount: YES

Surface mount installation allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle a wide range of power inputs, making it versatile for various applications.

Bit Size: 16

The 16-bit size allows for higher computational power and more complex operations, suitable for advanced control and processing tasks.

Power Supplies (V): 2/3.3

Support for both 2V and 3.3V power supplies provides flexibility in power options, accommodating different system requirements.

No. of Terminals: 64

The large number of terminals (64) allows for a greater number of connections and peripherals to be integrated, enhancing functionality and performance.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance (-40°C to 85°C) ensures reliable operation in harsh environmental conditions, making it suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable for extended operation.

Technical Specifications

Microcontrollers MSP430A092IPMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

14

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MSP430A092IPMR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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