Loading...

MSP430A081IPWR

Texas Instruments

MSP430A081IPWR by Texas Instruments

MSP430A081IPWR by Texas Instruments is a 16-bit microcontroller with 8-bit RAM and 16-bit address bus. It operates b/w -40 to 85 °C, has 256 bytes of RAM, and features 8 ADC channels for industrial applications. With a max clock frequency of 8 MHz, it offers low power mode and connectivity via USART for efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,276 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,276

-

-

-

-

Digiode

USA . 3,095 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,095

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 985 parts In-Stock

1+ parts

$8.000

100+ parts

-

1k+ parts

-

10k+ parts

-

985

$8.000

-

-

-

AZTECH Wire

Italy . 588 parts In-Stock

1+ parts

$11.592

100+ parts

-

1k+ parts

-

10k+ parts

-

588

$11.592

-

-

-

Parana Technologies

USA . 456 parts In-Stock

1+ parts

$26.694

100+ parts

-

1k+ parts

$27.420

10k+ parts

-

456

$26.694

-

$27.420

-

ChromeModa Solutions

Germany . 2,308 parts In-Stock

1+ parts

$29.993

100+ parts

$24.594

1k+ parts

-

10k+ parts

-

2,308

$29.993

$24.594

-

-

IDEA Electronic Components Group

UK . 527 parts In-Stock

1+ parts

$29.993

100+ parts

$28.493

1k+ parts

$26.994

10k+ parts

-

527

$29.993

$28.493

$26.994

-

QUARKTWIN TECHNOLOGY LTD

USA . 23,801 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

23,801

-

-

-

-

Corphita

USA . 4,432 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,432

-

-

-

-

DigiPath Technology Company

USA . 1,691 parts In-Stock

1+ parts

-

100+ parts

$27.042

1k+ parts

-

10k+ parts

-

1,691

-

$27.042

-

-

Overview

Discover the Texas Instruments MSP430A081IPWR microcontroller, a top-notch product from a trusted manufacturer. This compact device offers unparalleled value with its high-quality components and versatile applications in various industries. With features like low power mode, PWM channels, and connectivity options, this microcontroller provides customers with efficient solutions for their projects. Experience the reliability and performance of Texas Instruments with the MSP430A081IPWR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for portable and rugged applications.

Surface Mount: YES

Surface mount technology simplifies the manufacturing process and allows for compact designs, saving space in electronic devices.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, providing flexibility in different power supply configurations.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster data processing and storage within the microcontroller.

Address Bus Width: 16

With a wider address bus, the microcontroller can access larger memory spaces, enabling more complex operations and data handling.

Package Shape: RECTANGULAR

Rectangular packages are space-efficient and easy to handle during assembly and integration into electronic systems.

Bit Size: 16

16-bit architecture provides enhanced processing capabilities and higher computational power compared to lower bit sizes.

No. of Terminals: 20

Having more terminals allows for increased connectivity options and interfacing with external components for versatile functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style offers a compact form factor, making it suitable for applications where space is limited.

Minimum Supply Voltage: 2.7 V

Supports low supply voltages, enabling efficient power management and operation in battery-powered devices.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, the microcontroller can perform reliably in various environmental conditions.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making it ideal for energy-efficient designs.

Minimum Operating Temperature: -40 °C

The microcontroller can operate in extreme cold temperatures, making it suitable for harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish offers excellent conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Having analog-to-digital converter channels allows the microcontroller to interface with analog sensors and inputs.

Terminal Position: DUAL

Dual terminal positions provide flexibility in PCB layout and soldering orientations for easier integration.

ROM Words: 8192

With a large ROM capacity, the microcontroller can store and execute complex programs and firmware.

Maximum Seated Height: 1.2 mm

Low seated height allows for slim and compact device designs, especially in applications with space constraints.

Width: 4.4 mm

Narrow width enables dense PCB layouts and smaller form factors for miniaturized electronic devices.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging during the manufacturing process, improving product quality and reliability.

External Data Bus Width: 16

With a wider external data bus, the microcontroller can efficiently transfer data between external peripherals and memory.

Peripherals: BOR, POR, TIMER, WDT

Having built-in peripherals like Brown-Out Reset, Power-On Reset, Timers, and Watchdog Timer enhances the microcontroller's functionality for diverse applications.

Maximum Clock Frequency: 8 MHz

Operating at a high clock frequency enables fast processing speeds and real-time performance for time-critical applications.

Maximum Time At Peak Reflow Temperature (s): 30

The microcontroller can withstand peak reflow temperatures for a certain duration during the soldering process without compromising its functionality.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and assembly of the microcontroller on PCBs for reliable connections.

Length: 6.5 mm

Compact length contributes to space-saving designs and efficient PCB layouts in electronic devices.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, the microcontroller can withstand harsh operating conditions and extended temperature ranges.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture offers efficient instruction execution and low power consumption, making the microcontroller suitable for energy-sensitive applications.

RAM Bytes: 256

Having a sufficient RAM capacity allows for buffering data and temporary storage during program execution for smooth operation.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ensuring energy-efficient and reliable performance.

Terminal Form: GULL WING

Gull-wing terminal form simplifies soldering and provides good mechanical strength for reliable connections on PCBs.

Analog To Digital Convertors: 8-Ch 10-Bit

Multiple ADC channels with 10-bit resolution allow the microcontroller to accurately convert analog signals into digital data.

Maximum Supply Current: 0.35 mA

With low supply current requirements, the microcontroller can operate efficiently and prolong battery life in portable devices.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller under normal operating conditions.

PWM Channels: YES

Having Pulse-Width Modulation (PWM) channels enables the microcontroller to generate variable output signals for controlling motors, LEDs, and other devices.

Connectivity: USART

USART connectivity allows the microcontroller to communicate with external devices via serial communication, expanding its interfacing capabilities.

ROM Programmability: FLASH

Flash programmable ROM enables easy and quick updates to firmware and program code without the need for external programming devices.

Terminal Pitch: 0.65 mm

With a small terminal pitch, the microcontroller can be densely populated on PCBs for increased functionality in limited space.

Format: FIXED POINT

Fixed-point arithmetic format simplifies numerical computations and reduces processing complexity for efficient program execution.

Speed: 8 rpm

Operating at a speed of 8 revolutions per minute, the microcontroller can control variable speed applications with precision.

Low Power Mode: YES

The low power mode feature allows the microcontroller to conserve energy during idle or standby conditions, extending battery life in power-sensitive applications.

On Chip Program ROM Width: 8

With a wider on-chip program ROM width, the microcontroller can store larger program codes for complex applications and firmware.

No. of I/O Lines: 14

Having multiple I/O lines enables the microcontroller to interface with external sensors, actuators, and peripherals for versatile input and output operations.

Technical Specifications

Microcontrollers MSP430A081IPWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

6.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

14

No. of Serial I/Os:

1

No. of Terminals:

20

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

256

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

8 rpm

Maximum Supply Current:

.35 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

USART

Peripherals:

BOR, POR, TIMER, WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430A081IPWR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20