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MSP430A045IPWR

Texas Instruments

MSP430A045IPWR by Texas Instruments

MSP430A045IPWR by Texas Instruments is a 16-bit microcontroller with 8-bit data RAM and 16-bit address bus. It operates b/w -40 to 85 °C, has 5-Ch 10-Bit ADC channels, and supports BOR, POR, TIMER, WDT peripherals. Ideal for industrial applications requiring low power consumption and connectivity via USART with a max clock frequency of 8 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,639 parts In-Stock

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4,639

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Vyrian

USA . 4,195 parts In-Stock

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4,195

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Distributors (Availability)

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One Stop Electronics

USA . 1,100 parts In-Stock

1+ parts

$7.000

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1,100

$7.000

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AZTECH Wire

Italy . 628 parts In-Stock

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$18.299

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628

$18.299

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Parana Technologies

USA . 1,073 parts In-Stock

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$48.550

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1,073

$48.550

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ChromeModa Solutions

Germany . 4,369 parts In-Stock

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$54.550

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$44.731

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4,369

$54.550

$44.731

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IDEA Electronic Components Group

UK . 1,352 parts In-Stock

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$54.550

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$51.822

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$49.095

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1,352

$54.550

$51.822

$49.095

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DigiPath Technology Company

USA . 1,550 parts In-Stock

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$49.182

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1,550

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$49.182

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Corphita

USA . 911 parts In-Stock

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911

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Overview

Unlock the possibilities of advanced technology with the Texas Instruments MSP430A045IPWR microcontroller. Crafted with precision and expertise, this powerful device offers unmatched quality and reliability in a compact package. Ideal for a wide range of applications, this microcontroller ensures seamless performance and efficiency. Experience the value and benefits of the MSP430A045IPWR, from its low power consumption to its high-speed connectivity options. Elevate your projects with the trusted innovation of Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides good protection and durability for the microcontroller, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

Ability to operate at a maximum supply voltage of 3.6V ensures compatibility with various power sources and systems.

On Chip Data RAM Width: 8

Having a wider on-chip data RAM width of 8 bits allows for faster data processing and storage capabilities.

Address Bus Width: 16

With a wider address bus width of 16 bits, the microcontroller can access a larger memory space, enabling more complex algorithms and programs to run efficiently.

Bit Size: 16

A bit size of 16 indicates a higher processing capability, making the microcontroller suitable for tasks that require handling larger amounts of data and complex computations.

No. of Terminals: 20

Having 20 terminals allows for multiple connections and interfaces, enabling versatile communication and control options with external devices.

Minimum Supply Voltage: 1.8 V

Ability to operate at a minimum supply voltage of 1.8V allows for power-efficient performance and flexibility in various power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the microcontroller can withstand harsh environmental conditions and industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller with various peripheral ICs ensures efficient and optimized performance for a wide range of applications.

Technical Specifications

Microcontrollers MSP430A045IPWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

14

No. of Serial I/Os:

1

No. of Terminals:

20

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

8 rpm

Maximum Supply Current:

.35 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

USART

Peripherals:

BOR, POR, TIMER, WDT

Analog To Digital Convertors:

5-Ch 10-Bit

Trade Compliance

MSP430A045IPWR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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