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MSP430A065IRBHR

Texas Instruments

MSP430A065IRBHR by Texas Instruments

MSP430A065IRBHR by Texas Instruments is a 16-bit microcontroller with 8KB ROM, 256B RAM, and 8 ADC channels. Ideal for industrial applications, it operates b/w -40 to 85°C with low power consumption at max. supply current of 0.35mA. Features include USART connectivity, BOR, POR, TIMER peripherals, and a max clock frequency of 8MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,058 parts In-Stock

1+ parts

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4,058

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Digiode

USA . 881 parts In-Stock

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881

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,170 parts In-Stock

1+ parts

$16.000

100+ parts

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1,170

$16.000

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AZTECH Wire

Italy . 388 parts In-Stock

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$17.113

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388

$17.113

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Parana Technologies

USA . 345 parts In-Stock

1+ parts

$55.500

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345

$55.500

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DigiPath Technology Company

USA . 1,173 parts In-Stock

1+ parts

$61.113

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1,173

$61.113

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ChromeModa Solutions

Germany . 4,841 parts In-Stock

1+ parts

$62.360

100+ parts

$51.135

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4,841

$62.360

$51.135

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IDEA Electronic Components Group

UK . 1,332 parts In-Stock

1+ parts

$62.360

100+ parts

$59.242

1k+ parts

$56.124

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1,332

$62.360

$59.242

$56.124

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Corphita

USA . 4,770 parts In-Stock

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4,770

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Overview

Unlock endless possibilities with the Texas Instruments MSP430A065IRBHR microcontroller. Designed with cutting-edge technology and precision engineering, this versatile chip offers a wide range of applications in various industries. From industrial automation to consumer electronics, this microcontroller provides high performance and low power consumption, ensuring efficient operation in any project. Trust in Texas Instruments' reputation for quality and innovation, and revolutionize your designs with the MSP430A065IRBHR microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the microcontroller, ensuring long-term reliability.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and ensures stable operation under varying voltage conditions.

CPU Family: MSP430

Being part of the MSP430 CPU family signifies that this microcontroller has a proven track record of performance, efficiency, and reliability.

ADC Channels: YES

Having Analog to Digital Converter channels enables the microcontroller to interface with analog sensors and convert real-world signals into digital data for processing.

ROM Programmability: FLASH

The use of FLASH memory for ROM programmability allows for easy and fast reprogramming of the microcontroller, enabling quick product updates and enhancements.

Low Power Mode: YES

The availability of a low power mode feature helps in reducing power consumption during idle or low processing periods, making it suitable for battery-powered applications.

Technical Specifications

Microcontrollers MSP430A065IRBHR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

22

No. of Serial I/Os:

1

No. of Terminals:

32

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

256

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

8 rpm

Maximum Supply Current:

.35 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

USART

Peripherals:

BOR, POR, TIMER, WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430A065IRBHR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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