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MSP430A002IPM

Texas Instruments

MSP430A002IPM by Texas Instruments

MSP430A002IPM by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at a max frequency of 8 MHz. Ideal for industrial applications, it features Flash ROM programmability, PWM channels, and ADC capabilities. With a temperature range from -40 to 85°C and low profile packaging, it offers versatile performance in various environments.

Median Price

$5.237

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 770 parts In-Stock

1+ parts

-

100+ parts

$4.190

1k+ parts

$3.750

10k+ parts

$3.530

770

-

$4.190

$3.750

$3.530

DigiKey

USA . 770 parts In-Stock

1+ parts

-

100+ parts

$5.510

1k+ parts

-

10k+ parts

-

770

-

$5.510

-

-

Verical

USA . 577 parts In-Stock

1+ parts

-

100+ parts

$5.237

1k+ parts

$4.688

10k+ parts

$4.412

577

-

$5.237

$4.688

$4.412

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,555 parts In-Stock

1+ parts

$4.427

100+ parts

-

1k+ parts

-

10k+ parts

-

1,555

$4.427

-

-

-

Vyrian

USA . 4,213 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,213

-

-

-

-

DigiKey Marketplace

USA . 770 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

770

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,846 parts In-Stock

1+ parts

$4.194

100+ parts

-

1k+ parts

-

10k+ parts

-

2,846

$4.194

-

-

-

Parana Technologies

USA . 15 parts In-Stock

1+ parts

$15.941

100+ parts

-

1k+ parts

$16.292

10k+ parts

-

15

$15.941

-

$16.292

-

DigiPath Technology Company

USA . 1,929 parts In-Stock

1+ parts

$17.553

100+ parts

$16.149

1k+ parts

-

10k+ parts

-

1,929

$17.553

$16.149

-

-

ChromeModa Solutions

Germany . 2,232 parts In-Stock

1+ parts

$17.911

100+ parts

$14.687

1k+ parts

-

10k+ parts

-

2,232

$17.911

$14.687

-

-

IDEA Electronic Components Group

UK . 617 parts In-Stock

1+ parts

$17.911

100+ parts

$17.015

1k+ parts

$16.120

10k+ parts

-

617

$17.911

$17.015

$16.120

-

Microchip USA

USA . 495 parts In-Stock

1+ parts

$31.530

100+ parts

$31.330

1k+ parts

$31.230

10k+ parts

$31.140

495

$31.530

$31.330

$31.230

$31.140

Overview

Unlock the power of innovation with the Texas Instruments MSP430A002IPM microcontroller. Crafted with precision and expertise, this versatile device offers a wide range of applications in various industries. From smart home devices to industrial automation, this microcontroller delivers unparalleled performance and reliability. With its advanced features and cutting-edge technology, the MSP430A002IPM provides customers with unmatched value and benefits. Experience the difference with Texas Instruments – where quality meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection to the microcontroller, making it suitable for various environments and applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 3.6 V

Supports a wide range of voltage inputs, making it versatile and compatible with different power sources.

Package Shape: SQUARE

Square shape allows for efficient use of space on the PCB, making the overall design more compact.

Bit Size: 16

High bit size enables complex calculations and processing capabilities, suitable for advanced applications.

No. of Terminals: 64

Having a large number of terminals provides flexibility in connecting to various external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack design with fine pitch terminals saves space on the PCB and allows for dense packing of components.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage helps in reducing power consumption and extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures stable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows the microcontroller to operate in extreme cold conditions without any issues.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

ADC Channels: YES

Built-in ADC channels enable analog signal processing, making the microcontroller suitable for sensor interfacing and data acquisition applications.

Terminal Position: QUAD

Quad terminal position simplifies PCB layout and routing, making assembly easier and more efficient.

Maximum Seated Height: 1.6 mm

Low seated height allows for slim and compact designs, ideal for space-constrained applications.

Width: 10 mm

Compact width dimension further enhances the space-saving aspect of the microcontroller, facilitating integration into tight spaces.

Maximum Clock Frequency: 8 MHz

High maximum clock frequency supports fast processing speeds, suitable for real-time applications and high-speed data handling.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time ensures quick and efficient soldering during manufacturing, reducing production time.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures reliable solder joints and robust connections during assembly.

Length: 10 mm

Compact length dimension complements the overall small form factor of the microcontroller, enabling space-efficient designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade certification ensures reliable operation in demanding industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance and efficiency, making the microcontroller well-suited for data-intensive and computation-heavy tasks.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and faster switching speeds, enhancing the overall performance of the microcontroller.

Terminal Form: GULL WING

Gull wing terminal form ensures secure and reliable solder joints, reducing the risk of connection issues and improving overall product durability.

Nominal Supply Voltage: 2.2 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller in various voltage conditions.

PWM Channels: YES

Built-in PWM channels enable precise control of pulse-width modulation signals, essential for motor control, LED dimming, and other applications.

ROM Programmability: FLASH

Flash ROM programming capability allows for easy and flexible firmware updates, ensuring the microcontroller's adaptability to changing requirements.

Terminal Pitch: 0.5 mm

Fine terminal pitch facilitates high-density PCB layouts, enabling the integration of multiple components in a small area.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, requiring standard precautions during handling and storage to maintain component integrity.

Speed: 8 rpm

High speed capability allows for quick data processing and response times, essential for time-critical applications.

No. of I/O Lines: 48

Abundance of I/O lines provides ample interface options for connecting external devices and sensors, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers MSP430A002IPM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MSP430A002IPM Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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