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MSP430A001IPM

Texas Instruments

MSP430A001IPM by Texas Instruments

MSP430A001IPM by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 8 MHz. It features ADC and PWM channels, flash ROM programmability, and operates in industrial temperature range. Ideal for applications requiring low power consumption and high performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,146 parts In-Stock

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7,146

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Digiode

USA . 1,199 parts In-Stock

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1,199

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Distributors (Availability)

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AZTECH Wire

Italy . 431 parts In-Stock

1+ parts

$14.822

100+ parts

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431

$14.822

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Parana Technologies

USA . 1,682 parts In-Stock

1+ parts

$21.690

100+ parts

-

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$22.116

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1,682

$21.690

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$22.116

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DigiPath Technology Company

USA . 156 parts In-Stock

1+ parts

$23.884

100+ parts

$21.973

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156

$23.884

$21.973

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ChromeModa Solutions

Germany . 4,392 parts In-Stock

1+ parts

$24.371

100+ parts

$19.984

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4,392

$24.371

$19.984

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IDEA Electronic Components Group

UK . 453 parts In-Stock

1+ parts

$24.371

100+ parts

$23.152

1k+ parts

$21.934

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453

$24.371

$23.152

$21.934

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One Stop Electronics

USA . 1,288 parts In-Stock

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$33.000

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1,288

$33.000

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Corphita

USA . 2,545 parts In-Stock

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Overview

Unlock the power of innovation with the Texas Instruments MSP430A001IPM microcontroller. Manufactured to the highest quality standards, this versatile device is perfect for a wide range of applications. With its advanced technology and reliable performance, this microcontroller offers unmatched value, benefits, and advantages to customers looking to bring their projects to life. Experience the difference with Texas Instruments and take your designs to the next level!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the microcontroller, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Offers versatility in power input options, accommodating a wide range of applications.

Package Shape: SQUARE

Optimal shape for compact design layouts and efficient use of space on the PCB.

Bit Size: 16

Provides a good balance between processing power and energy efficiency for various tasks.

No. of Terminals: 64

Sufficient number of terminals for connecting to external components and peripherals in a complex system.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables a compact and low-profile design, suitable for space-constrained applications.

Minimum Supply Voltage: 1.8 V

Allows for operation in low-power scenarios, increasing energy efficiency and extending battery life.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with higher temperature requirements, ensuring reliable performance under harsh conditions.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely cold conditions, making it versatile for use in various climates.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for stable and long-lasting connections.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling the microcontroller to interface with analog sensors and signals.

Terminal Position: QUAD

Facilitates easy soldering and connection to the PCB, enhancing the ease of assembly and manufacturing.

Maximum Seated Height: 1.6 mm

Low profile design reduces overall height of the system, making it suitable for compact devices and applications.

Width: 10 mm

Compact width enables efficient placement on the PCB and leaves more space for other components.

Maximum Clock Frequency: 8 MHz

Offers a balance between processing speed and power consumption, suitable for a wide range of applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during manufacturing process, contributing to the reliability of the final product.

Peak Reflow Temperature °C: 260

High temperature tolerance during reflow soldering process for reliable and robust connection to the PCB.

Length: 10 mm

Compact length enables efficient placement on the PCB and leaves more space for other components.

Temperature Grade: INDUSTRIAL

Suitable for operation in industrial environments with higher temperature and reliability requirements.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient processing and control of connected devices and systems.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, ideal for battery-powered applications.

Terminal Form: GULL WING

Facilitates reliable solder connections for optimal electrical performance and mechanical strength.

Nominal Supply Voltage: 2.2 V

Optimal voltage level for efficient and stable operation of the microcontroller and connected components.

PWM Channels: YES

Enables pulse-width modulation for precise control of connected devices such as motors, LEDs, and actuators.

ROM Programmability: FLASH

Allows for flexible programming and reprogramming of the microcontroller's memory for adapting to changing requirements.

Terminal Pitch: 0.5 mm

Fine pitch spacing for high-density and compact PCB designs, suitable for miniaturized electronic devices.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering processes with moderate moisture sensitivity, ensuring reliable assembly.

Speed: 8 rpm

Moderate operating speed suitable for a wide range of applications and tasks that require precise timing.

No. of I/O Lines: 48

Sufficient number of input/output lines for interfacing with external devices and peripherals, enabling versatile connectivity options.

Technical Specifications

Microcontrollers MSP430A001IPM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MSP430A001IPM Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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